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Speaker: Rahul Raut | Company: MacDermid Alpha | Date: 12-13 October 2022 | Full Presentation Emerging electronic structures in consumer, automotive, medical and several other end-applications are rapidly moving towards integrated, interactive, smart interfaces from their current physical and mechanical forms (such as switches, connectors, housings, etc.). Electronics assembly, manufacturing and processing are also evolving to be compatible with the next generation of sleek, lightweight, compact form factors. Additionally, current megatrends such as sustainable and green electronics, and increasingly additive manufacturing approaches and fully automated assemblies will start to become mainstream. To enable and deploy these next generation smart structures and functional surfaces, a combination of smart materials and compatible processes are needed. In this paper, we present a holistic view from materials, high-volume manufacturing (HVM) approaches and sustainable processes. We discuss/review key building blocks of 3D smart structural platforms that represent an integrated approach, which covers: - Novel film substrates (for example, multifunctional PC Substrates for In-Mold Electronics), - Highly conductive and formable Silver Inks - High performance formable Dielectrics (Thermally curable), - Formable Structural and Electrically Conducting Adhesives (ECAs), and - Formable Encapsulants. We present performance and compatibility of an integrated multi-layer stacks that can be thermoformed and then injection molded to produce smart, interactive 3D structures. Details of several technology demonstrators showcasing these leading-edge technologies will be presented. A key requirement for many of these integrated 3D structures is that they will need to meet or exceed stringent reliability requirements for automotive, medical, military and other demanding applications. Finally, a summary of key reliability testing results will be presented for the 3D IME structures. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Ryojiro Tominaga | Company: Fuji Corporation | Date: 12-13 October 2022 | Full Presentation We’ll introduce a novel electronics 3D printer which integrates resin printing, circuit printing, and low temperature Surface Mount Technology (SMT). Based on these three key functions, we named this machine “FPM-Trinity”. FPM-Trinity enables the manufacturing of uniquely shaped electrical devices within one day. This can drastically reduce the development time for electronic products, adding value to the process of creating new products. In this presentation, we’ll introduce key process technologies of the machine and its main features. In addition, we’ll show some of the samples which have made using FPM-Trinity. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Andree Maindok | Company: DuPont Micromax | Date: 12-13 October 2022 | Full Presentation DuPont Microcircuit and Component Materials (MCM) continues to expand our portfolio of screen-printable inks (carbon, conductive, and dielectric) for use in the growing biosensor and health/wellness/fitness markets. These inks enable production of reliable, consistent, and high-accuracy electrodes used in medical monitoring, diagnostics, drug delivery, and wearable electronics. Through partnership with our customers and understanding of new market dynamics our new offerings include stable solvent-resistant inks, flexible/stretchable/washable inks for wearable applications, and thermally curable inks for abrasion resistance and long-term stability. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Thomas Exlager | Company: COATEMA Coating Machinery | Date: 12-13 October 2022 | Full Presentation The talk is about the production of nanocellulose by slot die coating and drying process to replace PET plastic substrates. This process was part of the European project Greensense and on the nanocellulose there had been printed a biosensor platform. So the talk covers coating, printing and drying technologies in combination with sustainable materials. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Dennis Hahn | Company: Airbus | Date: 12-13 October 2022 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Stan Farnsworth | Company: PulseForge | Date: 12-13 October 2022 | Full Presentation Electronics manufacturing is not exempt from the societal drive to improve overall sustainability, including materials and energy utilization. Multi-zone solder reflow ovens are a major energy uses due to prolonged operation at elevated temperatures necessary for reflowing traditionally-used SAC305 solder, both functionally for effecting the solder melt, as well as operationally to avoid their extended warm-up and equilibration times. At the same time, this same thermal process used for reflowing solder is a barrier to broader utilization of flexible hybrid electronics. Market demand for lightweight, conformal electronics has surpassed current traditional equilibrium-based thermal processes such as reflow soldering. Low-temperature, lightweight substrate materials such as PET, and electronic components such as cameras, sensors, and bioprocessors can typically not withstand sustained exposure to soldering temperatures. The presenter will offer next-generation thermal processing, which decarbonizes the supply chain by utilizing as little as 15% of the energy of standard processing. Sustainable manufacturing practices often come at the sacrifice of performance and/or cost, with what can be referred to as a Green Premium. Through also providing improved performance and throughput, this new soldering technology dispels a notion of a Green Premium. The new soldering capability enables next-generation applications in applications such as medical and lifestyle wearables, consumer electronics such as AR/VR goggles, and opens the door to broader innovation while still meeting ideals and practice of sustainable manufacturing. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Helen Kardan | Company: ASML | Date: 12-13 October 2022 | Full Presentation A look into Semiconductor industry and the role of lithography in that. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Jonathan Waldern | Company: Meta Materials | Date: 12-13 October 2022 | Full Presentation Meta Materials Inc. is developing discrete platform specific proprietary technologies for large-surface-area lithography, allowing the manufacture of nanostructures to be carried out in a cost-effective manner. Each platform employs a massively parallel patterning scheme, designed to be scalable to large areas of either rigid substrate materials and rolls of flexible films. In certain cases we use a phase-shift mask approach called Rolling Mask Lithography and in others, cast NIL printing – all allowing the creation of resonate plasmonic structures with feature sizes down to 50 nm. In addition, we are also using a first of its kind Plasma deposition technology, which enables high speed coating of any solid material on any type of substrate. We use this metallization step in our roll-to-roll production process for functional films, including security films, which will significantly accelerate line speed and increase capacity. Large scale and efficient metallization coating of ultra-thin substrate with zero defect, is a critical step for volume production of safe reliable lightweight battery materials like separators, requiring hundreds of millions of square meters per year. Additional applications being brought to market include 5G reflection, transparent microwave shielding and windscreen and sensor-window heater functional films, all of which will be reviewed. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Tsuyoshi Takeda | Company: Panasonic | Date: 12-13 October 2022 | Full Presentation Panasonic Industry Co Ltd., Electronic Materials Division, a leading company in the electronics field, has developed a new high-performance film designed as substrate for FHE/PE applications. Featuring unmatched heat resistance, these stretchable films are based on a proprietary, non-silicone polymer system, freeing designers, and manufacturers from the constraints of conventional thermoplastic films like TPU and PET. (i) Applicable to high-temperature processes: With a temperature resistance of greater than 260℃, these films withstand elevated drying temperatures for inks, coatings, and sintered materials. Even works well with typical SAC reflow processes. (ii) High printability: It has excellent adhesion performance with a wide range of conductive materials. (iii) Excellent reliability: The product exhibits a good durability in evaluations such as high temp/humidity tests, temperature shock tests, and insulation reliability tests. This presentation will provide details of the substrate technology, test results, and use-case demonstration parts manufactured with these materials. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Farida Bensadoun | Company: AB InBev | Date: 12-13 October 2022 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Peter Kämpf | Company: Stabilo | Date: 12-13 October 2022 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Thomas Morel | Company: JCDecaux | Date: 12-13 October 2022 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda