On-Site Masterclasses
On 10 June, the day before the conference and exhibition, you can participate in industry- and expert-led masterclasses as well as tours of local companies and research facilities.
In the morning (9:00 to 12:45) you can participate in the masterclasses. You will have a choice of 12 classes, organised in three parallel sessions. You can attend 4 classes in person but the other classes will be available on our platform after the event for you to view.
Each 45-min masterclass will cover a technology or application in detail, offering an insightful blend of practical, technical and application knowledge. These masterclasses will be delivered by industry experts and some may involve live demonstrations.
After lunch, you can participate in one of three tours. We will take you to the facility by bus and bring you back to the conference venue at around 6.00pm. Contact Chris@TechBlick.com if you have any queries.
Masterclasses | Track 1
9:00 AM
Printed Electronics Ltd
Digital Additive Manufacturing of Electronics: Inkjet, Aerosol, EHD Printing, Microdispensing and Beyond*
Neil Chilton
In this masterclass, you will learn about all key digital additive techniques for manufacturing electronic devices - in 2D, 2.5D, and 3D. These techniques include inkjet printing, aerosol printing, electrohydrodynamic printing, microdispensing, and beyond. This class introduces the techniques and include practical insights and real-life application orientated advice on technology use, selection and operation
10:00 AM
Kodak
Technologies for High-Resolution R2R Manufacturing*
Carolyn Ellinger
The use of printing techniques to manufacture flexible electronics is now commonplace for a range of products – from consumer electronics to medical tests to automotive components. Product requirements drive choices in manufacturing techniques. This talk will review features that can be delivered by different print methos for comparison against a diverse set of end-use requirements. There are multiple, readily available printing technologies that offer a range of addressable resolutions and obtainable throughputs (i.e. print speed). There is a further distinction between print technologies for the range of inks that can be printed, as well as the volume of ink that can be deposited in a single-pass. We will review a high-level comparison between print technologies – mapping the technical capabilities of each to the features required for end products. Advantages of these additive R2R technologies will be covered - looking beyond the “obvious” potential materials savings over subtractive technologies for potential benefits to both the manufacturer and the end-product stakeholders. The discussion will extend to ways to achieve the best performance from various print systems. Working examples will be primarily taken from Kodak’s high-resolution flexographic functional printing system, however broader insights will be shared. We will explore how best to take full advantage of “addressable resolution” and print speed in print systems, with attention to various process elements that must be considered and controlled
12:00 PM
Holst Centre
Introduction to LIFT (Laser Induced Forward Transfer): Technology and Challenges*
Arutinov Gari
LIFT is an emerging digital printing technology, which some characterize as digitization of screen printing. This technique can achieve high-throughput digital printing of multi-materials on various substrates. Uniquely unlike inkjet printing, it can also handle highly viscous pastes and materials, thus uniquely opening a digital technique for their precision printing. In this Masterclass, you will learn about the basics of the LIFT process, its current capabilities and limitations in terms of printable materials, viscosities, resolutions and printing speeds, and also recent technological advances enabling high-throughput integration of microcomponents (e.g., microLEDs) through printing of very fine interconnects and mass transfer assembly
Masterclasses | Track 2
9:00 AM
Copprint
Copper Inks Usage, Formulations and Applications
Ofer Shochet
There has been a long-term desire and development to replace the well-established silver paste and ink technology. The copper technology is finally reaching a maturity point where long-standing issues are resolved, and the technology is gaining market acceptance. In this class, you will learn about various copper inks on the market, and the pros and cons of each approach, including conductivity, reliability, and curing techniques. You will learn about practical techniques and tips for applying and adopting copper inks, even in existing lines. You will learn important insights about scale up of copper ink production. Finally, you will learn about a large array of applications in which copper inks deliver value together with supporting data. These applications range from wafer-based PV to RFID to aluminium based LED boards and beyond
10:00 AM
MacDermid Alpha
Interconnect technologies for flexible hybrid stretchable electronics: from conductive adhesives to low-T solder
Rahul Raut
IInterconnects are one of the most important technology elements in the entire flexible hybrid stretchable or soft electronics field. The requirements and limitations are fundamentally different to that of traditional SMTs and PCBs thus new solutions are required. Indeed, interconnect technologies can often hinder the performance of these systems. In this class the participants will learn the following: The existing and emerging requirement set from processing temperature, pitch, adhesion, flexibility and stretchability, reliability, method of application, etc Overview of different types of conductive adhesives. Here you will learn the pros and cons of each solution, understanding how each solution can find use in a different application. Overview of existing and emerging low-temperature solder, understanding the processing requirements as well as the applicability of different solder solutions. The emphasis will be on emerging low temperature solders compatible with flexible low-temperature substrates Discuss the key design considerations and challenges when implementing interconnect technologies in flexible and stretchable electronics, such as mechanical stability, electrical performance, and manufacturability. Examine the current and emerging applications of flexible hybrid stretchable electronics and understand how advancements in interconnect technologies can propel their development and adoption across various industries.*
