Join the the Future of Electronics RESHAPED USA conference and exhibition in Boston (11 & 12 June) - Where the global Additive and 3D Electronics industry connects.
No other event in the world offers a deeper, more immersive experience in Additive, Sustainable, Hybrid, and 3D Electronics than TechBlick's Electronics RESHAPED event.
Don't miss this opportunity to connect, learn, and RESHAPE the Future of Electronics, making it Additive, Sustainable, Hybrid, Wearable or 3D.
Register before 9 May before the next early bird expires
Conference Agenda
You can explore the full agenda here
Rochester Institute of Technology | On-Demand Jetting of Molten Metal Droplets for Power Electronics Applications
09:15:00, 2025-06-11
Denis Cormier, United States
Spark Biomedical | Wearable flexible circuit for Women's health
09:15:00, 2025-06-11
Alejandro Covalin United States
University of Maryland | High temperature Copper inks with oxidation and corrosion resistance
09:15:00, 2025-06-11
Shenqiang Ren, United States
Human Systems Integration, Inc. | Physiological Monitoring Garment for Air Crew Applications*
09:35:00, 2025-06-11
Brian Farrell, United States
NASA (Goddard Space Flight Center) | 3D Printed Electronics for space flight missions
09:35:00, 2025-06-11
Margaret H Samuels, United States
Priways | Air-stable cupper-nickel complex inks for Printed Electronics
09:35:00, 2025-06-11
Dr. Takeo Minari, Japan
Boeing Research & Technology | Advancements in metallic particle development for next-generation printed electronics applications
09:55:00, 2025-06-11
John D. Williams, United States
GE HealthCare Technology | Disposable, Adjustable Clinical Grade Vital Sign Monitoring Systems*
09:55:00, 2025-06-11
Azar Alizadeh, USA
Ames Goldsmith | Advancements in metallic particle development for next-generation printed electronics applications.
09:55:00, 2025-06-11
Daniel Lacorte, United States
Heraeus Electronics | Limitations of future wearable/medical trends and their development hurdles: A paste supplier’s perspective
10:15:00, 2025-06-11
Ryan Banfield, United States
Creative Materials Inc. | Skin Interface Materials: Impact on Signal Quality for ECG
10:15:00, 2025-06-11
Matthew Ganslaw, United States
Essemtec | Hybrid Electronics: Industrial Pick and Place on Flexible and Soft Substrates
10:15:00, 2025-06-11
Networking Break |
10:35:00, 2025-06-11
Epicore Biosystem | Wearable Sensors for Hydration Monitoring
11:25:00, 2025-06-11
Alexander Aranyosi, USA
Brewer Science | Building Circuits from the Ground Up: Materials Innovation for Additive Electronics
11:25:00, 2025-06-11
Adam Scotch, United States
HRL Laboratories LLC | Additively manufactured ceramic interposers with curved vias
11:25:00, 2025-06-11
Tobias A. Schaedler, United States
NovaCentrix | Ink Technology: Copper, Gold, Silver Across All Printing Techniques*
11:45:00, 2025-06-11
Rudy Ghosh, United States
VTT | Speeding up printed electronics medical device piloting
11:45:00, 2025-06-11
Paavola Juho, Finland
Notion Systems | Scaling Innovations: Industrial Electronics Manufacturing via Inkjet and EHD Printing
11:45:00, 2025-06-11
Max Mosberg, United States
GlucoModicum | Accurate and needle-free Continuous glucose monitoring enabled by MHD technology
12:05:00, 2025-06-11
Alejandro Garcia Perez, Finland
Nagase ChemteX | Next-Gen Stretchable Conductive Ink Technology
12:25:00, 2025-06-11
Alan Brown, United States
Irisi Light Technologies | Printed opto-electronic devices based on nanomaterial semiconductor inks
12:05:00, 2025-06-11
Chad Husko, United States
Dracula Technologies | Organic Photovoltaic Cells and Modules for Harvesting Indoor Light to Power IoT Devices – Upscaling and Long-Term Stability
12:05:00, 2025-06-11
Sadok Ben Dkhil, France
C-Ink | Recent progress in metal nanoink for inkjet using pi-junction metal nanoparticles
12:25:00, 2025-06-11
Masa Kanehara, Japan
Panacol-Elosol | Advanced Bonding Technologies for Flexible Substrates and Electronic Devices
12:25:00, 2025-06-11
Lena Reinke, Germany
Lunch Break
12:45:00, 2025-06-11
AmbAI | Bridging Worlds: How Ambient IoT is Creating the Critical Connection Between AI and the Physical Environment
09:20:00, 2025-06-12
Steve Statler, United States
AION Biosystems | Continuous wearable monitoring patches*
09:20:00, 2025-06-12
Chanel Manzanillo,United States
Jones Healthcare Group | Improving Medication Adherence with Intelligent Packaging
09:40:00, 2025-06-12
James Lee, Canada
Linxens | Accelerating development of Electronic Skin Patches and wearable sensors for medical applications
09:40:00, 2025-06-12
Alix Joseph, France
SPGPrints | Next-generation Rotary Screen Printing for printed electronics
10:00:00, 2025-06-12
Tom Overgoor, Netherlands
Policrom Screens Spa | Innovation in TPU
10:00:00, 2025-06-12
Giorgio Vavassori Bisutti, United States
