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Speaker: Rob Hendriks | Company: FononTech | Date: 12-13 October 2022 | Full Presentation One of the challenges in printed electronics is the large gap between costly, high-resolution lithography, and cost-effective – but also less refined – printing technologies. A brand new and revolutionary technology has been developed that fills that gap and enables the next generation of manufacturing to start today. Impulse Printing is a novel additive manufacturing technology that transfers high-resolution patterns through rapid surface heating. When the solvent at the heated interface reaches its boiling temperature, rapid gas generation leads to pressure build-up. This pressure causes the ink to transfer to the substrate at incredible speed. Impulse Printing has several unique features. It can deposit feature sizes ranging from several microns to many millimeters, with aspect ratios of up to 0.5. Since the ink is released from a surface, it does not experience any shear forces, which means a wide range of viscosities can be deposited. Impulse Printing can therefore solve common manufacturing challenges, including printing on any surface topology with inks of extremely high viscosity. Patterns can even be wrapped around substrates. Impulse Printing is a non-contact and high-throughput technology, so it is compatible with large substrates, like roll-to-roll processes. It was designed to be user-friendly and to have a low cost of ownership. It can therefore be seamlessly integrated into many current manufacturing set-ups. What’s more, the solution reduces waste associated with current manufacturing techniques, as it consumes low amounts of power and utilises ink with the highest efficiency. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: John Yundt | Company: SunRay Scientific | Date: 12-13 October 2022 | Full Presentation Advancements in the development of flexible hybrid electronics (FHE) technologies and materials continue to progress rapidly; however, reliable, high-volume manufacturing of complex FHE-based products remains elusive. This issue becomes even more into focus when the objective is for printable, wearable technologies. Due to the nature of the stresses applied during use, such stretchable devices are expected to be mechanically robust and sustain their electrical performance under high tensile strain. Most of these stretchable electronic devices are hybrid in nature, comprising both soft and rigid electronic components. Hence, robust and reliable electrical interconnections between these soft and rigid components is necessary to ensure proper functionality of the device. Interconnections between the electrically functional control systems and wearable e-textile materials have a variety of current, traditional methods, such as high pressure and high temperature Anisotropic Conductive Adhesives (ACA), solder, snap/cinch connections, and isotropic epoxy adhesives. Each of these electrical connections pose issues with the necessary material sets for wearables/e-textile materials. There are significant drawbacks related to mechanical and/or thermal damage during the connection process; poor mechanical adhesion; inability to connect standard-pitch functional devices; and lack of robustness when connecting to nonplanar surfaces seen in wearable technology. And additional challenges exist which limit the high-volume manufacturing of these products. SunRay Scientific will present recent results in the development of a novel anisotropic conductive adhesive, ZTACH® ACE, for high-volume surface mount assembly of electrical components, including those to by mounted/attached to flexible, stretchable, textiles in wearable applications. ZTACH® ACE technology demonstrates superiority in achieving environmentally stable and mechanically robust electrical connections. For improved manufacturability, it allows for pressure-less assembly, low-temperature cure, excellent adhesion to various substrates, and fine pitch reliability without sacrificing contact resistance or mechanical bond integrity. Because ZTACH® ACE can act as its own underfill and edge encapsulant, the rigors of use in typical wearable applications on host substrates like textiles and TPU, do not experience the same types of failures alternate competing technologies would experience without the addition of underfill and/or encapsulation. In providing superior adhesion, low contact resistance, and mechanical robustness during electromechanical testing, ZTACH® ACE proves itself to be a reliable interconnect between stretchable to stretchable/flex/rigid materials with high electrical conductivity. This enables easier and lower cost manufacturing of more flexible and robust applications through integration of SMD components directly onto e-textiles, without additional laminated protective layers. As a result, flexible, wearable printed electronics can finally be integrated into a wider range of cost effective, reliable end use application. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Nanomaterials, Inks, Coatings and Composites Speaker: Ajay Virkar | Company: C3Nano | Date: 12-13 October 2022 | Full Presentation C3Nano has developed a platform technology to empower a wide variety of electronics ranging from smartphones and solar cells to biomedical devices and transparent heaters and conductors for automotive applications. In this presentation C3Nano will discuss this platform consisting of the highest quality and scale Silver Nanowires (AgNWs) and novel Ultra-Nanowires with unprecedented stability and reliability, and its best-in-class ActiveGrid™ inks and coatings. We will also discuss how Nanowires are formulated into various inks and coatings incorporating our proprietary Nanoglue™ chemical fusing technology which engenders the best in-class solution coated transparent conductor; these conductive coatings have outstanding flexibility and mechanical properties and are compatible with a broad array of flexible, stretchable, and formable films. C3Nano will also describe a technology breakthrough wherein its new ActiveGrid™ LT ink series can be cured at room temperature incredibly quickly (~25 C for 1 min) to impart electrical conductivity to a variety of low Tg, soft, bio-compatible, and low-cost substrates targeting applications in life-sciences, packaging, displays, consumables, and anti-statics, among others. C3Nano will also explain how its NWs and Ultra-NWs are ideal conductive fillers achieving excellent conductivities at extremely low volume fractions (loadings) which opens up broad new applications and potentials in the multibillion-dollar conductive composites, conductive curable resins and adhesives and 3D-printing markets. Finally, C3Nano will discuss its some of its current commercial traction and how its technology platform is being used to generate smart surfaces and new functionality across several of the large aforementioned sectors. The ability to add electrical conductivity by depositing ActiveGrid ink as ultrathin layers on substrates, or by addition of low volume fractions of Nanowires and Ultra-Nanowires into composites, can unlock the imagination to enable new transformative electronics, devices, and HMI experiences. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Mike Hopkins | Company: LiquidWire | Date: 12-13 October 2022 | Full Presentation User interfaces with machines have long relied on tactile feedback to give crucial information to users. Whether pressure felt through a steering wheel or a clear detent on a pushbutton, people intuitively rely on this type of embodied information to communicate the state of the system under control. As machines incorporate more robotic elements this tactile feedback will need to become a 2 way street. Textiles, which are the only artificial technology human beings tolerate being in constant close physical contact with, provide an ideal platform for both sensing and active haptic communication between robots and the people who they serve. Incorporating smart textiles into apparel and active upholstery such as anti-bed sore platforms will pave the way for advanced soft robotics that can operate comfortably in close contact with people. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

through printed electronics. Speaker: Aad van der Spuij | Company: Henkel | Date: 12-13 October 2022 | Full Presentation Step into smart buildings of the future and you might not see a difference. Combining the scalability of coatings and building materials contemporary sensing techniques opens-up an incredible range of possibilities for predictive, preventative, and responsive maintenance. For Henkel, a global leader in specialized and cross-functional ink formulations for printed electronics, and Laiier a smart surface technology provider, the next decade will see the rise of smart buildings that integrate new capabilities into the built environment. Whether it’s office facilities that warn of leaking pipes, walls that heat our rooms, or floors that tell us when an elderly relative has suffered a fall, many of the core technologies are already here. Today, the challenge besides the technology innovation is more about building networks and creating markets. The presentation will cover the unique ecosystem required to bring this vision to life that includes the whole value chain from construction, materials, manufacturing industry to IoT integrators. The session will take the attendees through technical explanations and customer use cases demonstrating clear ROIs and customer insights. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Antti Kemppainen | Company: VTT | Date: 12-13 October 2022 | Full Presentation This presentation highlights critical design, manufacturability, sustainability and reliability aspects related to development of novel stretchable devices for the wearables market based on thermoplastic polyurethane (TPU), polydimethylsiloxane (PDMS) and nanocellulose substrate platforms. We will present examples of several fully integrated functional devices such as a stretchable wireless electrocardiography (ECG) smart patch and a disposable enzymatic amperometric biosensor for real-time sweat monitoring. Developments and upscaling aspects on Roll-to-Roll manufacturing will cover double-sided printing and via-forming, component assembly, lamination and encapsulation, structuring of PDMS films and sustainable substrate materials for single use devices. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Franz Vollmann | Company: Heraeus | Date: 12-13 October 2022 | Full Presentation Heraeus has in-house developed a full system solution consisting of particle-free metal inks, equipment and processes for the selective coating of semiconductor packages. Large scale inkjet printing and photonic curing on 300mm wafer frames has become a reality. Experience the advantages of this solution such as design freedom, material efficiency, high print accuracy and many more in various applications ranging from EMI shielding to metallization or plating replacement. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Peter Drage | Company: ATT Advanced Thermal Technologies | Date: 2-Dec-22 | Full Presentation Since advanced driver-assistance systems (ADAS) and other cutting-edge self-driving innovations hit the automotive market, reliable LiDAR (Light Detection and Ranging) and RADAR (Radio Detection and Ranging) systems are crucial in the development of advanced self-driving vehicles. One significant challenge in this relation, is to guarantee clear visibility of those systems even in the harshest environmental conditions. For the sensor cover, especially the accretion of snow and ice as well as fogging is a significant issue that needs to be solved. To ensure visibility during winter time, the RADAR and LiDAR sensor covers are currently equipped with wire based heating solutions. This state of the art solution is coming with some technological challenges during the manufacturing process, that is causing significant scrap rates. The homogeneity of the sensor cover temperature is often inadequate and overheating or even burning issues have been detected. This presentation focuses on sensor cover heaters by means of printed electronics. Besides the heating functionality, also ice and temperature sensors are embedded in the heating solution, allowing for a heating- on-demand functionality that is energy efficient and provides a significant safety advantage. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Boon Keng Lok | Company: Singapore Institute of Manufacturing Technology (SIMTech) | Date: 2-Dec-22 | Full Presentation In this presentation, Lok will share the development process of a smart apparel with ECG sensing. The process includes material formulation for printability, washability and safety, coating and patterning of electrode, fabric and apparel integration, functional testing and reliability validation. The smart apparel was tested by a third party for machine wash resistance and toxicity. Over 100 machine wash cycles were achieved through material and manufacturing innovations. The challenges in consumer acceptance will be discussed. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Markus Tuomikoski | Company: VTT | Date: 2-Dec-22 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Vivek Raja P S | Company: NexStem | Date: 2-Dec-22 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

with Anisotropic Conductive Adhesive films. Speaker: Morten Lindberget | Company: CondAlign | Date: 2-Dec-22 | Full Presentation Anisotropic Conductive Adhesive films for room temperature, low pressure bonding will shortly be available for commercial use. What is the performance of these films, and how can they add freedom and value in designing and manufacturing new products in the area of wearables, flexible, and hybrid electronics? An update on the availability and road-map for this product range will be presented, as well as application examples and performance data. Process savings will be discussed, related to the fact this bonding technique does not require heat nor additional pressure, and investments related to mounting equipment is moderate. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda