On-Site Masterclasses
On 10 June, the day before the conference and exhibition, you can participate in industry- and expert-led masterclasses as well as tours of local companies and research facilities.
In the morning (9:00 to 12:45) you can participate in the masterclasses. You will have a choice of 8 classes, organised in two parallel sessions. You can attend 4 classes in person but the other classes will be available on our platform after the event for you to view.
Each 45-min masterclass will cover a technology or application in detail, offering an insightful blend of practical, technical and application knowledge. These masterclasses will be delivered by industry experts and some may involve live demonstrations.
After lunch, you can participate in one of two tours. We will take you to the facility by bus and bring you back to the conference venue at around 6.00pm. Contact Chris@TechBlick.com if you have any queries.
Masterclasses | Track 1
9:00 AM
Printed Electronics Ltd
Digital Additive Manufacturing of Electronics: Inkjet, Aerosol, EHD Printing, Microdispensing and Beyond
Neil Chilton
In this masterclass, you will learn about all key digital additive techniques for manufacturing electronic devices - in 2D, 2.5D, and 3D. These techniques include inkjet printing, aerosol printing, electrohydrodynamic printing, microdispensing, and beyond. This class introduces the techniques and include practical insights and real-life application orientated advice on technology use, selection and operation
10:00 AM
Kodak
High-Resolution Roll-to-Roll Manufacturing
Carolyn Ellinger
A review of the benefits of high-resolution additive manufacturing will set the stage for the comparison of high-resolution roll-to-roll (R2R) processes for the mass production of printed electronic components. Mass-produced components are either exact replicates, or contain a high percentage of replicate circuitry, making their manufacture well suited for “analog” print technologies. While some consideration will be given to digital printing, the focus of this class will be the challenges of making high-resolution patterns that are truly functional via analog R2R print technologies, such as flexography. Using practical examples from both lab-scale and production-scale processes, we will explore how best to take full advantage of “addressable resolution” and print speed, with attention to various process elements that must be considered and controlled.
11:00 AM
TaktoTek
In-Mold Electronics Design: A Mechanical Perspective
David Greig
As industries push for seamless, sustainable, and intelligent design, advanced in-mold electronics are redefining how electronic functionality with mounted components can integrate into thin, 3D-formed, smart surfaces. This masterclass will explore this technology and its platforms, highlighting some of the unique challenges that may arise in its application.
Attendees will gain insight into the fundamental principles of integrating printed electronics with mounted components into molded structures, including key technology platforms—2-Films, Light Channels, and Surface Light—and learn what key mechanical engineering considerations must be addressed, such as tolerances in production, conductive ink stretching behavior, and the utilization of simulations. This masterclass is a must-attend for engineers, designers, and decision-makers looking to stay ahead in the smart surface revolution.
12:00 PM
Holst Centre
Eco-designing Hybrid & Printed Electronics
Corné Rentrop
In this master class, we will focus on a collection of circular practices applied to hybrid &; printed electronics (HPE) with the aim of reducing their environmental impacts. HPE offers many advantages compared to printed circuitry boards (PCBs), including reduced thickness and weight, increased design and form freedoms, simplified product integration, wear comfort and conformability, the use of recyclable thermoplastics, and additive printing of metals. A direct comparison between HPE and PCB-based electronics at product level reveals that HPE indeed offers reduced environmental burdens. Moreover, several circular practices may be used to further build on this first favorable outcome. Lifecycle assessments reveal several hotspots for HPE, namely plastics, printed metals and the electricity involved in production. Material related hotspots may be addressed by substituting petrochemical plastics and mined metals with recyclates or bio-based alternatives instead. A more optimized process flow with reduced production losses and a greener energy mix will lead to further cradle-to-gate emission reductions. End-of-life related burdens are less easily improved. At present, most HPE is not readily recycled, in part due to their unique selling points. HPE typically contains less (printed) metal than PCBs, making recycling of these metallized plastics less attractive for recyclers. Furthermore, the high level of integration combines metals, semiconductor components and plastics seamlessly, thereby increasing the complexity of material liberation at end-of-life. Especially when considering the unique form factors, lightweight and flexibility and/or stretchability of this unique class of electronics as well. Repairability, refurbishment and reuse are not widely pursued yet despite forthcoming regulations in the EU intended to increase consumer rights. But innovations that improve HPE sustainability and circularity are just around the corner. This master class will describe several HPE use cases wherefor the environmental impacts
have successfully been reduced by means of decarbonization, material circularity and/or lifetime extension.
