Speaker: Chisato Oyama | Company: Komori Corp | Date: 24-Jun-22 | Full Presentation
We examined to utilize the gravure offset printing method to print high-precision micro bumps with various pastes.
For the flux paste, the precision of the printing position was ±5 μm on a 300 mm wafer.
We have also tried to print and reflow the solder paste.
Printing and reflow have been successful with minimum diameter of 6 μm and 15 μm, respectively.
We will report the details on the day.
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