How lasers help in MicroLED display production? One of the biggest manufacturing challenges in uLED display production is the transfer step given the speed and yield requirements. As shown in the slides below by Oliver Haupt from Coherent Inc., lasers can play an important role in this step, both when all three colors (R G B) microLEDs and also when only blue microLEDs need to be transferred.
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The process flow for both cases is shown below. In case of RGB MicroLEDs, first a temporary carrier is attached to the sapphire substrate on which GaN uLEDs are grown. Laser Lift Off (LLO) is deployed to de-bond the sapphire substrate, releasing the carrier wafer with the detached GaN microLEDs. Next, controlled UV spots are used to release the individual microLEDs onto the final substrate holding the TFT active backplane layers. These process can be repeated three times, each time for a different uLED color. In all steps, of course, excellent and optimized control of the laser profile/parameters in harmony with the right adhesive material properties are required.
In the case of blue-only microLEDs, the final backplane substrate is brought into contact with the GaN sapphire substrate. The GaN uLEDs transfer to the final substrate via the LLO process. Three color capability is then achieved by color conversation, e.g., QDs or small-sized phosphors
The results show the example of microLED RGVB transfer. The parameters are shown in the slide including microLED size, pitch, laser energy density, donor-receiver distance, etc. It can be shown that a different color is transferred with each shot. Thus, in three shots all R G B microLEDs are placed at the right spot! As the subset in slide 2 shows, the laser can in each step/shot process an area of roughly 2.83cm2.
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#microLED #quantumdot #laser #sapphire #GaN #displays #displaytechnologies #liftoff #uv #backplane #activematrix
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