Masterclasses | Track 2
9:00 AM
Copprint
Copper Inks Usage, Formulations and Applications
Ofer Shochet
There has been a long-term desire and development to replace the well-established silver paste and ink technology. The copper technology is finally reaching a maturity point where long-standing issues are resolved, and the technology is gaining market acceptance. In this class, you will learn about various copper inks on the market, and the pros and cons of each approach, including conductivity, reliability, and curing techniques. You will learn about practical techniques and tips for applying and adopting copper inks, even in existing lines. You will learn important insights about scale up of copper ink production. Finally, you will learn about a large array of applications in which copper inks deliver value together with supporting data. These applications range from wafer-based PV to RFID to aluminium based LED boards and beyond
10:00 AM
MacDermid Alpha
Interconnects for the Electronics of Tomorrow: Conductive Adhesives (ECAs), Formable/Stretchable Adhesives and Low-Temperature Solders for Next-Gen Electronics
Rahul Raut
IInterconnects are one of the most important technology elements in the entire flexible hybrid stretchable or soft electronics field. The requirements and limitations are fundamentally different to that of traditional SMTs and PCBs thus new solutions are required. Indeed, interconnect technologies can often hinder the performance of these systems. In this class the participants will learn the following: The existing and emerging requirement set from processing temperature, pitch, adhesion, flexibility and stretchability, reliability, method of application, etc Overview of different types of conductive adhesives. Here you will learn the pros and cons of each solution, understanding how each solution can find use in a different application. Overview of existing and emerging low-temperature solder, understanding the processing requirements as well as the applicability of different solder solutions. The emphasis will be on emerging low temperature solders compatible with flexible low-temperature substrates Discuss the key design considerations and challenges when implementing interconnect technologies in flexible and stretchable electronics, such as mechanical stability, electrical performance, and manufacturability. Examine the current and emerging applications of flexible hybrid stretchable electronics and understand how advancements in interconnect technologies can propel their development and adoption across various industries.
11:00 AM
VTT
How to scale up (and not screw up) printed electronics enabled wearable device piloting
Ralph Liedert
Developing wearables devices especially for the medical applications is a long and complex process with many potential pitfalls. One emerging approach to de-risk the development phase of medical devices are dedicated pilot line services which pool the know-how of RTOs and companies in a particular field. These partnerships, forged through experience and collaboration, help assess the technology readiness of start-ups and companies in relatively short and in a structured process. Some of the most critical assets pilot lines can provide are independent design reviews to evaluate the technology maturity of a customer's solution, identify critical steps to reduce risks, and spot potential technology gaps.
As an example, this masterclass will highlight VTT’s role and partnerships in the MedPhab pilot line which focusses on pilot line services to speed up the development of photonic medical devices. One of the standout features of MedPhab is its "Front Office," a single entry point that gives customers access to the expertise of six leading European RTOs and industrial partners. The masterclass aims at being a hands-on guide, describing the process on how to engage with a suitable pilot line, walk through the steps of design review process and how to successfully work with the relevant RTOs and companies on turning a new product vision into reality. Scale up, don’t screw up.
12:00 PM
Fraunhofer IZM
E-Textiles: Integration techniques
Malte von Krshiwoblozki
This masterclass presents an in-depth exploration of integration techniques for e-textiles, specifically focusing on the journey from concept to process in e-textile bonding. It examines reliable methods for contacting electronic modules with multiple contacts to textile circuits, drawing on foundational principles of flip-chip bonding adapted for textile applications. The multi-compatible integration technology discussed enables the incorporation of electronic modules (PCBs) into a variety of textile forms, including woven, non-woven, knitted, and embroidered circuits. Significant durability is highlighted, with contacts designed to withstand 100 washing cycles. Attendees will gain insights into process development, an introduction to the research machine, and a discussion of ongoing and future activities in the field of e-textiles.
Masterclasses | Track 1
9:00 AM
Printed Electronics Ltd
Digital Additive Manufacturing of Electronics: Inkjet, Aerosol, EHD Printing, Microdispensing and Beyond
Neil Chilton
In this masterclass, you will learn about all key digital additive techniques for manufacturing electronic devices - in 2D, 2.5D, and 3D. These techniques include inkjet printing, aerosol printing, electrohydrodynamic printing, microdispensing, and beyond. This class introduces the techniques and include practical insights and real-life application orientated advice on technology use, selection and operation
10:00 AM
Kodak
High-Resolution Roll-to-Roll Manufacturing
Carolyn Ellinger
A review of the benefits of high-resolution additive manufacturing will set the stage for the comparison of high-resolution roll-to-roll (R2R) processes for the mass production of printed electronic components. Mass-produced components are either exact replicates, or contain a high percentage of replicate circuitry, making their manufacture well suited for “analog” print technologies. While some consideration will be given to digital printing, the focus of this class will be the challenges of making high-resolution patterns that are truly functional via analog R2R print technologies, such as flexography. Using practical examples from both lab-scale and production-scale processes, we will explore how best to take full advantage of “addressable resolution” and print speed, with attention to various process elements that must be considered and controlled.
11:00 AM
TaktoTek
In-Mold Electronics Design: A Mechanical Perspective
David Greig
As industries push for seamless, sustainable, and intelligent design, advanced in-mold electronics are redefining how electronic functionality with mounted components can integrate into thin, 3D-formed, smart surfaces. This masterclass will explore this technology and its platforms, highlighting some of the unique challenges that may arise in its application.
Attendees will gain insight into the fundamental principles of integrating printed electronics with mounted components into molded structures, including key technology platforms—2-Films, Light Channels, and Surface Light—and learn what key mechanical engineering considerations must be addressed, such as tolerances in production, conductive ink stretching behavior, and the utilization of simulations. This masterclass is a must-attend for engineers, designers, and decision-makers looking to stay ahead in the smart surface revolution.
12:00 PM
Holst Centre
Eco-designing Hybrid & Printed Electronics
Corné Rentrop
In this master class, we will focus on a collection of circular practices applied to hybrid &; printed electronics (HPE) with the aim of reducing their environmental impacts. HPE offers many advantages compared to printed circuitry boards (PCBs), including reduced thickness and weight, increased design and form freedoms, simplified product integration, wear comfort and conformability, the use of recyclable thermoplastics, and additive printing of metals. A direct comparison between HPE and PCB-based electronics at product level reveals that HPE indeed offers reduced environmental burdens. Moreover, several circular practices may be used to further build on this first favorable outcome. Lifecycle assessments reveal several hotspots for HPE, namely plastics, printed metals and the electricity involved in production. Material related hotspots may be addressed by substituting petrochemical plastics and mined metals with recyclates or bio-based alternatives instead. A more optimized process flow with reduced production losses and a greener energy mix will lead to further cradle-to-gate emission reductions. End-of-life related burdens are less easily improved. At present, most HPE is not readily recycled, in part due to their unique selling points. HPE typically contains less (printed) metal than PCBs, making recycling of these metallized plastics less attractive for recyclers. Furthermore, the high level of integration combines metals, semiconductor components and plastics seamlessly, thereby increasing the complexity of material liberation at end-of-life. Especially when considering the unique form factors, lightweight and flexibility and/or stretchability of this unique class of electronics as well. Repairability, refurbishment and reuse are not widely pursued yet despite forthcoming regulations in the EU intended to increase consumer rights. But innovations that improve HPE sustainability and circularity are just around the corner. This master class will describe several HPE use cases wherefor the environmental impacts
have successfully been reduced by means of decarbonization, material circularity and/or lifetime extension.
