In this issue, we dive into technologies shaping the future of printed electronics and additive electronics, smart buildings, and additive manufacturing. From optimizing tool chains for 3D printed electro-mechanical structures to exploring low-volume manufacturing techniques for printed circuit boards (PCBs), this edition showcases advancements and practical applications. Featured companies include Siemens, Murata Manufacturing, Henkel, and BotFactory, each presenting innovations that are redefining industries. Learn how additive manufacturing and advanced materials are driving efficiency and sustainability in electronics production and smart infrastructure.
Siemens | Optimizing the tool chain from Design through manufacturing for Printed Electronics
Printed Electronics Ltd | Scaling up From Idea to Product With The PEL Open-Access Printable Electronics Production Facility
Henkel - Laiier | Connecting surfaces of the smart building to the cloud with sensors enabled through PE
Murata Manufacturing | Highly Conductive MXene for Electronics
BotFactory | Exploring AM-PCBs for Low-Volume Manufacturing
The Future of Electronics RESHAPED USA is TechBlick's premier event, showcasing the latest innovations in electronics. Join us at UMass Boston on June 11-12, 2025 for an exciting exploration of emerging technologies. You can find more details on the event website here.
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Siemens | Optimizing the tool chain from Design through manufacturing for Printed Electronics
David Wiens | 2023
In this session, you will explore the following:
How printing and additive techniques enable innovative electronic architectures, including flexible, conformal, structural, and 3D designs.
A comparison of two design approaches: planar structures versus non-planar structures, along with the challenges each presents.
The tool chain required for 3D printed electro-mechanical structures, focusing on the key areas of development and optimization.
Printed Electronics Ltd | Scaling up From Idea to Product With The PEL Open-Access Printable Electronics Production Facility
Neil Chilton | 2024
For university spin-outs and startup companies, especially in the growing medical sector, it can be challenging to find a responsive production partner to scale up your idea from bench-scale to the small/mid volume production needed to gain investment and customers. PEL is an established manufacturing company with over 18 years’ experience in printable electronics. Here in the UK, we have an extremely well-equipped production facility that gives access to a multitude of printing methods including: high resolution screen printing, inkjet deposition, aerosol jet and viscous jet piezo jet deposition. Whilst some customers prefer to outsource their production entirely to us, we also engage with users who are keen to become manufacturers in the longer term – where they can be trained on the systems we sell and “try before they buy”. In this presentation we explain the capabilities and the training and support packages that PEL can offer.
Key takeaways from this session include:
Additive manufacturing of electronics – areas of expertise at PEL.
Screen printing excellence – featuring high-performance print platforms, including Micro-tec in the EU.
PEL's screen print offerings – covering printers, screens, inks, typical layers, and turnaround times.
Functional inkjet printing – a detailed example of our inkjet capabilities.
Aerosol jetting of bio-compatible carbon electrodes – collaboration with a UK university for disease-sensing applications.
Henkel - Laiier | Connecting surfaces of the smart building to the cloud with sensors enabled through PE
Matt Johnson - Laiier | Aad van der Spuij - Henkel | 2022
Step into smart buildings of the future and you might not see a difference. Combining the scalability of coatings and building materials contemporary sensing techniques opens-up an incredible range of possibilities for predictive, preventative, and responsive maintenance. For Henkel, a global leader in specialized and cross-functional ink formulations for printed electronics, and Laiier a smart surface technology provider, the next decade will see the rise of smart buildings that integrate new capabilities into the built environment. Whether it’s office facilities that warn of leaking pipes, walls that heat our rooms, or floors that tell us when an elderly relative has suffered a fall, many of the core technologies are already here. Today, the challenge besides the technology innovation is more about building networks and creating markets. The presentation will cover the unique ecosystem required to bring this vision to life that includes the whole value chain from construction, materials, manufacturing industry to IoT integrators. The session will take the attendees through technical explanations and customer use cases demonstrating clear ROIs and customer insights.
In this session, you will learn about: Retrofit Smart Skin: IoT monitoring through smart stickers and tape
Unique Selling Propositions: Leveraging printed electronics for installation, coverage, and resolution
Surface to Cloud™: Delivering real-time insights and alerts
Launch Use Cases: Measuring leaks and levels with "smart tape"
Reshaping Partnerships: Accelerating the path to implementation
Join us on February 11-12, 2024, for the Solid-State Battery Materials, a virtual event by TechBlick. Engage with industry leaders driving innovation in battery technology. Explore the agenda here.
Early Bird Offer: Register by December 24 and save 150 Euros with the discount code: Save150EurosSSB
Murata Manufacturing | Highly Conductive MXene for Electronics
Shun Sakaida | 2022
In this session, explore the potential of MXene (Ti3C2Tx) in electronics applications, with a focus on its high conductivity and environmental stability. Learn about the synthesis procedure for MXene and its ability to enhance components such as capacitors, EMI/ESD components, and SAW components. The session also covers:
Schematic Representation: Host–guest interaction for improved environmental stability
Humidity Test: Assessing the material's resistance to moisture
Anti-Swelling: Strategies to prevent material degradation and maintain performance
BotFactory | Exploring AM-PCBs for Low-Volume Manufacturing
Carlos Ospina | 2024
In this session, discover how Additive Manufacturing (AM) is transforming the production of Printed Circuit Boards (PCBs), enabling faster, more sustainable solutions for low-volume manufacturing. Learn about:
Reducing Lead Time: How AM reduces the production time of a 4-layer PCB from 10 days to just 4 hours.
Challenges of Traditional PCB Manufacturing: The inefficiencies of mass production for small runs.
Additive Manufacturing Technologies Matrix: Pros, cons, and how AM fits into low-volume PCB manufacturing.
Substrate-Based vs. Substrate-Less: An overview of these different approaches in AM-PCB production.
BotFactory’s Experience: Insights into the company's journey with AM-PCBs and the innovations they have implemented.
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