Flexible printed circuit boards (FPCs) have found uses in a wide variety of applications, including health/wellness, mobile devices, aerospace and many more. Conventional FPCs consist of copper patterns formed on the surface of a flexible film using standard printed circuit board fabrication processes. Historically, polyimide resin (PI) has been widely used because it is readily available and possesses heat-resistant property which make it compatible with high volume assembly processes like solder reflow. However, new applications and device designs like wearables are driving the development of more conformable circuits. Stiff, high-modulus films such as polyimide are not suitable for these products and currently available pliable, low modulus films like thermoplastic polyurethane (TPU) are not compatible with surface mount assembly processes. Researchers at Panasonic Electronic Materials are developing a new material technology that overcomes the limitations of conventional FPCs. In this presentation, we will introduce our novel ultra-pliable circuit board material development.
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