Masterclasses | Track 2
9:00 AM
Copprint
Copper Inks Usage, Formulations and Applications
Ofer Shochet
There has been a long-term desire and development to replace the well-established silver paste and ink technology. The copper technology is finally reaching a maturity point where long-standing issues are resolved, and the technology is gaining market acceptance. In this class, you will learn about various copper inks on the market, and the pros and cons of each approach, including conductivity, reliability, and curing techniques. You will learn about practical techniques and tips for applying and adopting copper inks, even in existing lines. You will learn important insights about scale up of copper ink production. Finally, you will learn about a large array of applications in which copper inks deliver value together with supporting data. These applications range from wafer-based PV to RFID to aluminium based LED boards and beyond
10:00 AM
MacDermid Alpha
Interconnects for the Electronics of Tomorrow: Conductive Adhesives (ECAs), Formable/Stretchable Adhesives and Low-Temperature Solders for Next-Gen Electronics
Rahul Raut
IInterconnects are one of the most important technology elements in the entire flexible hybrid stretchable or soft electronics field. The requirements and limitations are fundamentally different to that of traditional SMTs and PCBs thus new solutions are required. Indeed, interconnect technologies can often hinder the performance of these systems. In this class the participants will learn the following: The existing and emerging requirement set from processing temperature, pitch, adhesion, flexibility and stretchability, reliability, method of application, etc Overview of different types of conductive adhesives. Here you will learn the pros and cons of each solution, understanding how each solution can find use in a different application. Overview of existing and emerging low-temperature solder, understanding the processing requirements as well as the applicability of different solder solutions. The emphasis will be on emerging low temperature solders compatible with flexible low-temperature substrates Discuss the key design considerations and challenges when implementing interconnect technologies in flexible and stretchable electronics, such as mechanical stability, electrical performance, and manufacturability. Examine the current and emerging applications of flexible hybrid stretchable electronics and understand how advancements in interconnect technologies can propel their development and adoption across various industries.
11:00 AM
VTT
How to scale up (and not screw up) printed electronics enabled wearable device piloting
Ralph Liedert
Developing wearables devices especially for the medical applications is a long and complex process with many potential pitfalls. One emerging approach to de-risk the development phase of medical devices are dedicated pilot line services which pool the know-how of RTOs and companies in a particular field. These partnerships, forged through experience and collaboration, help assess the technology readiness of start-ups and companies in relatively short and in a structured process. Some of the most critical assets pilot lines can provide are independent design reviews to evaluate the technology maturity of a customer's solution, identify critical steps to reduce risks, and spot potential technology gaps.
As an example, this masterclass will highlight VTT’s role and partnerships in the MedPhab pilot line which focusses on pilot line services to speed up the development of photonic medical devices. One of the standout features of MedPhab is its "Front Office," a single entry point that gives customers access to the expertise of six leading European RTOs and industrial partners. The masterclass aims at being a hands-on guide, describing the process on how to engage with a suitable pilot line, walk through the steps of design review process and how to successfully work with the relevant RTOs and companies on turning a new product vision into reality. Scale up, don’t screw up.
12:00 PM
Fraunhofer IZM
E-Textiles: Integration techniques
Malte von Krshiwoblozki
This masterclass presents an in-depth exploration of integration techniques for e-textiles, specifically focusing on the journey from concept to process in e-textile bonding. It examines reliable methods for contacting electronic modules with multiple contacts to textile circuits, drawing on foundational principles of flip-chip bonding adapted for textile applications. The multi-compatible integration technology discussed enables the incorporation of electronic modules (PCBs) into a variety of textile forms, including woven, non-woven, knitted, and embroidered circuits. Significant durability is highlighted, with contacts designed to withstand 100 washing cycles. Attendees will gain insights into process development, an introduction to the research machine, and a discussion of ongoing and future activities in the field of e-textiles.
