Speaker: Malte von Krshiwoblozki | Company: Fraunhofer IZM | Date: 24-Jun-22 | Full Presentation
Fraunhofer IZM is an electronic packaging institute providing solutions for new electronics manufacturing. Fraunhofer IZM is focusing on miniaturization, new materials and new form factors for electronics.
Adhesive bonding for electronic textiles was developed and evolved at IZM during several projects. This pitch will introduce the technology that allows the assembly of electronic modules on textiles through creating an electrical and mechanical connection within the same process. Adhesive bonding allows the integration of any kind of PCB, flex PCB or stretchable electronics based module e.g sensor module, light module etc. into a textile circuit. Therefore, Fraunhofer IZM developed a prototype bonding machine with a working area of 1 by 1 m that is able to handle any kind of textile substrate. A hug variety of textile integrated conductors are supported by adhesive bonding, even insulated conductors if the insulation is thermoplastic.
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