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Full Agenda: Future of Electronics RESHAPED Europe | Berlin | 23 & 24 October 2024


We are delighted to announce a fresh, cutting-edge and exciting agenda covering the entire spectrum of innovations, manufacturing, and applications.


We invite you to explore this agenda featuring 70+ speakers including the likes of Forvia, European Space Agency, Meta, Decathlon, Airbus, Air Force Research Laboratories, Fuji, Datwyler, Motherson Innovations, Würth Elektronik, Avery Dennison, LPKF, Marquardt, Louisenthal Papierfabrik, imec, NExtflex, and many others.


In addition, you can enjoy an exhibition floor featuring ca. 80 onsite exhibitors and network with over ca. 650 participants from around the world. 




Future of Electronics RESHAPED conference and exhibition focusing on sustainable, 3D, additive, printed, flexible electronics


Conference Agenda:

You can browse the agenda below.

For the most up-to-date version please refer to https://www.techblick.com/electronicsreshaped

23.OCT.2024 | Track 1

TechBlick | Welcome & Introduction

Forvia | Smart surfaces in automotive interiors*

European Space Agency | Unlocking the Future of Space Electronics with Advanced Manufacturing

Networking Break

Flexoo | Mass customization & mass production of Smart Sensors

Beckermus Technologies | Challenges of interconnections between chips and flex substrates

Avery Dennison Smartrac | Green Printing in the Digital Landscape - from fab to mass production

SPGPrints | The 3 C’s of de-risking industrialized Printed Electronics production

TU Eindhoven | The road ahead for integrated photonics

Lunch & Exhibition Break

Motherson Innovations | From Heating to Transparent Sensing to Lighting Elements in Smart Surfaces

Würth Elektronik Group | State of the art of the industrial stretchable PCB and its potential for future development

Metafas | InMold Electronics: Technical and Business Transition from Membrane Switches to 3D InMold Electronics*

Kimoto | Next-generation 3D Formable Substrates*

Exhibition & Refreshment Break

Marquardt GmbH | Printed electronics: why is it difficult to leave the ‘trough of disillusionment’?

Semikron Danfoss | Classifying Additive Electronic Manufacturing Technology: From 2D to 3D and From Simple to Complex System

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23.OCT.2024 | Track 2

BSC Computer / Momentive | Sustainable Motion based on Silicone 

X-Trodes | Soft electrode array for skin electro-physiology: New opportunities in sleep studies and rehabilitation

Creative Materials | Advances in Materials for Additively Manufactured Electronics Skin Patches

MacDermid Alpha Electronic Solutions | Novel substrates for InMold Electronics*

Printed Electronics Ltd | TBC

Lunch & Exhibition Break

DECATHLON | How Plastronic LDS process can reduce CO² emissions for Electronics devices

Horizon Microtechnologies | Hybrid Microfabrication by 3D printing and subsequent Coating for Electronics and Radio-Frequency Applications

LPKF Laser & Electronics | LPKF Laser & Electronics SE

Exxelia Micropen | Functionalization of Medical Devices Using Additive Dispense Technology

Exhibition & Refreshment Break

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23.OCT.2024 | Track 3

Fuji Corporation | New era of additive manufactured electronics with the integration of SMT process and machine.

Elephantec | Printed Electronics as sustainable solutions

Nano OPS | Fully Additive Manufacturing of Electronics at the Nano and Microscale for Making Active Components and Integrated Circuits

Notion Systems | Advancing Additive Processes into Electronics Mass Production - Breaking Boundaries One at a Time

Henkel | Advancing Pad Printable Solutions with Henkel Materials

Teca-Print | Advancing Pad Printable Solutions with Henkel Materials

Lunch & Exhibition Break imec | Sustainable Electronics: A detailed comparison of additive manufacturing and subtractive PCB processing*

Pragmatic Semiconductor | Bringing flexible intelligence to Medicine 3.0

Essemtec | Enhancing circular economy by facilitating the repair of electronic components

Jiva Materials Ltd | Fully recyclable PCB substrate


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24.OCT.2024 | Track 1

Binghamton University | Fabrication of Multi-Sensor Vital Sign Patches for Ambulatory Care*