Masterclasses | Track 3
12:00 PM
Intellivation LLC
R2R Laser Processing of Multi-Layer Vacuum deposited coatings on flexible substrates for 2D functional Devices
Mike Simmons
Roll-to-Roll (R2R) laser patterning of vacuum-deposited coatings on flexible substrates is
emerging as a versatile and efficient method for enabling advanced two-dimensional (2D)
functional devices. This method of patterning offers scalability, reliability, and cost-efficiency,
making it ideal for applications in electronics, optics, medical and energy systems. The
integration of laser processing techniques with vacuum deposited materials allows for high-
quality coatings that can be selectively patterned without the addition of masking elements or
chemical etching. Precision and uniform vacuum coated materials can be patterned and their
morphology can be controlled for specific applications. For example, wetting properties or
phase change functionalization can be performed. This approach streamlines product development by allowing for rapid prototyping, ease of process control, and fast changes to device design. Combining these technologies allows for a faster and more reliable method of
manufacturing flexible, high-performance 2D devices.
Company Tours | 10 June 2025
Boston is a hotbed of innovation with an excellent university, pioneering companies as well as applied research centres
In the afternoon of 10 June 2025, we will be organising several guided tours to the state-of-the-art research centres and companies in and around Boston, allowing you to experience the best-in-class facilities first hand.
We will be announcing more tours, over the next few weeks. These tours are open to attendees on the morning masterclasses. Places on the tours will be allocated on a first come, first served basis.
The tours will leave at 1.30pm and attendees should meet at the registration desk. Transportation will be provided and the tours are expected to return to the UMass by 6.00pm.
E Ink Holdings Inc
Advancements in E Ink technology. Hands-on demonstration of ePaper fabrication
This tour is limited to 40 people, and places will be allocated on a first come, first served basis. E Ink is a 45 minute drive from UMASS and transportation will be provided.
E Ink is the originator, pioneer and commercial leader in ePaper technology. The company delivers its advanced display products to the world's most influential brands and manufacturers, enabling them to install extremely durable, low power displays in previously impossible or unimaginable applications and environments.
E Ink’s corporate philosophy centers around delivering revolutionary products, excellent user experiences, and environmental benefits through advanced technology development. E Ink has pledged reaching NetZero by 2040 and RE100 by 2030 and is committed to joining international initiatives related to carbon reduction. The Company participates in programs such as RE 100, EP 100, The Climate Pledge, and SBTi science-based targets. E Ink has adopted the TCFD framework to disclose financial impacts of climate-related risks and opportunities.
In this visit, attendees will learn about recent advancements in E Ink technology, tour the Company’s History Wall and participate in a hands-on demonstration of ePaper fabrication: laser cutting, lamination and module operation.
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Tekscan, Inc.
Discover Innovation at Tekscan: An Exclusive Facility Tour
Explore Tekscan, pioneers and leaders in tactile pressure mapping and sensing solutions, through this exclusive behind-the-scenes tour. Gain direct insights into how our advanced technologies are enabling smarter product design and manufacturing across industries.
What to Expect:
Kickoff Presentation
Start with a presentation highlighting Tekscan’s history, products, and their applications in industries like manufacturing, automotive, and healthcare.
Visit the TactileLab
Explore the TactileLab, where customers and partners collaborate to develop solutions. Learn about our rapid prototyping process, advanced electronics, and "lab to fab" approach for transitioning prototypes to production.
Facility Tour
Take a guided tour of our production facility to see the processes behind the manufacture of our ink-based piezoresistive sensors.
Interactive Demonstrations
See our pressure mapping solutions in action, showcasing their role in quality control and R&D applications.
Networking
Connect with Tekscan engineers, product experts, and industry professionals to exchange ideas and explore collaboration opportunities.
Don’t miss this opportunity to see innovation in action.
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Member-only meeting
June 10, 2025
1:00pm - 5:00pm
NextFlex, America's Hybrid Electronics Manufacturing Innovation Institute, will hold a member-only meeting followed by a reception. The agenda will consist of invited technical presentations and interactive discussions about the state of the art in hybrid electronics. NextFlex is celebrating its 10th anniversary in 2025, so stay tuned for agenda updates and special announcements. All NextFlex members and invited guests are welcome to join. Learn More...