This newsletter provides an overview of printed, flexible, and hybrid electronics, addressing critical challenges in commercialization, material performance, and process scalability. Discussions on In-Mold Electronics (IME) highlight the current status of screen printing technologies, substrate material limitations, and ink formulation challenges. Insights into highly bendable oxide TFTs demonstrate significant progress in mechanical durability, stress simulation, and wearable sensor integration. Further, the exploration of reliability frameworks for scalable FHE manufacturing emphasizes the importance of data-driven optimization and failure mode analysis.
The latest developments in conductive adhesives also present a step-change in component bonding for FHE applications, introducing room-temperature processing solutions that improve efficiency and reduce material constraints. By bridging research, industry expertise, and application-driven insights, these discussions contribute to the ongoing evolution of next-generation electronics manufacturing.
InMold Electronics (IME) Panel | State-of-the-Art Talks| Advancing Screen Printing Across Industries
Clayens NP | Plastronics - A Short Introduction
Toppan | Highly bendable oxide TFT withstanding over one million bending cycles
Bayflex Solutions | Accelerating FHE at scale with commercial grade reliability data frameworks
CondAlign | Enabling Room Temperature Electronics Bonding In FHE Applications, Addressing Sustainability and Cost
The Future of Electronics RESHAPED USA is TechBlick's premier event, showcasing the latest innovations in electronics. Join us at UMass Boston on June 11-12, 2025 for an exciting exploration of emerging technologies. You can find more details on the event website here.
EARLY BIRD rates are available now
InMold Electronics (IME) Panel
Screen printing remains a cornerstone technology in printed electronics, and its future depends on close collaboration among industry leaders. This panel brings together experts with over 100 years of combined experience to explore the latest breakthroughs in screen printing across various applications.
Featured Speakers & Topics:
Antti Keränen, CTO at Tactotek - Status of IME process and roadblocks to commercialization
Dirk Pophusen from Covestro focusing on status, challenges, and open questions for IME substrates [film aspects]
Marius Nolte Covestro focusing on status, challenges, and open questions for IME substrates [resin aspects]
Rahul Raut, Director, Strategy and Technology Acquisition at MacDermid Alpha Electronics Solutions - Ink portfolio challenges and status for complex IME products
Robert Boks, Director Global Business Development Panacol-Elosol GmbH - Status and challenges of component attached in IME environment and on 3D shapes
This interactive session is designed not just to present technical advancements, but to foster meaningful discussions, networking, and knowledge sharing among key stakeholders.
Learn how collaboration is shaping the next era of screen printing.
This workshop is co-located with our panel on In-Mold Electronics, offering a unique opportunity to explore complementary technologies.
Clayens NP | Plastronics - A Short Introduction
Didier Muller
Plastronics is a new branch of the electronics industry, setting the electronic circuitry directly at the surface of plastic parts, or inside its structure. The different processes of the plastronics (LDS, 2K molding, IME, …) gives possibilities to designers and engineers, depending upon the kind of application: antenna, HMI, lighting, sensors, … For customers and users, it permits new experience: surfaces, shapes, aspects, ….After highlighting some key manufacturing processes and their possibilities and limits, this presentation will show potential or existing applications. As a conclusion, we will raise some key challenges and hard points the plastronics is facing, such standardization, recycling, …
Key Takeaways:
Why Plastronics? Unlocking design freedom and optimizing fabrication
Applications & Needs The role of integrated functions
Technologies in Focus Rigid substrates, 3D-MID, and in-mold electronics
Design Challenges Track layout complexities and chip placement
Toppan | Highly bendable oxide TFT withstanding over one million bending cycles
Manabu Ito
Our IGZO TFT with organic/inorganic hybrid dielectric layer can withstand one million bending tests at a bending radius of 1mm without employing the neutral plane concept.
Applications for wearable motion sensors are also demonstrated.
Key Discussion Points:
Approaches to Flexible TFT Design – A look at various methods for achieving flexibility in TFTs.
Organic TFTs at Toppan – Insights into the electrical characteristics of printed organic TFTs.
Hybrid Type TFT Structure – How Toppan’s hybrid approach enables extreme flexibility.
Stress Simulation & Performance – Using Finite Element Method (FEM) simulations to analyze stress and predict performance.
Impact of Bending on TFTs – How bending affects electrical performance and long-term reliability.
Wearable Sensor Applications – Demonstration of motion-sensing technology, including the detection of swallowing movements.
Join us on 22-23 October 2025 in Berlin, Germany, for Perovskite Connect—co-located with The Future of Electronics RESHAPED. This conference and exhibition bring together the global perovskite industry to discuss the latest technological advancements, commercial breakthroughs, and emerging collaborations. Stay ahead of the curve as new ideas, projects, and ecosystems take shape.
Explore the agenda here.
Bayflex Solutions | Accelerating FHE at scale with commercial grade reliability data frameworks
Eisuke Tsuyuzaki
Scaling Flexible Hybrid Electronics (FHE) comes with a unique set of challenges, engineers are expected to solve increasingly complex problems with fewer resources. This session will explore the key obstacles in the field and practical strategies to balance reliability, material costs, and investment while ensuring scalability.
Key Discussion Points:
Common Challenges in FHE Engineering – Addressing the pressure to do more with less, both from a technical and business perspective.
Finding the Right Balance – How to navigate the trade-offs between reliability performance, material costs, and capital investment when scaling up.
Data Preparedness in FHE – Where does your organization stand in terms of data-driven decision-making and predictive insights?
Why Reliability Data Matters – The role of comprehensive data collection systems in improving performance tracking, identifying failure modes, and optimizing mechanical motions.
Bayflex Solutions combines real-world data with software assessments to provide deeper reliability insights, because, as they say, “You can’t improve what you can’t measure.”
CondAlign | Enabling Room Temperature Electronics Bonding In FHE Applications, Addressing Sustainability and Cost
Salvatore Micali
CondAlign is an innovative technology company that has patented and developed a new range of adhesive anisotropic conductive films (ACFs), to enable efficient components bonding for the flexible and hybrid electronics (FHE) industry. This new ACF named E-Align, provides excellent electrical and mechanical bonding performances, in particular to bond electronic components to flexible and rigid substrates.This ACF comes in the form of a double-sided tape, and it doesn’t require any post curing process. Its application process is also very simple, considering that doesn’t require any high pressure (typical bonding pressure is ca 0,1 – 0,3 MPa) or heat (it can be bonded at room temperature).Through these unique characteristics, the E-Align ACF has the ambition of simplifying the entire electronic production and assembly process, increasing efficiency and reducing costs.Presentation content In this presentation, CondAlign will start with an introduction of the technology principles behind the products development, will then provide an overview of the characteristics of the different ACF products already available in the market and the others under qualification, and will finally conclude with different examples of successful end user applications, where the E-Align ACF products enable sustainable and cost-efficient electronic bonding of different products for distinct industries. Examples of applications are the following: bonding printed batteries to printed IOT platforms for logistic and inventory tracking solutions, bonding flexible displays to flex-tails, bonding skin patches to wearable electronic medical devices, etc.
The Future of Electronics RESHAPED USA. Mark your calendars for June 11-12, 2025, and join us at UMass Boston to explore the forefront of emerging technologies. Full event details are available on our website [here].
Take advantage of our EARLY BIRD rates. Don’t miss the chance to save your spot at this must-attend event! Register here
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