NextFlex | Flexible Hybrid Electronics: Challenges in Technology Transition from Lab to Product

Ceradrop | TBC

Voltera | Multi-layer Printed Battery for Versatile Integration in Wearables, Medical Applications, Smart Packaging, Smart Sensors & more

Exhibition & Refreshment Break

Texavie | Empowering Personalized Therapy and Wellness Anywhere with Texavie’s MarsWear Smart Apparels

Danish Technological Institute | DTI Printed Electronics: On body eTextile sensors for physiological and neurological monitoring

Datwyler | Smart Elastomer based Sensors and Actuators

Nanoleq | Unique Sticky Dry Electrode for Innovative Textile Integration (reusable, washable, stretchable)

PROFACTOR | Concept for direct integration of electronic circuits and sensors on textiles using inkjet printing.

Lunch & Exhibition Break

Fuelium | Fit-To-Purpose batteries for responsible portable electronics.

Sungkyunkwan University | Sustainable Roll-to-Roll Printing Foundry for Realizing 4 Things: Internet of Things (IoT), Display of Things (DoT), Vision of Things (VoT), and Care of Things (CoT)

Papierfabrik Louisenthal GmbH | Large-scale fabrication of low-haze transparent metal mesh foils

AdapTronics | Thin-layer electro-adhesive gripper technology with printed flexible electronics*

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24.OCT.2024 | Track 2

Technische Hochschule Ingolstadt | Particle Free Copper Inks

Tesa | TBC

Air Force Research Laboratory | Liquid Metal Inks for Printed Stretchable Electronics

Ames Goldsmith | Advances in metallic particle development and manufacturing: impact on paste and final application

Exhibition & Refreshment Break

Coatema | Tech Pillars of the green hydrogen economy – how to scale the production methods for PEM Fuel cells from lab2fab.

Panacol | Adhesive Solutions for Perovskite-based and Organic Photovoltaic Applications

Fraunhofer ISE | Thinner than a human hair - fine line metallization for next-generation silicon solar cells

ISC Konstanz | Copper ink and electrically conductive adhesives for future PV production

FOM Technologies | The role of slot-die coating in the future of photovoltaics.

Lunch & Exhibition Break

University of Texas at El Paso | Additive Manufacturing of Elastomer, Ceramic and Metal Multi-functional Structures*

Hasselt University | ACT-3D_Assembly and Connection Technology for 3D plastic carriers

Hahn-Schickard Institute | Hybrid 3D printing of conductive bulk metal and dielectric polymer for sustainable and smart 3D electronics

Karlsruhe Institute of Technology | The Aerosol-on-Demand (AoD) jet-printing principle: a novel concept for 3D-printed electronics

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24.OCT.2024 | Track 3

Global Access Diagnostics (GADx) | Advancing Innovative Diagnostics for Global Health

Meta | Noninvasive Biopotential Sensors for Future Wearable Electronics

Nagase Chemtex | Recent Developments of Conductive Inks for Printed Electronics*

Exhibition & Refreshment Break

Hamamatsu Photonics | Thermal Laser Processes in Printed Electronics

PERC | Additive Manufacturing for Advanced Microwave and RF Applications

Sun Chemical | Biosensor Materials Requirements – Challenges and Opportunities

Airbus | 3D printed and hybrid electronics durability under aeronautic conditions

Neotech AMT | TBC Lunch & Exhibition Break

Alpha Micron | Liquid Crystal Smart Eyewear: How to achieve fastest tint-changing worldwide*

Light Tree Ventures Group | Large-area wearable LED light therapy*

PolyPhotonix | Saving Sight With OLED Light: Treatment for Diabetic Eye Disease*


 

Dynamic Exhibition Floor

The event includes a tabletop exhibition floor featuring over 80 exhibitors.

You can explore the confirmed exhibitors below.

The exhibition stands are ca.90% sold out out.


Future of Electronics RESHAPED conference and exhibition focusing on sustainable, 3D, additive, printed, flexible electronics

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