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CondAlign | Adhesive ACF for efficient room temperature bonding in FHE | June 2022


This is an auto-transcribed version without human control

Fantastic. So thank you for the introduction. Lindbergh is my name Cornelis. It's a company based in Oslo making anisotropic conductive film. So what we provide is an electrical and mechanical interconnection by this adhesive anisotropic conductive film, which enables bonding at the room temperature and finger pressure. So no curing. You get the film from us in the form of a double sided tape, which you can bond your components with. With the the advantage with the film is that you retain the original polymer properties much better because we use much less conductive film fillers than in conventional conductive films. That is due to our on the line alignment process, which I'm not going to go into today. But also you have heard me before. I know about this this process. It's also enables a very flexible product design. In principle, it is material independent, as I said, which opens for development or tailor made application based products. So where are we today with the product pipeline? We are in the moment though qualifying and qualified qualify and verify the first time, which we call the line 100, which is the thickness of 100 micrometer. Also, the pitch between the conductive chains is also about 100 micrometer. Typical application areas which we work quite a lot with. The paper battery is coming up now smart labels connections with similar pad sizes, which is more than like in the area to hundred, about 200 micrometers, which is quite large for us. So I'll come back to to the sizes afterwards. This is in verification and is in the qualification product with several customers now. And we we expect to run this from our roll to roll line here in Oslo before the end of this year in in commercial quantities, which for us will say up to 10,000 square meters annually from our machine supply about that get will come from from OEM manufacturers that we contract next product in the light will be what we call new line 35 or 40 in that area. It's not completely defined yet. Pitch then will be in the area of 34 three micrometer thickness as well. And this is typically the applications with cheap bonding and other connection with the smaller pad sizes. This is next in line for the first product. I meant I mentioned the come then later this year or next year for future products, we're talking about 15 or something, 1050 micrometer thickness and pitch. So here you have a little about the pitch sizes. So this green, this is this area on the left side, the TEC one is a E line 100 with typical sizes as you see here, 200 by 2000 micrometer at the top thousand by 2300 by 600 400 by five. That's typical pad sizes for these applications. And we go up to the top right. You see that what we call the take two will be the second product, which then go more to typical ICI connections. And though not the right to see the the future applications are very high density and then we are actually talking about components of our micro LEDs and those small components down to like in the area of 20 micrometer by 20 micrometer. So manufacturing is a role. The role one production technology. I say multiple products and applications. The picture on the top right is actually our machine here in Oslo. And when you say the industrial production strategy is that we make interim production here in Oslo and qualify the processes, and we come up over to column two. It's contract manufacturing for for higher volumes. And we can also discuss licensing license manufacturing. If you are a high volume customer who want to include this process in your and your internal production lines down to the right, you see some very schematic picture of the process itself. Two words about the time we are then a company based in Oslo developing and making anisotropic conductive films. The product focus is, as I say, ICF, as I mentioned here, and we also use the same process technology for making thermal interface materials.

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