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ATLANT 3D’s Direct Atomic Layer Processing (DALP®) is set to transform the semiconductor landscape with its groundbreaking direct-write technology based on ALD. This cutting-edge process enables swift transition from conceptualization to prototype, reducing the time from idea to physical realization to mere hours. It simplifies exploring new materials and structures for semiconductor devices to just a week, opening doors to multi-functional devices previously deemed unattainable. With DALP®, you gain access to a wide range of designs, including various 2D shapes, multidirectional thickness gradients, and complex overlapping patterns. The flexibility extends to the materials, DALP opens the ability to utilize standard ALD materials and create tailored multilayers to prototype novel semiconductor devices. To showcase DALP® capability, we’ve fabricated a sample wafer using TiO2 on a 4-inch Si/SiO2 substrate, with a maximum deposited thickness of 30 nm. The vibrant and distinct color variations stem different thicknesses of the TiO2 layer and showcase thickness steps of 0.3 nm separated by 1 micron. Traditional methods in the industry require extensive time and effort for such variations, often involving multiple masks or complicated process. Novel processing methods such as inkjet lack the vertical resolution to provide filled patterns with this level of control. DALP® streamlines this process. From the initial design concept to the start of processing, it takes just 2 hours. The process requires no manual intervention after the setup procedure. Furthermore, DALP® drastically reduces chemical usage, relying on a few micrograms of precursors instead of the substantial quantities of target material, resists, and chemicals used in conventional methods. KEY FIGURES FOR DALP® PROCESSING Ideation and CAD design of all shapes: approximately 1 hour Conversion of CAD designs to machine code, including input of thickness and material parameters: approximately 30 minutes TiO2 structure processing: 17 hours (overnight) DALP® significantly reduces process steps and time, enhancing prototyping speed and enabling the creation of devices with functionalities previously deemed impossible. The diverse shapes designed through DALP® offer substantial benefits to several applications, including: Optics: optical coatings, Bragg mirrors Electronics: vertical thin film capacitors, thin film integrated circuits Neuromorphic computing: variable thickness hybrid neural networks MEMS: functionalized surfaces, encapsulated devices Sensors: electrochemical, gas, distance, temperature, pressure, humidity IC postprocessing: chip surgery, IC repair Smart coatings: engineered surface properties Software simulation of a TiO2 DALP® deposition Imaging ellipsometry measurements of TiO2 DALP® RASTERED PATTERN SIMULATION, DEPOSITION, CHARACTERIZATION The different rastering methods of the set of squares were simulated in our software, deposited using DALP®, and finally characterized with imaging ellipsometry. DALP® produced a repeating 2 nm-tall hexagonal pattern with a 20 µm period over an area of 4x4 mm2. It is also possible to deposit, e.g., a square pattern 6 nm height oscillation and a 100 µm period. These patterns are attractive to applications that require surface nanopatterning, e.g. changing surface wettability or optical characteristics. CONTACT +45 22 29 00 80 sales@atlant3d.com We are exhibiting! We look forward to meeting you at our booth  at one of the most significant industry and research events "The Future of Electronics RESHAPED" in Berlin, Germany on 23-24 October 2024. We invite our friends, partners and customers to visit and take this opportunity to connect with the brilliant innovators showcasing their latest advancements with this cutting-edge technology. Experience a world-class programme, featuring 72 invited presentations, 80 exhibitors and over 600 global attendees. You can explore the programme here. Join us and RESHAPE the Future of Electronics, making it Additive, Sustainable, Flexible, Wearable and 3D. TechBlick events are designed to deliver an inspiring customer experience Register as our guest with this discount code: ATLANT3D

Introduction: The Future of Bioelectronics and Biomedicine   #High-Precision Capillary Printing (HPCaP) #PrintedElectronics #BioElectronics #BioMedicine In the rapidly evolving fields of bioelectronics and biomedicine, the demand for high-precision and high-resolution printing technologies has never been greater. With advancements in miniaturization, personalized medicine, and the rise of wearable and implantable medical devices, there is an urgent need for additive manufacturing technologies that can deliver unparalleled accuracy and flexibility. This is where High-Precision Capillary Printing (HPCaP) comes into play, offering groundbreaking solutions that are set to revolutionize the way we approach healthcare technology.   HPCaP is an advanced technology that leverages capillary forces to achieve exceptional precision in printing, making it ideal for the demanding applications within the medical field. In the sections below, we will explore how HPCaP is paving the way for new innovations in healthcare, from high-resolution sensors to the printing of living cells, demonstrating its vast potential and versatility. We are exhibiting! Visit our booth at the flagship TechBlick event in Berlin on 23-24 October 2024.   Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D.      High Precision Printing: The Cornerstone of Modern Bioelectronics   Precision is paramount in the creation of bioelectronic devices, where even the slightest deviation can significantly impact performance. HPCaP technology stands out by printing at micron and submicron resolutions that were previously unattainable, all while maintaining unmatched precision. This capability has been instrumental in advancing research and development in the field of bioelectronics.   At Duke University, Dr. Aaron Franklin and his research team have harnessed the power of HPCaP to print silver electrodes with submicron gaps, achieving an impressive 500 nm separation for their carbon nanotube (CNT) transistors. This level of precision is crucial for the development of high-performance bioelectronic devices. The team's success didn't stop there; they have now progressed to fully printing CNT transistors; they’re using HPCaP to print both the electrodes and the CNTs.   One of the standout features of HPCaP is its versatility in printing on both rigid and flexible substrates. While Duke University initially focused on silicon wafers, they have since expanded their research to include flexible substrates like Kapton. This flexibility is particularly relevant to the medical field, where wearable sensors including biosensors often require substrates that can conform to the body's contours. The ability to print on such diverse surfaces makes HPCaP an invaluable tool for the development of next-generation medical sensors. Biosensors: The Key to Advanced Healthcare Solutions   As the healthcare industry increasingly leans toward personalized medicine, the need for advanced biosensors that can provide real-time, accurate data has become more critical. Biosensors are instrumental in monitoring a wide range of physiological parameters, from glucose levels in diabetics to detecting early signs of disease. The precision of these sensors can directly influence the quality of care a patient receives, making their development a top priority.   HPCaP technology is uniquely suited to meet these demands. Its ability to print with high precision on a variety of substrates allows the manufacturing of highly sensitive and accurate biosensors. This capability was demonstrated with the The Interfaces Treatments Organization and Systems Dynamics laboratory – ITODYS at Université Paris Cité in their recent development of transistor based biosensors. HPCaP is being employed to print the EGOFETs (Electrolyte-gated Organic Field Transistors) and achieve a small distance between the electrodes as small as 500 nm.    Such sensors are capable of detecting minute changes in the body's biochemistry, providing invaluable data that can inform treatment decisions and improve patient outcomes. With HPCaP not only highly accurate sensors can be developed but also ones capable of being integrated into wearable devices, making them ideal for continuous monitoring in real-world conditions. The implications of this technology for personalized medicine are profound, offering the potential to tailor treatments to individual patients' needs more. A Versatile Tool for Bioprinting and Beyond   One of the most exciting aspects of HPCaP technology is its versatility in printing a wide range of materials, including conductive inks like gold and silver, polymers, quantum dots and even living cells. This capability opens up new possibilities in the field of bioprinting, where the ability to precisely position cells can lead to breakthroughs in tissue engineering, regenerative medicine, and microbiome research.   At the Department of Infectious Disease at Imperial College in London, Dr. Ravinash Krishna Kumar and his team have been exploring the potential of HPCaP for creating spatially structured cell communities. Their work focuses on understanding the fundamental principles of how to build productive and diverse microbial communities, which could have far-reaching implications for both healthcare and environmental applications. One of the key challenges in this research is the ability to print high-resolution patterns of cells, patterns with diameters typically less than 50 micrometers. Traditional printing equipment has struggled to achieve the necessary resolution, prompting the team to explore HPCaP as a solution. Working closely with Hummink, the team successfully printed  E. coli  bacteria in various patterns and resolutions. This capability could significantly advance our understanding of the structure of microbial communities and their applications in healthcare. From high-resolution sensors and wearable devices to implants and even the printing of living cells, the possibilities are vast. HPCaP's ability to print on diverse substrates and with a wide range of materials makes it a versatile tool that can be adapted to a myriad of healthcare needs.   As the technology continues to evolve, we can expect to see even more innovative applications emerge, including the potential for drug delivery systems and advanced tissue engineering. The future of healthcare is bright, and with HPCaP, we are one step closer to realizing its full potential. Hummink is committed to pushing the boundaries of what's possible, and we are excited to see how HPCaP will continue to shape the future of medicine. We are exhibiting! Visit our booth at the flagship TechBlick event in Berlin on 23-24 October 2024.   Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D.

