Pyramidal µLEDs, Indium Bump Deposition, InGaN-Based Red Micro-LEDs, Laser and LIFT, VCs
In this newsletter, you’ll learn about advancements in microLED technology, deeptech investment, laser-driven manufacturing, and cutting-edge microelectronics. You will also have the opportunity to download the full presentation slides.
Polar Light Technologies | Pyramidal µLEDs – a novel - bottom-up concept delivering focused light emission
Intlvac Thin Film | Indium Bump Deposition System
Kaust | Challenges in InGaN-Based Red Micro-LEDs Technology
Coherent | MicroLED Display Volume Manufacturing Enabled By Laser Technology
Imec.xpand | Opportunities and Challenges of Investing in Deeptech Startups
The MicroLED Connect conference and exhibition will take place next year at the High Tech Campus in Eindhoven on 24 & 25 Sept 2025. You can learn more here
This year this show will be co-located with our inaugural AR/VR Connect technology, covering all the key innovations in AR/VR display technology, from light engines to waveguides to optics.
EARLY BIRD rates are available until December 20, 2025 – secure your spot now!
Polar Light Technologies | Pyramidal µLEDs – a novel - bottom-up concept delivering focused light emission
Lisa Rullik | 2024
Our novel bottom-up concept based on InGaN/GaN uLEDs offers solutions to several challenges that the uLED development is facing right now, namely miniaturization of the die without efficiency droop, sufficient small pitch to reach FHD resolution, and focused light emission to reach sufficient incoupling efficiency into waveguide optics. By using selective area growth, the dies can be placed deterministically onto the lithographically patterned SiN-masked GaN templates and die sizes down to 300nm have been achieved. As no etching of the die itself is needed the efficiency of the InGaN quantum wells, which are the active emitters, stay intact. The geometic structure of the uLED, a hexagonal pyramid, facilitates the focused emission and a sub-lambertian emission was obtained.
In this presentation you will learn about the following:
Polar Light Technologies’ GaN/InGaN bottom-up approach without etching damage
Achieving RGB in the same material system
Focused light emission and sub-lambertian performance
Insights from the first hybridization prototypes
Intlvac Thin Film | Indium Bump Deposition System
Michael Chesaux | 2024
Producing indium bumps for interconnect is a technology that has had to adapt to an ever increasing demand for smaller bump size and high bump density while having to process larger and larger substrate sizes. This presentation discusses how indium bump fill and uniformity was optimized for substrates up to 200mm wafers. We demonstrate strategies to both prevent dendritic growth, to produce reliable bumps, and to eliminate indium spits, which can be a source of defects, without having to sacrifice tack time and reliability.
In this presentation you will learn about the following:
How we minimized pattern hole closure
How we improved bump quality by preventing dendritic growth
Prevention of spits
System stability and reliability
Indium bumps we produce
Kaust | Challenges in InGaN-Based Red Micro-LEDs Technology
Daisuke Iida | 2024
Micro-LEDs are promising for next-generation displays such as AR/VR. InGaN material can generate emissions in red, green, and blue. In the same material system, the LED devices can be stacked continuously, making it possible to fabricate monolithic RGB micro-LEDs on the same wafer. The low efficiency of red LEDs is the bottleneck for RGB micro-LED development. In this presentation, we will discuss the growth technology for InGaN-based red LEDs and the realization of monolithic RGB micro-LEDs.
In this presentation you will learn about the following:
Red LED growth technologies
Micro-LED fabrication technologies
Monolithic RGB micro-LEDs
LED Fabrication Technologies
Join us on December 11, 2024, for the FREE-TO-ATTTEND Printed Electronics & Display Innovation Day, a free online event by TechBlick and the MicroLED Association. Connect with industry leaders shaping the future of displays. View the agenda here.
Coherent | MicroLED Display Volume Manufacturing Enabled By Laser Technology
Oliver Haupt | 2024
Laser technologies are essential for display fabrication today. Several laser processes and laser types are required for state-of-the-art display manufacturing. With the move from OLED to microLED displays some processes remain and several new manufacturing processes are required. The success of microLED displays is mainly driven by costs and availability of volume manufacturing equipment. Thus, microLEDs must become very small and need to be processed with highest throughput and yield. Lasers have proven their capability already in many applications but also in display fabrication. In this presentation, we will provide an overview of the microLED display process chain and highlight the individual laser processes.
In this presentation, you’ll learn about Laser-driven mass transfer techniques like LIFT
The key steps in microLED manufacturing and how lasers drive innovation.
The critical role of laser mass transfer for microLED miniaturization.
Advanced laser applications like LTPS backplane annealing and beam delivery systems.
Imec.xpand | Opportunities and Challenges of Investing in Deeptech Startups
Cryil Vancura | 2024
Many aspects of today’s modern society are enabled by advances in semiconductor technologies. Most of those innovations have been driven by the incumbent corporates in the industry but some of them have come from ambitious startups globally. Despite the size of the market and the potential for key innovation, startups active in semiconductor technologies have often struggled to raise sufficient capital in the past decade, even in times when other sectors of the venture capital market have been very active. Since one to two years, though, we start to see a change in sentiment of venture capital investors towards semiconductor technology startups. This is driven by external market factors, such as the onset of artificial intelligence technology, driving global increase of data center traffic and compute performance, as well as geopolitical considerations and dependencies.imec.xpand is one of the world’s largest independent venture capital funds dedicated to early-stage semiconductor innovation. Since 2018 we have been investing in ambitious startups where the knowledge, expertise and infrastructure of imec, the world-renowned semiconductor and nanotechnology R&D center, can play a determining role in their growth. imec.xpand has an outspoken international mindset towards building disruptive global companies and strongly believes that sufficient funding from the start is key to future success. Our position gives us a unique view on the startup landscape in the sector, which we will share with the audience.
In this presentation, you’ll learn:
How imec's world-class infrastructure, brilliant minds, and global network enable disruptive ventures.
What venture capitalists look for, including team evaluation and market potential.
The importance of understanding the value chain, business models, and positioning in the market.
Strategies for building a competitive edge, from patents to speed and comprehensive approaches combining these elements.
Join us on December 11, 2024, for the FREE-TO-ATTTEND Printed Electronics & Display Innovation Day, a free online event by TechBlick and the MicroLED Association. Connect with industry leaders shaping the future of displays. View the agenda here.
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