top of page

Dupont Teijin Films | Polyester film solutions from DTF meeting changing needs in flexible electroni


This is an auto-transcriped version of the presentaiton without human control

Thank you. Yeah. I've looked forward here, too, to give you a blitz update on the developments we have done to films for flexible electronic. Applications. And we are a company which is a global company which has six manufacturing sites across the world as an R&D centre where I personally work in the UK northeast of of, of England. We've been a long time in developing films for the applications of flexible electronics with since the early nineties with test strips, batteries, membrane switches, flexible circuits, diffuser vector films. And you may wonder why actually, apart from being a choice for sustainability point of view these days, why we actually use it now briefly, it's because of our process really, or about by actual rotation process. With the process at the end, it gives us superior properties for chemical, electrical, mechanical and optical and but not to go too much of that. What I want to show you is the scale of the production. Here we are making from half a market to 500 mark on thick films with run rates from 20 to 3 millimetres a minute and on a line of nine meters wide, that gives you 21 2000 square meters a minute. That's a large scale, but this is all just offered at low cost but has repercussions for minimum order quantities, of course. Now many applications in the flexible electronics are rely on DTF dimensionally stabilized rates and become more and more common with development of low temperature shoulders. And and therefore we can move away from the high, more expensive high temperature resistant substrates. Also Polyamide we have a more superior polyester film which is PAN, which is mechanically stronger, higher processing temperature and better weather resistance. But basically this is where we are. We are in flexible context, but more so we are in it because we are we happen to be able to tailor our substrates to your specific needs by functions, fictionalizing it through modifying the properties of the bulk. We have multiple layers of different polymer grades or we can add treatments to to for functionalized surface. Now I would like to give you some, some some examples of this. And one of them is the third affordable thermal foldable pet for the Animal Electronics, which is used a lot in Amish for the automotive and medical applications, for example. And it replaces the incumbent polycarbonate films. The advantage of peat here is this is be much more chemical resistant and offers a better flex resistance than polycarbonate and yet meeting its for mobility performance. Then we have flame retardant parties. Bitch meeting victim zero, and we hope to get them on the market this year. Another more recent development for Flextronics is the inherent clean and defect free films, which are manufactured with a repeatable sacrificial layer which you peel off the substrate to where to leave it with a pristine, clean and smooth surface, which allows you applications which demand a very high resolution structure and therefore absolutely no defect whatsoever on the surface. But also and that's what's being more developed at the moment is a breakthrough for development of monolayer ultra barriers. And this leads us nicely into the Encapsulation Development Project, which is mainly driven by flexible PV applications, in particular at the moment. I'm going to that. What you see here is a a device, a pet with electrodes, and you build a device on that needs to be encapsulated by a substrate barrier substrate, which is a defect free substrate. You put a metal oxide on it. This metal oxide after it's been unpeeled, very clean, very smooth surface. So you get a very robust layer that after is being deposited. What we develop and that's very interesting, we put a protective liner on it, which could serve as an A capsule and if need be. And then what we can do too is actually add on the other side of the pet an abrasion resistant layer for OPV to be interesting because is often used outside and needs to be cleaned. So some abrasion would be handy there. Further, if it's exposed to nature, we can. I don't know. You have you have one minute. Yeah, that's absolutely perfect. At some UAV uses a hydraulic resistance to it, which makes it gives it a longer lifetime. It's been exposed. And further we can structure the surface with to maximize the minimize refraction and maximize the light capture of it. Now that is not just it. We can go further because usually these devices are encapsulated with these barriers. What we can do to is further enhance the the rationalisation of the applications in the industry by adding a making of a hybrid solution with a electrode layer on top of it, on top of the protective liner for which it needs to be capitalised because it's not suitable for directly electrode, it needs to be adapted and we can do that with a few solutions for that. And that will rationalise the design of an OPV module, for example, drastically. Okay. Well, that's really well, I'd like to say this is about the highlights which we have with the developments and we can take many of the challenges and we very much look forward to work with you to realise the potential of your own innovation. And I think even Room eight.

Comments


Subscribe for updates

Thank you!

bottom of page