TechBlick The Future of Electronics RESHAPED - Why You Should Join Us We have prepared a world-class agenda for you, featuring over 70 superb invited talks from around the world, 12 industry- or expert-led masterclasses, 4 tours, and over 80 onsite exhibitors. In this article, we discuss two themes of (1) Green and Sustainable Electronics and (2) Printing in Photovoltaics and Fuel Cells, highlighting talks, masterclasses and tours from the likes of Essemtec, imec, Holst Centre, Jiva Materials, RISE, VTT, ISC Konstanz, Fraunhofer ISE, Coatema, FOM Technologies, Panacol, etc #GreenElectronics #CircularElectronics #AdditiveElectronics #BioBasedElectronicMaterials #FineLineMetallization #FuelCells #LIFT #PerovskiteSiTandemCells #CopperMetallization #SlotDieCoating #Repair #Jetting #FR4Alternative In future articles, we will highlight more contributions on this theme as well as other key themes such as materials innovations, additive and 3D electronics, wearables and electronic textiles, volume manufacturing, etc. Stay tuned! Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Sustainable, green, and circular economy The first theme to be discussed is sustainable, green, and circular economy . This is a crucial driver for the additive electronics industry since additive processes can reduce material and energy consumption and enhance circularity vs. subtractive processes. Essemtec will outline how their automatic repair tools with no human interaction enable repair of electronic components and thus promote a circular economy. This technique combines jetting with pick-and-place and quality control in a single machine. This is a key theme in sustainable electronics, leading to prolonged product lifespans, enhanced performance, and ability to correct production mistakes! You will also learn about specific examples showing how this technique is applied to PCBs and BGAs even with different solder alloys. This will be a very interesting talk. Jiva Materials will outline their novel biodegradable water-soluble PCB laminate material, acting as an alternative to the incumbent fibreglass-epoxy rigid laminates. This new material containing natural fibers and non-brominated flame retardants has a 60% lower carbon footprint vs FR-4, whilst water solubility enhances end-of-life metal recovery without incineration. You will learn more about the properties and use cases of this novel FR-4 alternative in this talk imec will present jointly with the Holst Centre , comparing the sustainability of traditional PCB technology vs. the additive printed electronic technology. This is an important work that goes beyond just consideration of the additive nature of printed electronics, examining also the role of application, operating environment, as well as offering insights on more detailed LCA (Life Cycle Assessment) and data collection for printed electronics. Finally, they discuss how PCB technology is also addressing its environmental drawbacks, potentially making it superior in this regard. This works pavs the way for a robust and reliable application-specific benchmarking of additive electronics vs traditional PCBs. Explore and Register Before 11 October When The FINAL Early Bird Rate Ends VTT will present a masterclass exploring the sustainability and circularity of the electronic industry (not just additive electronics). The class focuses on how the EU regulatory landscape is changing and how the electronic industry can improve its environmental footprint, shifting from fossil-based, critical and rare materials to renewable, bio-based and abundant materials, adopting additive vs subtractive manufacturing processes, and utilizing circular economy business models and electronic designs and manufacturing. This is an important class for anyone interested in green, sustainable and circular electronics. RISE will also offer a masterclass , looking more specifically into (a) the role of bio-based materials and (b) additive manufacturing in achieving sustainable goals for the electronic industry. This class goes into more detail on emerging alternatives to the likes of PFAS, which are bio-based nature-inspired materials based on trees, plants, algae, etc. Furthermore, this class will explore how additive production minimizes waste and energy consumption, with specific examples drawn from flexible solar cells, PCBs, displays, and sensors. Holst Centre will also give a masterclass , focusing specifically on the sustainable and circular aspects of additive and printed electronics. This talk in particular addresses some of the challenges involved with the end-of-life treatment of hybrid & printed electronics, including about how to recover materials and components if parts are fused together as is the case in in-mold electronics. Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Printing in the photovoltaic and fuel cell industries The second theme to be highlighted today is around printing in the photovoltaic and fuel cell industries ! Fraunhofer ISE will present a cutting-edge development, showing how they can print high-aspect ratio ultra-fine lines with a width of only 14 μm on thin and fragile silicon wafers. This is an important development that advances the art of fine line printing in mass production beyond current perceived limits in what is possibly the largest printed electronics market: printing photovoltaic metallization. We cannot recommend this talk strongly enough! ISC Konstanz will present on adoption of screen-printed copper pastes for metallization of TopCon and IBC silicon photovoltaics, showing that the copper pastes can be a drop-in replacement for silver pastes (Ag inks). This is an important advancement of the art since the incumbent silver metallization is a major cost driver of the photovoltaic industry, and most attempts to develop alternatives have ended without major market success. Furthermore, ISC Konstanz will showcase ECAs with minimal amounts of Ag fillers to act as modulate-level interconnects to achieve lead-free solar modules. Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Coatema Coating Machinery GmbH will discuss how printing and coating play a role in the direct and indirect coating of platinum catalyst on membranes or gas diffusion layers for fuel cells. In particular you can learn about the role of slot die coating as well as the role of LIFT (Laser Induced Forward Transfer) technology in digital fabrication of PEM fuel cells as well as laser drying. This is an important talk, showing how slot die and digital LIFT can bring printing into the Fuel Cell industry too. FOM Technologies will show and discuss how slot die coating can enable the fabrication of perovskite-Si tandem solar cells, which can combine the efficiencies of both technologies and extend the efficiency beyond that reachable by the dominant Si technology alone. The choice and method of manufacturing is critical, and here you will learn about different options with an emphasis on why slot die coating offers a scalable and efficient solution even on non-flat surfaces. Panacol will also join to present their adhesive solutions for both perovskite and organic solar cell technologies. The adhesive technology plays an independent role in enabling these technologies, both as ways to reliably and cost effectively attach barrier films, and also as means to achieve lead-free module-level interconnections. Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Exhibition Of course, the exhibition is the key place where you can find partners across the entire value chain, including equipment manufacturers, ink and paste formulators, printing houses, and more. This is the place to visit if you intend to develop, prototype, or manufacture with printed and/or flexible hybrid electronics. There will be over 80 exhibitors from around the world. You can see the floor plan and learn about the exhibitors here . Explore and Register Before 11 October When The FINAL Early Bird Rate Ends

