top of page

Demonstration of high frequency 5G modules using LTCC

Speaker: Brian Laughlin | Company: DuPont Microcircuit & Component Materials. | Date: 24-Jun-22 | Full Presentation


DuPont™ GreenTape™ 9KC Low-Temperature Co-fire Ceramic (LTCC) tape and silver (Ag) metallization was used to fabricate an antenna-in-package (AiP) radio frequency front end (RFFE) module operating at 28 GHz. DuPont collaborated with ITRI in Taiwan to design, fabricate, and test this AiP RFFE module which utilizes a Anokiwave phasor chipset and a 2x4 patch antenna array that gives >18 dBm Effective Isotropic Radiated Power (EIRP) while steering the radiated beam over ±35° with <1 ppm error vector magnitude (EVM) under 64 QAM modulation. This reference design is analogous to many use cases for 5G telecommunication deployment such as small cells and mmWave base stations where LTCC is a excellent material platform due to high reliability, superior thermal performance, and stable material performance at high frequency over all practical ambient conditions.


Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs)

portfolio of expert led masterclass year-round platform


And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor.


To learn more visit

https://www.techblick.com/electronicsreshaped


To see feedback about previous event see https://www.techblick.com/events-agenda





Bình luận


Subscribe for updates

Thank you!

bottom of page