Fedrigoni Group | Upscaling to R2R mass production of Recyclable Printed Electronics on Paper
10:20:00, 2025-06-12
Victor Thenot, France
NGK Insulators | Ultra-thin and safe Li-ion rechargeable battery suitable for medical/healthcare wearables
10:20:00, 2025-06-12
Masahiro Furukawa, Japan
Networking Break |
10:40:00, 2025-06-12
Worcester Polytechnic Institute | Printed Stretchable Electronics and Sensors Towards a Multimodal Glove and Sleeve Human Machine Interface
11:30:00, 2025-06-12
Pratap Rao, United States
3DFlexible | Advancing conformal circuit printing with AM-modified 5-axis CNCs
11:30:00, 2025-06-12
Victor Yun, nan
Artimus Robotics | Flexible Electrohydraulic Actuators for the Future of Motion
11:50:00, 2025-06-12
Eric Acome, USA
CRM Group | Electronics Printed on 3D Objects for Heavy Industry and Harsh Environments
11:50:00, 2025-06-12
Philippe Guaino, Belgium
Raytheon | An RTX Business | Printed Hybrid Electronics Manufacturing: High Power Electronics Packages*
12:10:00, 2025-06-12
Daniel Hines, USA
Nautilus Defense | Textile-chiplet integration and the path to building impactful systems at scale
12:10:00, 2025-06-12
Jim Owens, United States
Lunch Break | Lunch Break
12:30:00, 2025-06-12
East West Manufacturing | Printed Wearable Sensors At Scale: How To Commercially Succeed?*
13:30:00, 2025-06-12
Nextflex | State of the Art in Additive Hybrid Electronics by NextFlex and its Partners
13:30:00, 2025-06-12
Fabian Schnegg, United States
Mass General Research Institute | EEGs and MRI measurements with printed electronics solutions*
13:50:00, 2025-06-12
Giorgio Bonmassar, USA
DEVCOM Army Research Lab | Convergent Manufacturing of Electronics for High-G Environments*
13:50:00, 2025-06-12
Harvey Tsang, United States
PebbleSense | Sensing mats for continuous pressure ulcer monitoring
14:10:00, 2025-06-12
Luthfun Nessa, United Kingdom
Iowa State University | Advancing manufacturing readiness of aerosol jet printing for conformal electronics
14:10:00, 2025-06-12
Ethan Secor, United States
Networking Break | Break
14:30:00, 2025-06-12
Eink |
15:00:00, 2025-06-12
Edzer Huitema, United States
Massachusetts Institute of Technology | Photopatternable, Performant, Degradable Polyimides for Reprocessible Multilayered Electronic Circuits
15:00:00, 2025-06-12
Thomas J. Wallin, United States
New Mexico State University | Magnetic Field Patterning of Nickel Nanostructures using Precursor Ink
15:20:00, 2025-06-12
Chaitanya Mahajan, United States
Vibrantz Technologies | Resistive Inks for High-Temperature Applications on Low-Thermal Expansion Substrates
15:40:00, 2025-06-12
Vlad Domnich, United States
Register before 9 May before the next early bird expires
Masterclasses
You can explore the masterclass program here
Printed Electronics Ltd | Digital Additive Manufacturing of Electronics: Inkjet, Aerosol, EHD Printing, Microdispensing and Beyond*
Kodak | Technologies for High-Resolution R2R Manufacturing*
TaktoTek | In-Mold Electronics Design: A Mechanical Perspective
Holst Centre | An Overview of Solutions for the Mass Transfer of Microcomponents.
Copprint | Copper Inks Usage, Formulations and Applications
MacDermid Alpha | Interconnect technologies for flexible hybrid stretchable electronics: from conductive adhesives to low-T solder
VTT | How to scale up (and not screw up) printed electronics enabled wearable device piloting
Fraunhofer IZM | E-Textiles: Integration techniques
Exhibition Floor
The show is accompanied by a dynamic exhibition showcasing the most important developments from across the globe in the world of additive, sustainable, hybrid, wearable, and 3D electronics.
You can learn more here
Register before 9 May before the next early bird expires
Essemtec, a Nano Dimension Division
Henkel
Notion Systems
Heraeus Electronics
Voltera
Nagase ChemteX
Silver
NovaCentrix
Priways
Armor Smart Films
NGK Insulators LTD.
Policrom
Ercon
Sumitomo Metal Mining
SPGPrints
Creative Materials Inc.
NanoPrintek
Intellivation LLC
Linxens
INO, d.o.o., Žiri
Hummink
Akoneer
Sun Chemical
Coatema
Panacol
VTT
XTPL
Ames Goldsmith
CondAlign
Brewer Science
ImageXpert
Conductive Technologies
ACI Materials
Kimoto
East West Manufacturing, LLC
Sefar
SunRay Scientific
Eastman Kodak Company
Holst Centre
Fuji Corporation
Standard
Hochuen Group
Technic, Inc.
NBC Meshtec
AilArain Ltd
THIEME
NanoIntegris Technologies
GOT Interface
Komori America Corporation
Lisat Pte Ltd.
MicroScreen, LLC
Nuovo Film Inc.
Xenon
FlackTek
VFP Ink Technologies
Copprint
RH Solutions LLC
Fraunhofer IFAM
Advanced Printed Electronic Solutions
BotFactory
Saralon
Arkema
National Research Council Canada
Coveme Spa
nsm Norbert Schläfli AG
Metalor Technologies USA
Agfa
Joanneum Research
Brilliant Matters
Soon to be Exhibitor
Fedrigoni
Fujikura Kasei
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