Author: Dennis Kuppens – Product Manager at SUSS Microtec Netherlands b.v. At SUSS MicroTec, our vision is to lead the way in enabling innovative semiconductor advanced backend and photomask solutions. In this article, we will explore how this vision extends beyond our own innovations to enable third-party innovation through SUSS PiXDRO inkjet technology. For years, the SUSS LP50 R&D Inkjet printer, featuring PiXDRO technology, has set the standard for researchers and engineers in developing and validating inkjet inks and processes, from R&D to high-volume production, across universities, research institutes, high-tech startups, and multinational companies. Whether you start in an ink development phase, a prototype development phase or a pilot-production phase, the LP50 printer can be configured and even field-upgraded to suit your current and future development needs. The 500+ research papers which are published on Google Scholar are a firm testimony to this. These articles highlight a wide variety of innovative applications where inkjet technology is being used for functional devices. All the papers have been submitted by users of SUSS LP50 printers, with more than 400 printers installed and used daily by researchers worldwide. Below are three abstracts of the most recent publications that can be found on Google Scholar. Development of a Screening Platform for Optimizing Chemical Nanosensor Materials (Published: Aug 24, 2024) https://www.mdpi.com/1424-8220/24/17/5565 Inkjet-printing and characterization of undoped zinc oxide thin films (Published: Aug 5, 2024) https://www.sciencedirect.com/science/article/abs/pii/S0925346724011145 Compact multispectral light field camera based on an inkjet-printed microlens array and color filter array (Publication: June 17, 2024) https://opg.optica.org/oe/fulltext.cfm?uri=oe-32-13-23510&id=551644 Summary These publications are a perfect illustration of how SUSS realizes its vision of enabling innovation. Beyond the three applications discussed, there are over 500 studies on the use of inkjet technology with the SUSS LP50 printer available on Google Scholar. These studies span various fields, including semiconductors, PCBs, flexible devices, pharmaceuticals, battery technology, medical devices, printed electronics, OLED display technology, and more. You can access all these papers through the LP50 website: https://lp50.suss.com Are you inspired? Reach out to SUSS to discover how we can support and enhance your innovation. We are eager to assist with your projects, collaborate on ink development, or provide the LP50 as a platform for your modules and business needs. You can fill out a web form on the LP50 website to get started: https://lp50.suss.com and explore other innovative products here www.suss.com   References: Development of a Screening Platform for Optimizing Chemical Nanosensor Materials (Published: Aug 24, 2024) -   https://www.mdpi.com/1424-8220/24/17/5565 Inkjet-printing and characterization of undoped zinc oxide thin films (Published: Aug 5, 2024) - https://www.sciencedirect.com/science/article/abs/pii/S0925346724011145 Compact multispectral light field camera based on an inkjet-printed microlens array and color filter array (Publication: June 17, 2024)  - https://opg.optica.org/oe/fulltext.cfm?uri=oe-32-13-23510&id=551644 Google Scholar - https://scholar.google.com/scholar?q=lp50+pixdro   We are exhibiting! We look forward to meeting you at our booth  at one of the most significant industry and research events "The Future of Electronics RESHAPED" in Berlin, Germany on 23-24 October 2024. We invite our friends, partners and customers to visit and take this opportunity to connect with the brilliant innovators showcasing their latest advancements with this cutting-edge technology. Experience a world-class programme, featuring 72 invited presentations, 80 exhibitors and over 600 global attendees. You can explore the programme here. Join us and RESHAPE the Future of Electronics, making it Additive, Sustainable, Flexible, Wearable and 3D. TechBlick events are designed to deliver an inspiring customer experience Register as our guest with this discount code: Suss

Ayer, MA September 2024 - Creative Materials Inc., an innovator of materials for the electronics industry, is pleased to announce the launch of two new high performance ink products: 125-10ADP Economical Conductive Ink and 130-05GL High Dielectric Strength Ink. These advanced inks represent a significant advancement in the realm of electronic manufacturing providing enhanced performance, reduced costs, and greater reliability. 125-10ADP Economical Conductive Ink The 125-10ADP Economical Conductive Ink is designed to meet the growing demand for cost-effective solutions without compromising performance. This ink is user friendly, offers high mechanical strength, electrical conductivity and excellent adhesion to a variety surfaces, making it ideal for use in a variety of applications including membrane switches, flexible electronics, printed circuit boards (PCBs), and sensors. Key features of the 125-10ADP ink include: Reliability: Delivers consistent electrical performance with low resistivity. Cost-Effectiveness: Provides a high-quality solution at a competitive price, enabling cost savings for manufacturers. Versatility: Suitable for use on a wide range of substrates, including treated and untreated polyester, urethanes and polyimide. 130-05GL High Dielectric Strength Ink In parallel, the 130-05GL High Dielectric Strength Ink addresses the critical need for materials with outstanding insulation properties. This novel ink is engineered to provide high dielectric strength (2,500 volts/mil). 130-05GL is a high gloss ink particularly suited for flexible cross-over circuitry applications.   We are exhibiting! Visit our booth at the flagship TechBlick event in Berlin on 23-24 October 2024.   Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D.    Notable benefits include: High Dielectric Strength: Ensures insulation and safety in high energy products. Mechanical Durability: Offers enhanced resistance to environmental stressors such as abrasion, humidity, and temperature fluctuations. Flexibility: Maintains performance across a range of operating conditions and substrates. Driving Innovation and Efficiency “Creative Materials is committed to pushing the boundaries of material science to deliver products that drive innovation in the electronics industry,” said Matthew Ganslaw, Executive Vice President of Creative Materials Inc. “With the introduction of 125-10ADP and 130-05GL inks, we are providing our customers with solutions that not only meet, but exceed the demands of modern electronic applications, while also helping them achieve greater efficiency and cost-effectiveness.” About Creative Materials Inc Founded in 1987, Creative Materials Incorporated develops, manufactures, and delivers customized inks, adhesives, & coatings, that are designed and optimized for each client’s specific product requirement while continuously exceeding the highest quality standards, and providing the most responsive engineering and customer service support in the industry. Contact: Call to speak with an application support specialist today at 1-800-560-5667 or email us at info@creativematerials.com We are speaking! Join us at the flagship TechBlick event in Berlin on 23-24 October 2024.   Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D.

On 22 October 2024, the day before the Future of Electronics RESHAPED conference and exhibition opens its doors, you can participate in a day of industry- and expert-led masterclasses. These sessions offer a unique blend of technology, application, and practical insights, providing a valuable opportunity to learn the latest advancements, acquire new skills, or refresh your existing knowledge. Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Masterclass Themes Material Innovations, Developments, and Application Advances Polymer Thick Films : This topic has always been, and will remain, fundamentally important to the entire printed electronics industry. The instructor for this class is Saeed Madadi from Celanese. Liquid Metals : One of the most exciting emerging materials in printed, soft, and stretchable electronics, liquid metals offer amazing properties. This class will be instructed by leading researcher Mahmoud Tavakoli from the University of Coimbra . Electroactive Polymers : This is an important class for anyone interested in haptics, actuators, and sensors based on piezoelectric technology. The class will be jointly instructed by Fabrice Domingues Dos Santos from Arkema and Valerio Zerillo from Kemet. Wearables and E-Textiles Manufacturing Wearable Sensors:  In this class, you will learn about wearable sensors and their typical applications. Additionally, you'll gain insights into the technical requirements and materials commonly used in printed wearable sensors, with a focus on cost considerations and manufacturing challenges. This class is taught by Mikko Paakkolanvaara from Screentec, a company with years of experience in printed wearable sensors. Mastering Electronics Integration Into Textiles and Wearables:  This is a crucial class for anyone interested in e-textiles. The integration of electronics into textiles and wearables is a critical aspect that affects manufacturing and all facets of product design. In this class, you will learn about the key methods for successful integration. The class is instructed by Guus De Hoo, from Elitac Wearables,  who has extensive experience in electronic integration into textiles. Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Manufacturing Flexible Hybrid Electronics R2R Flexible Hybrid Electronics:  This is a must-attend class for anyone interested in performing roll-to-roll (R2R) production of flexible hybrid electronics. The course covers printing techniques, assembly methods, and testing processes. The class is offered by  Ashok Sridhar from TracXon , who brings unique insights from his research background at the Holst Centre and his current R2R FHE manufacturing activities at TracXon. Chip Interconnections for Flexible Printed Electronics:  This is a critical topic for anyone interested in placing SMT components on flexible substrates, where the choice of interconnect technology plays a pivotal role. You will learn from Aviv Ronen of Beckermus Technologies,  who is ideally positioned to teach this class due to his research on solder and interconnect technologies and the work of Beckermus Technologies in R2R manufacturing of flexible hybrid electronics. Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Digital Printed, Additive and 3D Electronics  Digital Additive Manufacturing:  This class offers an overview of various digital printing electronics processes, including inkjet, aerosol, electrohydrodynamic (EHD), microdispensing, and more. It's a valuable class for anyone interested in working with digital additive electronics techniques. The class is instructed by Neil Chilton of Printed Electronics Ltd. Optimizing Inkjet Processes:  This is an essential class for anyone currently printing electronics with inkjet or looking to start. The class, taught by Jochen Christiaens from ImageXpert , will teach how to optimize the printing process to improve print performance and stability while saving development time. Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Sustainable, Green and Circular Electronics How to Improve Sustainability in Electronics:  This class is an excellent introduction for anyone interested in green electronics. It covers the latest trends and needs in sustainable and circular electronics, focusing on changes in materials, manufacturing processes, designs, and business models that enable circular electronics. The class is offered by  Liisa Hakola from VTT. Role of Bio-based Materials in Additive and Sustainable Electronics:  This class provides valuable insights into how bio-based and nature-inspired materials can replace synthetic and non-sustainable materials in electronics, impacting all aspects of electronic design and manufacturing, including printed and additive electronics. The class is offered by Jesper Edberg from RISE Research Institute of Sweden. Sustainable and Circular Printed Electronics:  This unique class explores how materials and components in printed, flexible, hybrid, or in-mold electronics—where electronics might be fused together—can be recovered, addressing the challenges of end-of-life treatment in hybrid and printed electronics. The class is offered by Stephan Harkema, an expert researcher at the Holst Centre. Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Tours After the masterclasses you can participate at a tour of your choice. You have a choice of four insightful tours covering themes such as inkjet printed OLED lighting, high viscosity jetting head technology, PCB and electronic manufacturing technologies and advanced material research. The tours include: Fraunhofer IZM, Fraunhofer IAP, Quantica GmbH, and Inuru Explore and Register Before 11 October When The FINAL Early Bird Rate Ends

TechBlick The Future of Electronics RESHAPED - Why You Should Join Us. 23 & 24 October 2024 | Berlin, Germany TechBlick have prepared a world-class agenda for you, featuring over 70 superb invited talks, 12 industry- or expert-led masterclasses, 4 tours, and over 80 onsite exhibitors. You can explore the full program here . In this article series, we highlight various talks in the program, outlining the technologies and applications that will be showcased.  In this article, we discuss the theme of   Additive and 3D Electronics, highlighting talks, masterclasses and tours from the likes of Airbus, Semikron Danfoss, Ceradrop, NeoTech AMT GmbH, Hasselt University, Karlsruhe Institute of Technology, Hahn-Schickard Institute, PERC, Binghamton University, University of Texas El Paso, Tecnalia. Note that this is the second article on the theme of Additive and 3D Electronics . In the previous article, we highlighted contributions from the European Space Agency, Yole Group, Decathlon, LPKF Laser & Electronics, Exxelia Micropen, Fuji Corp, Elephant, Nano OPS, Notion Systems, and Henkel and Tecna-Print, Printed Electronics Ltd, ImageXpert, Quantica. Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Airbus  will share their findings on the durability of 3D printed and hybrid electronics under aeronautic conditions. The motivation here is the direct integration of electronics on composite structures. In this case, flexible hybrid electronics embedded in TPU foils are integrated on aeronautic composite coupons. In this study, the durability of these devices is investigated. In parallel, test results on the durability of additively manufactured electronics are also presented. This is an important theme as there is a lack of information on such topics today.  Semikron Danfoss:  For users and designers, the landscape for additive electronics is complex, given the breadth of materials and princess. Here a classification is presented from the perspective of the application, helping the user identify useful tools, methods and materials which are needed for simple or very complex AME projects. This is an important project that will help users, designers, hard- and software vendors - also those from outside the AME industry- to benefit from this discussion and launch project. This is an important contribution in lowering barriers to commercial adoption. Ceradrop:  This is a talk focused on enabling industrialization with digital printed electronics processes. This is an important theme since many applications are transitioning from prototyping to mass production, and often find that the transition is not very straightforward. Ceradrop will present how their equipment solutions enable a seamless transition, and in doing so will highlight specific use cases.  Neotech AMT GmbH: This talk focuses on the fundamental technology combining free-form, 5-axis 3D printing of mechanical and electronic components, Surface Mount Device (SMD) placement and pre- and post-processing techniques. This is an advanced form of 3D printed electronic technology, offering design freedom, local production, as well as opportunities to create sustainable mechatronic systems. In this talk, you will also learn about the specific use case of a 3D-printed lighting product.  Explore and Register Before 11 October When The FINAL Early Bird Rate Ends PERC:  In this talk, by one of the most important centers for printed electronics R&D in the US, you will learn about Additive Manufacturing for Advanced Microwave and RF Applications. This talk addresses all the key challenges in additive manufacturing of high-frequency electronics including including UV curable low-loss dielectric, resistive, and ferroelectric inks. Furthermore, the talk will present examples of additive packaging including, design, fabrication, and characterization of a non-planar multi-material MMIC structure as well as bare-die integration and tunable Frequency Selective Surface (FSS) based filters, wearable metasurface filters, and printed connectors  University of Texas El Paso:  This is an important research direction which integrates functional content in mass-customized structures, thus creating true 3D-printed electronics. Here the underlying technology developments are reviewed and the presentation will also outline specific examples of multi-process 3D printing for creating structures with consumer-anatomy-specific wearable electronics, electromechanical actuation, and electromagnetics in ceramic structures.  Hahn-Schickard Institute : In this talk, a hybrid printing system is introduced. Here the polymer/dielectric substrates can be directly printed from FFF technology. The StarJet technology is directly integrated into the 3D printing system as the 2nd extruder which prints the bulk metal (e.g. SAC305 solder) through digital and non-contact deposition of the molten metal droplets or Jet. This technique achieves bulk electrical conductivity, conformal printing, no pre- and post-treatment, and high compatibility on flexible substrates due to solvent-free printing. Furthermore, when the bulk solder (e.g. Tin silver copper alloy) is used for the molten metal printing, the SMD components can be directly soldered and bonded onto the large-area flexible substrates, eliminating the troublesome solder reflow process. This is an innovative technology addressing many traditional technology shortcomings in 3D printed electronics. Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Karlsruhe Institute of Technology: This talk presents a novel Aerosol-on-Demand (AoD) jet-printing system which overcomes issues of traditional digital printing of electronics. Here, the aerosol is generated from a point-like source within the printhead and is then hydrodynamically focused, enabling one to achieve the printing of discontinuous microstructures without ink loss and the need for a shutter. This novel system holds great promise for 2D, 2.5D, and 3D electronics printing with aerosol.  Tecnalia Research & Innovation:  This talk focuses on composite functionalization via printing, adding even more value to fibre-reinforced plastics. You can learn how advances in printing and manufacturing technologies enable the integration of electronic functionality onto composites without compromising their properties. You can learn about processes, materials, and specific demonstrators.  Hasselt University:  This talk focuses on thermoformed 3D electronics. Here, the study reports on the process of screen printing of conductive Ag-based inks on different 2D foils and the subsequent thermoforming of the same to achieve 3D circuit layers on which, afterwards, rigid electronics can be placed via the use of pick-and-place and conductive adhesives. The process and the different foils and inks are discussed in detail in this work. Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Exhibition Of course, the exhibition is the key place where you can find partners across the entire value chain, including equipment manufacturers, ink and paste formulators, print houses, and more. There will be over 80 exhibitors from around the world. You can see the floor plan and learn about the exhibitors here . At the exhibition, you will also meet many key players developing equipment, materials and services for additive (digital) and 3D electronic printing. Such exhibitors include: Notion Systems, Voltera, Heraeus Printed Electronics, ImageXpert, Printed Electronics Limited, IDS, Hummink, Fuji,  MAAS, Neotech AMT, Nano Ops, Quantica, SüssMicrotec, XTPL, Atlant 3D, Ceradrop, DoMicro, Exxelia, Teca Print, and PrintedUp Institute, BotFactory, and more.  Some companies offering digital and/or 3D-printed electronics Notion Systems Voltera Heraeus Printed Electronics ImageXpert PEL IDS Hummink Fuji MAAS Neotech AMT Nano Ops Quantica SüssMicrotec XTPL Atlant 3D Ceradrop DoMicro Exxelia Teca Print PrintedUp Institute BotFactory Explore and Register Before 11 October When The FINAL Early Bird Rate Ends

Visit The Latest Industry and Research Highlights On 22 October 2024, the day before the Future of Electronics RESHAPED conference and exhibition opens its doors, you can participate in a day of industry- and expert-led masterclasses and tours. See the program below. In addition to the tours and masterclasses you will have access to ✅ 75 invited onsite conference talks ✅ 83 onsite exhibitors ✅ 12 expert-led masterclasses ✅  4 tours ✅ Annual online access to TechBlick platform Library of content featuring over 1500 talks (PDF and video) from all past online as well as onsite events around the world Access to all future online events within access period Access to on-demand version of all talks and masterclasses at upcoming onsite events including MicroLED Connect (Eindhoven, Sept 2024) and Future of Electronics RESHAPED (Boston, June 2025) Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Tour Themes After the masterclasses, you’ll have the option to participate in one of the following themed tours: Fraunhofer IZM Fraunhofer IZM’s focus is on packaging technology and the integration of multifunctional electronics into systems. Fraunhofer IZM was founded in 1993 and is today one of the global leaders in microelectronics and microsystems packaging The guided tour at Fraunhofer IZM is organized by three working groups:  System on Flex  This group is working on advancing flexible hybrid electronics, stretchable electronics, and electronic textiles. During the tour, you can visit various labs and cleanrooms. #AssemblyTechnologies #FlipChipBonding #Fine Patterning of Flexible and Stretchable Substrate #Integration of Microelectronics Into Flexible and Stretchable Substrates #Lamination #LaserPatterning #Mechanical Drilling #Thermoforming Technologies for Bioelectronics This group designs, fabricates, and tests active neural interfaces and flexible, biocompatible implants for neural stimulation and recording. They explore new methods for stimulation and wireless power transfer. During the tour, you can visit their specialized facilities. Sensor Development and Integration  This group develops micromechanical sensors for various applications. #TextileLabs #MechanicalTestingLab #FlexibleElectrodeProduction #Implantables #SmartTextiles #NeuralSimulation Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Inuru Possibly the only company worldwide printing OLED lighting, they have simplified the process by utilizing inkjet printing, making printed OLED lighting affordable. This is an advanced printed electronics production facility. This is a unique opportunity to visit Inuru and its facilities. #OLEDLighting #SmartPackaging #Branding #InkjetPrinting Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Fraunhofer IAP Fraunhofer IAP is developing future-oriented solutions throughout the polymer and nanomaterial value chain. On this tour, attendees will gain insights into the research divisions of "Functional Polymer Systems," "Biopolymers," and "Polymeric Materials and Composites." You will be guided through Fraunhofer IAP's pilot plants and labs on-site in Potsdam, including the clean room area for printed electronics, the pilot plant for fiber technology (from spinning to carbonization), and labs for polymer and quantum dot synthesis. Key topics include #QuantumDots, #PerovskitePhotovoltaics, #OrganicPhotovoltaics, #PolymerSolidStateBatteries, and #PFAS-Free Fuel Cell Membranes. Quantica Quantica is an advanced additive manufacturing company headquartered in Berlin, Germany. Their innovative inkjet-based technology enables  the digital deposition of high-viscosity and high particle-load materials. With their advanced systems, users can print and combine new materials seamlessly in a single process for 2D and 3D application development. From car coatings to printed electronics to hearing aids, Quantica's technology offers an innovative new solution. On this tour, attendees will gain insight into the research and development behind Quantica's printheads and systems. Additionally, they'll have the opportunity to witness a live printing demonstration, showcasing the technology firsthand. Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Masterclasses The tours take place after our masterclass program where you can learn the latest on some of the most important themes and technologies in the field, including:​ Polymer Thick Films Liquid Metals Sustainable Electronics Mass Production of Medical Wearables Electroactive Polymer Actuators and Sensors Interconnect Technologies for SMT on Flex R2R Production of Flexible Hybrid Electronics Digital Additive Electronics Technologies Methods To Optimise InkJet Printing of Electronics Green and Circular Additive Electronics Bio and Green Electronic Materials Integration of Electronics Into Textiles You can see the full program here Online Masterclasses You can, of course, have access to the full portfolio of on-demand masterclasses. These were delivered onsite at our past TechBlick events in Boston 2024, Berlin 2023, and Eindhoven 2022 as well as online. Furthermore, with the Hybrid Annual Pass, you will have access the onsite masterclasses to be delivered this September in Eindhoven on MicroLED, AR/VR and Display Technologies as well as masterclasses which are to be delivered in Boston 2025 on printed and additive electronics. Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Eindhoven 2024 | Coming Soon IQE | MC1:MicroLED LED Epitaxy Holst Centre | MC2: Enabling solutions for mass-transfer of microLEDs Coherent | MC3:Laser Technology in Mini- and MicroLED Fabrication: from Mass Transfer to Bonding and Repair InZiv | MC4: Inspection and Repair Technologies in Micro and MiniLED Manufacturing UBI Research | MC5: ARV/VR technologies, trends, and markets* Hendy Consulting | MC6: An overview of the MicroLED industry and market Fraunhofer IAP | MC7: Quantum Dot and Color Conversion Technologies* Scrona | MC8: EHD and Inkjet Printing in MicroLEDs: From Repair to Color Conversion Boston 2024 | Watch Now Innovation Collaborative Centre (C2MI)  | Interconnect Technologies for Integrating Rigid Components in Flexible Hybrid Electronics Applications. Nagase ChemteX  | Conductive Inks and Pastes: Technologies and Applications VTT  | Full R2R Process Flow for Flexible and Hybrid Electronics with Test and Verification Aspects NC University  | Liquid Metal Technology: Technologies, Applications, Practice and State-of-the-Art Binghamton University  | Digital Additive Manufacturing of Electronic Devices: Inkjet, Aerosol, Dispensing, EHD printing and beyond Celanese | Screen Printing, Curing, and Testing/Post-Processing: Technologies, Practice, State-of-the Art BotFactory | An Analysis of AME and its readiness to serve low-volume PCB manufacturing Holst Centre  | Wearables for Healthcare Applications Berlin 2023 | Watch Now Kundisch GmbH & Co. KG  | HMIs with Integrated Smart Functions Holst Centre  | Sustainable Electronics: Understanding and Analysing Sustainability Aspects of Printed Electronics MacDermid Alpha  | Interconnect technologies for flexible hybrid stretchable electronics: from conductive adhesives to low-T solder Elantas  | Processing Functional Screen Printing Pastes Scrona  | Electrohydrodynamic Printing and how to Scale it towards Economics Neotech AMT GmbH  | 3D Printed Electronics Stuttgart Media University | Screen Printed Batteries JOANNEUM RESEARCH  | R2R - UV Nanoimprint Lithography - Nano goes Macro for innovative use cases Eastman Kodak  | Technologies for High-Resolution R2R Manufacturing TactoTek  | 3D Structural In-Mold Electronics: New Design Freedom and New Design Rules Holst Centre  | Wearable Sensors for Healthcare Applications Molex  | Navigating the Market Landscape: Qualifying Ideas and Overcoming Barriers in Printed Electronics Eindhoven 2022 | Watch Now Asada Mesh  | Advanced Functional Screen Printing: Advances and Techniques for Ultra Fineline Printing Copy Notion System s | Industrial Inkjet Printing Holst Centre  | Wearable Sensors for Healthcare Applications Fraunhofer Institute for Applied Polymer Research  | Introduction to Solution-Processed Light-Emitting Materials: Quantum Dots, OLEDs Holst Centre | Introduction to LIFT (Laser Induced Forward Transfer): Technology and Challenges CPI  | Flexible Hybrid Electronics Manufacture – An Overview Innovation Lab  | The Art of Roll-2-Roll Printing Copprint  | Copper Inks Usage, Formulations and Applications

