Speaker: Franz Vollmann | Company: Heraeus | Date: 12-13 October 2022 | Full Presentation
Heraeus has in-house developed a full system solution consisting of particle-free metal inks, equipment and processes for the selective coating of semiconductor packages. Large scale inkjet printing and photonic curing on 300mm wafer frames has become a reality. Experience the advantages of this solution such as design freedom, material efficiency, high print accuracy and many more in various applications ranging from EMI shielding to metallization or plating replacement.
Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs)
portfolio of expert led masterclass year-round platform
And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor.
To learn more visit
https://www.techblick.com/electronicsreshaped
To see feedback about previous event see https://www.techblick.com/events-agenda
Comments