Masterclasses | Track 3
Company Tours | 10 June 2025
Boston is a hotbed of innovation with an excellent university, pioneering companies as well as applied research centres
In the afternoon of 10 June 2025, we will be organising several guided tours to the state-of-the-art research centres and companies in and around Boston, allowing you to experience the best-in-class facilities first hand.
These tours are open to attendees on the morning masterclasses. Places on the tours will be allocated on a first come, first served basis.
The tours will leave at 1.30pm and attendees should meet at the registration desk. Transportation will be provided and the tours are expected to return to the UMass by 6.00pm.
Tekscan, Inc.
Discover Innovation at Tekscan: An Exclusive Facility Tour
Explore Tekscan, pioneers and leaders in tactile pressure mapping and sensing solutions, through this exclusive behind-the-scenes tour. Gain direct insights into how our advanced technologies are enabling smarter product design and manufacturing across industries.
What to Expect:
Kickoff Presentation
Start with a presentation highlighting Tekscan’s history, products, and their applications in industries like manufacturing, automotive, and healthcare.
Visit the TactileLab
Explore the TactileLab, where customers and partners collaborate to develop solutions. Learn about our rapid prototyping process, advanced electronics, and "lab to fab" approach for transitioning prototypes to production.
Facility Tour
Take a guided tour of our production facility to see the processes behind the manufacture of our ink-based piezoresistive sensors.
Interactive Demonstrations
See our pressure mapping solutions in action, showcasing their role in quality control and R&D applications.
Networking
Connect with Tekscan engineers, product experts, and industry professionals to exchange ideas and explore collaboration opportunities.
Don’t miss this opportunity to see innovation in action.
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E Ink Holdings Inc
Advancements in E Ink technology. Hands-on demonstration of ePaper fabrication
This tour is limited to 40 people, and places will be allocated on a first come, first served basis. E Ink is a 45 minute drive from UMASS and transportation will be provided.
E Ink is the originator, pioneer and commercial leader in ePaper technology. The company delivers its advanced display products to the world's most influential brands and manufacturers, enabling them to install extremely durable, low power displays in previously impossible or unimaginable applications and environments.
E Ink’s corporate philosophy centers around delivering revolutionary products, excellent user experiences, and environmental benefits through advanced technology development. E Ink has pledged reaching NetZero by 2040 and RE100 by 2030 and is committed to joining international initiatives related to carbon reduction. The Company participates in programs such as RE 100, EP 100, The Climate Pledge, and SBTi science-based targets. E Ink has adopted the TCFD framework to disclose financial impacts of climate-related risks and opportunities.
In this visit, attendees will learn about recent advancements in E Ink technology, tour the Company’s History Wall and participate in a hands-on demonstration of ePaper fabrication: laser cutting, lamination and module operation.
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NextFlex Workshop. 10 June 2025
NextFlex is a linchpin organisation in the US in the field of Flexible Hybrid Electronics, bringing the ecosystem together. It will hold a workshop alongside TechBlick's Future of Electronics RESHAPED USA event in Boston, uniting all its members from across the USA. Contact Nextflex for your special 20% discount to join the TechBlick show now!
Member-only meeting
June 10, 2025
1:00pm - 5:00pm
NextFlex, America's Hybrid Electronics Manufacturing Innovation Institute, will hold a member-only meeting followed by a reception. The agenda will consist of invited technical presentations and interactive discussions about the state of the art in hybrid electronics. NextFlex is celebrating its 10th anniversary in 2025, so stay tuned for agenda updates and special announcements. All NextFlex members and invited guests are welcome to join. Learn More...