Author: Thibaut Soulestin, PhD; Senior Application Engineer, Henkel Adhesive Technologies - Printed Electronics;  thibaut.soulestin@henkel.com Henkel Adhesive Technologies holds leading market positions worldwide in the industrial and consumer business. As a global leader in the adhesives, sealants, and functional coatings markets, Henkel has developed a large material portfolio of LOCTITE® conductive inks and coatings suitable for printing electronic circuitry, that is thin, lightweight and flexible. The LOCTITE® Printed Electronics portfolio offers more than 100 different material solutions of which more than 20 are silver inks. Driven by the megatrend of digitalization, printed electronics offer a complementary solution to traditional electronic circuitry, opening new opportunities for electronics integration and miniaturization across industries. To achieve surface integrability, with limited visibility to the human eye, the printing of fine line structures has become increasingly important. To achieve high-performing fine line printed circuitry, it requires conductive inks having fine silver particles and adapted viscosity e.g. LOCTITE® ECI 1006. We are exhibiting! Visit our booth at the flagship TechBlick event in Berlin on 23-24 October 2024.   Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D.    1. LOCTITE® ECI 1006 Among the large range of Henkel silver inks, LOCTITE® ECI 1006 is specifically developed for fine-line printing, targeting a line width below 150 µm (Figure 1). Fine lines are of particular interest for the development of transparent conductive surfaces, amongst others enabling human-machine interface (HMI) solutions. More precisely transparent capacitive touch sensors enable backlighting for HMI. The better long-term reliability of LOCTITE® ECI 1006 can be an advantage compared to alternative materials on the market, e.g. PEDOT: PSS inks. In addition, LOCTITE® ECI 1006 can heat up to 150°C, without performance degradation, allowing rapid heating. This makes it an interesting material solution for visible or radar-transparent heaters with printed fine lines. The heater power can be adjusted by the design of the fine lines. De-icing of advanced driving assistance systems, ADAS, is a good application example. LOCTITE® ECI 1006 is specifically formulated with fine silver particles to avoid clogging of the screen and provide homogeneous electrical contact, even for very fine lines below 50 µm width. This ink also shows high viscosity and thixotropic index to reduce the spreading of the ink. Figure 1. Example of a 1 kg LOCTITE® silver ink The dry ink layer shows good adhesion onto a large range of substrates after 1000 hours at 85°C and 85 %RH, even on difficult substrates such as copper, or ITO. Beyond good adhesion on ITO LOCTITE® ECI 1006 offers low contact resistance, making it particularly suitable for busbars on transparent ITO films. To meet the growing demand for hybrid electronics and components attached onto flexible substrates, this ink is compatible with low-temperature solder Sn42Bi58 paste; and electrically conductive adhesives such as Henkel LOCTITE® ABLESTIK CE 3104WXL or LOCTITE® ABLESTIK 2030SC. Table 1. Typical Properties of LOCTITE® ECI 1006 2. Printing Trials with LOCTITE® ECI 1006 2.1 Equipment Stainless steel screens with thin wires and high mesh count are mandatory to achieve good printing quality. It is the most important parameter. For a test study, a 640-15 stainless steel mesh from Asada was selected. Thermotropic liquid crystal polymer monofilament mesh, also known as V-screenTM, are a good alternative. Figure 2 shows the test design with line width from 100 µm down to 30 µm width with different spacing and orientation to see the influence of print direction and ink spreading. Figure 2. Fine line test screen design A thin and low roughness emulsion over mesh, EOM, is also required to keep the good printing definition, below 10 µm with a roughness below 2 µm, is recommended. A thicker EOM will impede the ink release, resulting is pinholes or line breaks. The emulsion AZOCOL® Z 177 FL with release agent KIWOMIX® RA 1750. EOM 8 µm from Kissel+Wolf. The release agent improves the paste releases from the screen (Figure 3). Figure 3. Emulsion AZOCOL® Z 177 FL with release agent KIWOMIX® RA 1750. EOM 8 µm. After printing, the paste is fully released from the screen. A Carbon S 75° 8 mm squeegee from RKS was chosen to provide constant printing quality over the entire trial without mechanical changes of the squeegee behaviour. Standard untreated polyester substrate, CUS5 125 µm thick from Mc Dermid, was selected. The substrate surface energy can play a significant role in the printing quality, especially for the ink spreading after printing. Using a standard substrate demonstrates that with the right ink and printing equipment, fine silver lines, below 50 µm, are already possible. LOCTITE® ECIs 1006 was used un-diluted and diluted with 2 wt% of DBE solvent, CAS number: 95481-62-2. The ink is mixed with a propeller mixer, at low speed, 300 rpm. Dilution up to 10 wt%, by 1 wt% increments, is possible to balance printability versus ink spreading. Printing trials were carried out in Henkel Inspiration Center Düsseldorf, ICD in a standard lab environment. For reliable quality production, dust-controlled rooms or even clean rooms are highly recommended. We are speaking! Join us at the flagship TechBlick event in Berlin on 23-24 October 2024.   Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D.   2.2 Visual Inspection Figure 4 shows the microscope images of 30 µm and 75 µm lines width with un-diluted and 2 wt% diluted ink. 75 µm lines with un-diluted ink have good edge quality with very low spreading. At 30 µm, due to the high ink viscosity and the screen mesh, the edges are wavy and line breaks are observed. 2 wt% dilution with DBE solvent improved the printability and much better line edges are observed without lines breaks. This improvement is coming with a larger ink spreading as observed for the 75 µm line width. Figure 4. Left column: Un-diluted LOCTITE® ECI 1006 ink, Right column: 2 wt% diluted. Top row: 30 µm line width design, Bottom row: 75 µm line width design. Line breaks may be caused by the rough surface of the mesh and high ink viscosity. But they can also result from external pollution such as dust. Figure 5 shows a line break of a 50 µl line width despite good printing quality. This break is likely due to screen blockage by external pollution. Thus, it is important to produce in a dust-controlled environment, and clean room conditions to avoid contaminations resulting in line breaks or shortcuts between lines with narrow spacing. Figure 5. Microscope image of 50 µm line width printed with undiluted LOCTITE® ECI 1006. The mesh structure is visible on the edges of the printed tracks but also on the surface. Figure 6 gives an overview of interferometer measurements on fines lines with undiluted LOCTITE® ECI 1006. At low width, below 30 µm, the ink is barely printed on the substrate. For the 50 µm lines, even if the edges are regular (Figure 5), the surface roughness is important with hills and valleys ranging from 1 µm up to 9 µm thick. This roughness is strongly related to the screen mesh but can also be mitigated by diluting the ink to favour ink flow. Figure 6. Interferometer images of 20, 25, 30, 40, and 50 µm lines width printed with undiluted LOCTITE® ECI 1006. Printed track surface homogeneity and edge regularity have a direct influence on the final printed track resistance. The valley and narrower sections create local higher resistive points resulting in higher track resistance. Figure 7 summarises the track resistance (R) normalized to the track shape (Nsq = length/width), called Square Resistance, in mOhm/sq. For standard silver ink printing with a line width in the 0.5 to 20 mm range, the square resistance on tracks on one print is constant, as the thickness is the same for all the tracks and the edges have no influence. For fine lines, the influence of edges and roughness is clearly visible. 20 µm tracks are not conductive. The square resistance for the 30 to 50 µm lines is above the expected value because of a narrower section of the tracks. As of 75 µm, the square resistance is constant indicating negligible influence of the edges and roughness. The square resistance of the tracks printed with undiluted ink is higher as the edge quality is lower. To achieve good quality 50 µm tracks, a dilution higher than 2 wt%, closer to 4 wt%, would be required. Figure 7. Square resistance of undiluted and 2 wt% diluted LOCTITE® ECI 1006 for different line widths Advanced microscopic equipment is thus not needed to check the printing quality of the tracks. By simply monitoring the square resistance, it is possible to assess the edge quality and even more thickness homogeneity. Homogenous tracks are important for fine-line heater applications to avoid local hot spots leading to local burns and loss of heater performance. 3. Conclusion Successful fine line printing is a subtle balance between ink, equipment, and processing. Different LOCTITE® inks can be used for fines lines such as LOCTITE® ECI 1010, LOCTITE ECI® 1011 or LOCTITE® ECI 1006. The later features the best combination of fine silver particles, adapted viscosity, good reliability, and adhesion to a wide range of substrates. Aside the ink, the screen is the most important parameter for successfully printing fine lines. Therefore, it is highly recommended to seek advice and alignment with your screen supplier before starting the printing. To ensure you achieve your printing goals, the Henkel Printed Electronics team can help you choose the right ink for your application requirements and introduce you to trusted industry partners. Connect with our printed electronics experts and learn more about Henkels established portfolio of conductive inks and coatings: printed.electronics@henkel.com . 4. Acknowledgements Thank you; to Asada Mesh for supplying the stainless-steel mesh; Kissel+Wolf for supplying the screens with the emulsions, and RKS for the carbon squeegees. Thank you all for the in-depth and fruitful technical discussions.

