TechBlick The Future of Electronics RESHAPED - Why You Should Join Us.
23 & 24 October 2024 | Berlin, Germany
TechBlick have prepared a world-class agenda for you, featuring over 70 superb invited talks, 12 industry- or expert-led masterclasses, 4 tours, and over 80 onsite exhibitors. You can explore the full program here.
In this article series, we highlight various talks in the program, outlining the technologies and applications that will be showcased.
In this article, we discuss the theme of Additive and 3D Electronics, highlighting talks, masterclasses and tours from the likes of Airbus, Semikron Danfoss, Ceradrop, NeoTech AMT GmbH, Hasselt University, Karlsruhe Institute of Technology, Hahn-Schickard Institute, PERC, Binghamton University, University of Texas El Paso, Tecnalia.
Note that this is the second article on the theme of Additive and 3D Electronics. In the previous article, we highlighted contributions from the European Space Agency, Yole Group, Decathlon, LPKF Laser & Electronics, Exxelia Micropen, Fuji Corp, Elephant, Nano OPS, Notion Systems, and Henkel and Tecna-Print, Printed Electronics Ltd, ImageXpert, Quantica.
Airbus will share their findings on the durability of 3D printed and hybrid electronics under aeronautic conditions. The motivation here is the direct integration of electronics on composite structures. In this case, flexible hybrid electronics embedded in TPU foils are integrated on aeronautic composite coupons. In this study, the durability of these devices is investigated. In parallel, test results on the durability of additively manufactured electronics are also presented. This is an important theme as there is a lack of information on such topics today.
Semikron Danfoss: For users and designers, the landscape for additive electronics is complex, given the breadth of materials and princess. Here a classification is presented from the perspective of the application, helping the user identify useful tools, methods and materials which are needed for simple or very complex AME projects. This is an important project that will help users, designers, hard- and software vendors - also those from outside the AME industry- to benefit from this discussion and launch project. This is an important contribution in lowering barriers to commercial adoption.
Ceradrop: This is a talk focused on enabling industrialization with digital printed electronics processes. This is an important theme since many applications are transitioning from prototyping to mass production, and often find that the transition is not very straightforward. Ceradrop will present how their equipment solutions enable a seamless transition, and in doing so will highlight specific use cases.
Neotech AMT GmbH: This talk focuses on the fundamental technology combining free-form, 5-axis 3D printing of mechanical and electronic components, Surface Mount Device (SMD) placement and pre- and post-processing techniques. This is an advanced form of 3D printed electronic technology, offering design freedom, local production, as well as opportunities to create sustainable mechatronic systems. In this talk, you will also learn about the specific use case of a 3D-printed lighting product.
PERC: In this talk, by one of the most important centers for printed electronics R&D in the US, you will learn about Additive Manufacturing for Advanced Microwave and RF Applications. This talk addresses all the key challenges in additive manufacturing of high-frequency electronics including including UV curable low-loss dielectric, resistive, and ferroelectric inks. Furthermore, the talk will present examples of additive packaging including, design, fabrication, and characterization of a non-planar multi-material MMIC structure as well as bare-die integration and tunable Frequency Selective Surface (FSS) based filters, wearable metasurface filters, and printed connectors
University of Texas El Paso: This is an important research direction which integrates functional content in mass-customized structures, thus creating true 3D-printed electronics. Here the underlying technology developments are reviewed and the presentation will also outline specific examples of multi-process 3D printing for creating structures with consumer-anatomy-specific wearable electronics, electromechanical actuation, and electromagnetics in ceramic structures.
Hahn-Schickard Institute: In this talk, a hybrid printing system is introduced. Here the polymer/dielectric substrates can be directly printed from FFF technology. The StarJet technology is directly integrated into the 3D printing system as the 2nd extruder which prints the bulk metal (e.g. SAC305 solder) through digital and non-contact deposition of the molten metal droplets or Jet. This technique achieves bulk electrical conductivity, conformal printing, no pre- and post-treatment, and high compatibility on flexible substrates due to solvent-free printing. Furthermore, when the bulk solder (e.g. Tin silver copper alloy) is used for the molten metal printing, the SMD components can be directly soldered and bonded onto the large-area flexible substrates, eliminating the troublesome solder reflow process. This is an innovative technology addressing many traditional technology shortcomings in 3D printed electronics.
Karlsruhe Institute of Technology: This talk presents a novel Aerosol-on-Demand (AoD) jet-printing system which overcomes issues of traditional digital printing of electronics. Here, the aerosol is generated from a point-like source within the printhead and is then hydrodynamically focused, enabling one to achieve the printing of discontinuous microstructures without ink loss and the need for a shutter. This novel system holds great promise for 2D, 2.5D, and 3D electronics printing with aerosol.
Tecnalia Research & Innovation: This talk focuses on composite functionalization via printing, adding even more value to fibre-reinforced plastics. You can learn how advances in printing and manufacturing technologies enable the integration of electronic functionality onto composites without compromising their properties. You can learn about processes, materials, and specific demonstrators.
Hasselt University: This talk focuses on thermoformed 3D electronics. Here, the study reports on the process of screen printing of conductive Ag-based inks on different 2D foils and the subsequent thermoforming of the same to achieve 3D circuit layers on which, afterwards, rigid electronics can be placed via the use of pick-and-place and conductive adhesives. The process and the different foils and inks are discussed in detail in this work.
Exhibition
Of course, the exhibition is the key place where you can find partners across the entire value chain, including equipment manufacturers, ink and paste formulators, print houses, and more. There will be over 80 exhibitors from around the world. You can see the floor plan and learn about the exhibitors here.
At the exhibition, you will also meet many key players developing equipment, materials and services for additive (digital) and 3D electronic printing. Such exhibitors include: Notion Systems, Voltera, Heraeus Printed Electronics, ImageXpert, Printed Electronics Limited, IDS, Hummink, Fuji, MAAS, Neotech AMT, Nano Ops, Quantica, SüssMicrotec, XTPL, Atlant 3D, Ceradrop, DoMicro, Exxelia, Teca Print, and PrintedUp Institute, BotFactory, and more.
Some companies offering digital and/or 3D-printed electronics
Notion Systems Voltera Heraeus Printed Electronics ImageXpert PEL IDS Hummink Fuji MAAS Neotech AMT Nano Ops Quantica SüssMicrotec XTPL Atlant 3D Ceradrop DoMicro Exxelia Teca Print PrintedUp Institute BotFactory |  |
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