In this masterclass, you will learn about all key digital additive techniques for manufacturing electronic devices - in 2D, 2.5D, and 3D. These techniques include inkjet printing, aerosol printing, electrohydrodynamic printing, microdispensing, and beyond. This class introduces the techniques and include practical insights and real-life application orientated advice on technology use, selection and operation

The use of printing techniques to manufacture flexible electronics is now commonplace for a range of products – from consumer electronics to medical tests to automotive components. Product requirements drive choices in manufacturing techniques. This talk will review features that can be delivered by different print methos for comparison against a diverse set of end-use requirements. There are multiple, readily available printing technologies that offer a range of addressable resolutions and obtainable throughputs (i.e. print speed). There is a further distinction between print technologies for the range of inks that can be printed, as well as the volume of ink that can be deposited in a single-pass. We will review a high-level comparison between print technologies – mapping the technical capabilities of each to the features required for end products. Advantages of these additive R2R technologies will be covered - looking beyond the “obvious” potential materials savings over subtractive technologies for potential benefits to both the manufacturer and the end-product stakeholders. The discussion will extend to ways to achieve the best performance from various print systems. Working examples will be primarily taken from Kodak’s high-resolution flexographic functional printing system, however broader insights will be shared. We will explore how best to take full advantage of “addressable resolution” and print speed in print systems, with attention to various process elements that must be considered and controlled

As industries push for seamless, sustainable, and intelligent design, advanced in-mold electronics are redefining how electronic functionality with mounted components can integrate into thin, 3D-formed, smart surfaces. This masterclass will explore this technology and its platforms, highlighting some of the unique challenges that may arise in its application.
Attendees will gain insight into the fundamental principles of integrating printed electronics with mounted components into molded structures, including key technology platforms—2-Films, Light Channels, and Surface Light—and learn what key mechanical engineering considerations must be addressed, such as tolerances in production, conductive ink stretching behavior, and the utilization of simulations. This masterclass is a must-attend for engineers, designers, and decision-makers looking to stay ahead in the smart surface revolution.

This masterclass will delve into an overview of prevalent and advanced mass transfer technologies. Topics will include micro-transfer printing, various laser-assisted transfer techniques, and fluid self-assembly approaches. We will conduct a comparative analysis to evaluate the advantages and challenges associated with these technologies, focusing on transfer throughput, accuracy, and yield.