Author: Dr. Lena Reinke | lena.reinke@panacol.de Perovskite-based (PSC) and organic photovoltaic (OPV) cells represent a promising frontier in renewable energy generation technologies due to their potential for lightweight, flexible and potentially cost-effective solar power generation. However one of the critical challenges in the commercialization and long-term reliability of OPV cells is their encapsulation. Effective encapsulation protects the delicate photoactive materials from environmental factors such as moisture, oxygen and mechanical stress. Adhesives play a crucial role in this encapsulation process, offering not only mechanical stability but also environmental protection. This article focuses on the various types of adhesives used in the encapsulation of OPV or PSC cells. We are exhibiting! Visit our booth at the flagship TechBlick event in Berlin on 23-24 October 2024. Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D. Encapsulation adhesives for OPV or PSC cells must meet several stringent criteria: Moisture and Oxygen Barrier: As the active materials are sensitive towards humidity and/or oxygen, the adhesive should therefore provide good barrier properties to prevent a degradation caused by moisture or oxygen ingress. The adhesive barrier properties can be tuned using to different strategies. One can either use quite hydrophobic raw materials to chemically prevent the ingress of water molecules or the cross-linking properties of some multifunctional components can build up a dense polymer network after curing so that the water ingress is blocked mechanically. UV stability: The adhesive should also withstand prolonged exposure to sunlight without turning yellowish or getting brittle. This is especially important for PV applications that will be used outside. Adhesion strength: It is important to ensure the mechanical integrity of the devices. Therefore, the adhesive needs to firmly bond the encapsulant material to the PV cell layers. Within initial tests, we check the adhesive performance by conducting T-Peel tests. Often it is very helpful to use a pretreatment technology such as corona or plasma to ensure sufficient surface energy and thus an enhanced T-Peel strength. Compatibility: While sufficient adhesion strength is crucial, we also need to address the compatibility between the adhesive and the active layers. While an effective binding towards plastic substrates can often be provided by using monomeric raw materials, those can be quite harmful for the sensitive photoactive materials especially if a pronounced polarity is present. To overcome this issue, chemists need to balance out the ratio between oligomeric and monomeric compounds. We are speaking! Join us at the flagship TechBlick event in Berlin on 23-24 October 2024.   Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D.   For the encapsulation process, there are several types of adhesives that can be interesting. Epoxy-based formulations are widely used as they typically bring chemical resistance and thermal stability. This is due to the durable bonds that are formed during the polymerization process and accompanied by significantly improved barrier properties. Acrylic-type adhesives are also commonly used, especially if it comes to more challenging substrates as for example PET. Here, the required flexibility can be achieved more easily as for the usually more rigid epoxies. An additional advantage for acrylic-based adhesives is the typically faster polymerization. As time often is a critical criteria the curing speed should always be taken into consideration. In Table 1 a qualitative comparison between the two adhesive groups is listed. Table 1 Qualitative comparison of the main features of epoxy- and acrylate-based adhesives. It is obvious that for both adhesive types there are advantages and drawbacks. This is caused by the adhesive’s properties influencing each other. The best example is that the barrier properties of a flexible acrylate-based adhesive are often worse in comparison to a highly crosslinked material. On the other hand, the flexibility of an adhesive also strongly influences the adhesion properties on flexible substrates positively. Therefore, it is required to balance out the adhesive’s flexibility and barrier properties. Another interesting binding task for adhesives is the contacting of the PV cells. To address this topic, it is possible to use electrically conductive adhesives. Those adhesives typically have the drawback that a deep frozen storage and delivery is required as the metal particles tend to settle down. As the particles block UV light, a photoinduced curing is also not possible often resulting in a slow curing speed and high temperatures that are required for curing. With Elecolit 3648, Panacol has developed an adhesive that can be cured under relatively mild conditions (see table 2). The comparatively low viscosity of about 10.000 – 15.000 mPas (at shear rate 10, 25 °C) allows it to be dispensed easily. Table 2 Possible curing parameters for Elecolit 3648. The previously mentioned adhesive properties are complemented by the adhesives' impressive flexibility which allows Elecolit 3648 to be used within flexible PV devices. Join us at the flagship TechBlick event in Berlin on 23-24 October 2024. Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D.

