In this newsletter, you can learn about the following technologies in the field of printed electronics, additive electronics and conductive inks and conductive pastes. We will have the opportunity to download the full slides.
Copprint | Conductive Copper Inks Enabling Sustainable PCBs and Printed Electronics
Namics Technologies Inc | Low-temperature sintering nano silver paste
Elantas | Overview Of ELANTAS High Potential Functional Inks And Application Cases
Celanese Micromax | Silver Sintering Pastes - Improved Bond Performance and Simplified Handling
ACI Materials | Breakthrough Conductivity and Sensing With Semi-Sintered Silver Ink
The Future of Electronics RESHAPED Europe is the flagship TechBlick event. This event will take place at the Estrel Hotel and Convention Center (ECC) in Berlin on 23-24 October 2024. Explore the preliminary agenda here.
1. Conductive Copper Inks Enabling Sustainable PCBs and Printed Electronics
Copprint | April 2024
In these slides you will learn about the following:
Background to the history behind calling PCBs "Printed" Circuit Boards
Example of the first printed conductive line
Printed proximity fuses in 1943!
Disadvantages of etched Cu
Advantages of printed copper for PCBs
Comparing printed silver vs printed copper
Application examples include RFID tags, IBC Si solar cells, greener double-sided PCBs with printed copper lines and vias
Benchmarking Copprint's screen printable copper inks on various substrates (PET, PC, FR4, PV, Glass, Aluminium PI, etc=vs other silver inks on the basis of conductivity vs sintering time.
2. Low-temperature sintering nano silver paste
Namics Technologies Inc | December 2022
In this presentation you will learn the following:
Low-temperature sintering pastes based on nanosilver
Technical features including sintering conditions, viscosity, printing width, resistivity, adhesion, thickness, flex test, shelf life, etc
Sinterability and conductivity of sintering paste vs conventional Ag pastes (comparing resistance and particle packing)
Flex resistance (resistance change with bending cycle with repeated bending at various radii of curvature)
Adhesion results on PC, PET, PI, CNT Film, ITO Film, etc
Screen printing results
Fineline printing (60um lines)
Reliability tests
Detailed application example: Heaters
Results of printed heaters (temperature vs voltage, uniformity, stability, etc)
3. Overview Of ELANTAS High Potential Functional Inks And Application Cases
Elantas | June 2023
In this presentation you can learn the following:
Printed heaters on 3D thermoformed smart surfaces made with InMold Electronics
Processing parameters and properties of various formable inks including silver, insulating and carbon inks
Results: Adjusting conductivity of heater inks with graphite loading
Screen printable inks (conductive + insulating) for HIGH TEMPERATURE applications on substrates like Kapton
4. Silver Sintering Pastes - Improved Bond Performance and Simplified Handling
Celanese Micromax | October 2023
In this presentation, you will learn about sintering pastes, especially for power electronic applications. In particular, you can learn the following:
A short introduction to wide bandgap semiconductors
SiC power inverters and how silver paste sintering is used on Si MOSFET power devices
Processing conditions from stencil printing to drying to sintering
Process flexibility including impacts of pressure, temperature, time, etc
Paste properties including solid content, viscosity, particle size, volume resistivity, thermal conductivity, etc
Cross-sectional SEM images of sintered surfaces
Reliability results and stability data
Working time on screen under various conditions
Properties after drying
5. Breakthrough Conductivity and Sensing With Semi-Sintered Silver Ink
ACI Materials | April 2024
In this presentation, you can learn about semi-sintered silver inks including:
Ability to use finer meshes with 20um openings
Application in additively manufactured PCBs as a replacement for etched Cu
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