TechBlick The Future of Electronics RESHAPED - Why You Should Join Us We have prepared a world-class agenda for you, featuring over 70 superb invited talks from around the world, 12 industry- or expert-led masterclasses, 4 tours, and over 80 onsite exhibitors. In this article series, we highlight various talks in the program, outlining the technologies and applications that will be showcased. In this article, we discuss the theme of volume manufacturing with printed electronics highlighting talks, masterclasses and tours from the likes of Flexoo, Avery Dennison Smartrac, SPGPrints, db-Matik, Beckermus Technologies, Printed Electronics Limited, Voltera, Tracxon, ImageXpert, Fraunhofer IZM, Quantica, Inuru, ScreenTec, etc In a previous article, we have already highlighted some of the talks focused on wearable, bio, and/or medical sensors as well as on digital and 3D additive electronics. In future articles, we will highlight more contributions on this theme as well as other key themes such as sustainable electronics, materials innovations, additive and 3D electronics, wearables and electronic textiles, medical electronics, photovoltaics, packaging, novel materials, lighting applications, etc. Stay tuned! Flexoo will outline their ability to offer mass customization as well as mass production with a specific focus on smart sensors and labels. Flexoo - a spin-off from InnovationLab GmbH with the direct acquisition of Heidelberg Printed Electronics GmbH - has created unique capabilities, covering all scales of R2R production from development to prototyping, to small volume production, to extremely large volume. In this talk, you can learn how this one-stop-shop approach enables the development and production of products with printed sensors, printed circuits, printed antennas, printed heaters, and beyond. SPGPrints will take you through the journey of scaling up Printed Electronics production along the 3 C’s of de-risking industrialized production using real-life customer cases: Cost, Capacity, and Certainty. They will also cover critical technical and application-design considerations for mass production, including how to balance pattern design, inks, substrates, and production methods. Furthermore, they will discuss how rotary screen printing enables cost-effective and high-throughput manufacturing with superb resolution and excellent thickness control, and they will offer a detailed cost comparison of flat versus rotary screen printing. Avery Dennison Smartrac will outline their developments in green printing in the digital landscape, showing how their approach can scale to mass production. This is an excellent development, combining the long-standing expertise of Avery Dennison Smartrac in R2R production of hybrid electronics with green additive manufacturing techniques. Beckermus Technologies will outline the key challenges of interconnections between chips and flex substrates, especially in R2R hybrid electronic manufacturing. This is a critical technological step in enabling roll-to-roll manufacturing of flexible hybrid electronics. Beckermus Technologies will offer insights based on its years of real-time FHE manufacturing experience, discussing different interconnect material and process technologies. Voltera will present the latest developments using their unique digital printer, focusing on the use case of multi-layered printed battery applications. While this machine is not a volume manufacturing machine, it could play an important role in accelerating the design-to-fabrication process. This is because it enables digital and software-controlled development and prototyping of complex multilayer devices using high-viscosity pastes, which could then be transitioned directly to mass production techniques like screen printing. This is significant because many other digital prototyping techniques rely on inkjet and are thus limited to low-viscosity inks with nanomaterials that cannot be screen printed. Printed Electronics Limited (PEL) will share their unique experiences in prototyping and small production (10 pcs to 2500 pcs) across the resolution spectrum. PEL’s unique capabilities cover the entire resolution spectrum from 1 µm to 1 mm. Their capabilities include superfine inkjet (SIJ), aerosol, screen printing, inkjet, and viscous jet deposition. Even with their screen printers (Microtec printers), they can achieve down to 30 µm linewidths with <15 µm print-to-print accuracy. Furthermore, they can print between 2-14 layers per device, including through-hole printing. db-Matik will present their capabilities, outlining their full turnkey solutions for electronic manufacturing on flexible substrates. This includes printing as well as assembly lines, covering circuit printing as well as component placement on films. Additionally, their solutions offer testing as well as singulation. They are an excellent partner for anyone looking to set up or expand a printed electronics production line. Expert-Led Masterclasses The event also includes fantastic masterclasses dedicated to manufacturing. ScreenTec will discuss how to manufacture wearable sensors. ScreenTec is a well-established printing house with deep expertise and experience in wearable sensor manufacturing. Beckermus Technologies will hold a class on interconnect technologies for flexible hybrid electronics, covering key technologies such as various solders and conductive adhesives. This is a must-attend class for anyone interested in placing components onto films in flexible hybrid electronics manufacturing. ImageXpert will hold a class showing how to optimize an inkjet printing process for electronic or functional manufacturing. This is a must-attend class for anyone wishing to develop and/or manufacture with inkjet printing. TracXon will discuss roll-to-roll (R2R) flexible hybrid electronics manufacturing, covering all steps from R2R printing to R2R assembly and testing. TracXon has robust expertise here, given their own work with R2R screen printing, R2R sintering/curing, and assembly. Printed Electronics Ltd will hold a class covering all digital additive electronics manufacturing tools, from inkjet to aerosol to EHD printing and dispensing, and beyond. This is an excellent overview class for those wishing to apply digital methods to develop or manufacture electronics. Tours We also have several tours related to the theme of manufacturing. Fraunhofer IZM: This is an extremely popular tour, showcasing Fraunhofer IZM’s deep and wide capabilities and expertise in all aspects of advanced PCB and assembly technology, as well as in hybrid soft electronics, integrating electronics with soft substrates such as textiles. Inuru: This is a unique tour showcasing the world’s first and only printed OLED lighting factory. This is possibly the only facility worldwide dedicated to inkjet printing of thin and flexible OLED lighting. Quantica GmbH: Here, you can see the workshop and machinery of Quantica, who offers jetting heads for high-viscosity digital printing of electronics. This is a much-needed technology that promises to break the limits of inkjet printing, making digital functional printing finally a versatile production method. Exhibition Of course, the exhibition is the key place where you can find partners across the entire value chain, including equipment manufacturers, ink and paste formulators, printing houses, and more. This is the place to visit if you intend to develop, prototype, or manufacture with printed and/or flexible hybrid electronics. There will be over 80 exhibitors from around the world. You can see the floor plan and learn about the exhibitors here .

In this newsletter, you can learn about the following technologies. We will have the opportunity to download the full slides. ISC Konstanz - Screen-printed Cu-pastes for highly efficient back-contact silicon solar cells Oxford Suzhou - Efficient and Stable Inverted Perovskite Solar Cell with modified Al as a Cathode OE Technologies - Roll2Roll High-Volume Manufacturing of OPVs Perovskia Solar AG - Perovskite solar cells for low-light applications   The Future of Electronics RESHAPED Europe is the flagship TechBlick event. This event will take place at the Estrel Hotel and Convention Center (ECC) in Berlin on 23-24 October 2024 . Explore the preliminary agenda here. 1. Screen-printed Cu-pastes for highly efficient back-contact silicon solar cells ISC Konstanz  |  March 2022 Screen printed Cu-pastes for high efficient back-contact silicon solar cells? In this slide deck you can learn about: ✅Accelerated growth of photovoltaics ✅Market growth of PVs and impact on silver consumption ✅Benefits of Copper vs Silver ✅Requirements for Cu based metallization ✅Properties of copper ink from Copprint ✅Back contact solar cells: ISC’s ZEBRA cell ✅Replacement of Bus Bars in ZEBRA ✅Line resistance Cu busbars ✅Results cell IV characteristic ✅Peel force results: soldering and ECA ✅Climate chamber tests ✅Thermal cycling results ✅Damp heat results ✅Conclusion and Outlook Download Presentation Slides 2. Efficient and Stable Inverted Perovskite Solar Cell with modified Al as a Cathode Oxford Suzhou  |  JAN 2024 Efficient and Stable Inverted Perovskite Solar Cell with modified Al as a Cathode? In this slide deck you will learn about: ✅Inverted Perovskite Solar Cells ✅Inverted Perovskite Solar Cells with Al as cathode ✅Characterization of TOASiW12/Al interface ✅Performance of the inverted PVSCs ✅Air stability the inverted PVSCs ✅Chemical reactions between perovskite and Al ✅In-situ optical microscope images ✅Conclusion Download Presentation Slides 3. Roll2Roll High-Volume Manufacturing of OPVs OE Technologies  |  JAN 2024 Roll2Roll High-Volume Manufacturing of OPVs? In this slide deck , you can learn about ✅R2R process flow ✅R2R Printed OPVs | Smart Manufacturing ✅Automated Coating Station & Vision System ✅In-Line Metrology & Quality Control tools ✅Design and Result Collection ✅OET’s R2R Printed OPVs Manufacturing ✅World’s 1st R2R Automated Manufacturing Line for IPVs (Integrated OPVs) ✅BI(O)PV [Building Integrated OPV] PILOT DEMONSTRATION SITES ✅Agri(O)PV PILOT DEMONSTRATION SITES ✅VI (O)PV PILOT DEMONSTRATION SITES ✅Towards GigaFactory Download Presentation Slides 4. Perovskite solar cells for low-light applications Perovskia Solar AG  |  DEC 2022 Inkjet printed perovskite solar cells? In these slides you can learn from: ✅The Technology ✅Indoor energy harvesting ✅Design Freedom ✅World's first self-charging health tracker ✅Electrical specifications and data ✅Technical developments ✅Damp heat test ✅Sun illumination test including under 11K Lux ✅Production facility Download Presentation Slides