Daniel Slep, CEO
Dielectric materials play a critical role in modern electronics as they serve as insulators that prevent electrical charges from flowing between conductive parts. In recent years, significant advances have been made in the development of dielectric materials, driven by the demand for improved performance and efficiency in electronic devices. Novel methods have been developed for processing and integrating dielectric materials into electronic devices, including inkjet printing, plasma-enhanced chemical vapor deposition, and self-assembly techniques. These advances have enabled the fabrication of electronic devices with improved performance, reduced size, and lower power consumption. ChemCubed has adopted inkjet printing since it’s a promising technique for the fabrication of electronic devices due to its precision, versatility, and low cost. Together with our commercialized silver ink, we are able to print circuit boards with complex structures for electronic devices such as capacitors, sensors, and antennas, which have potential applications in diverse fields such as healthcare, energy, and communication. However, one disadvantage of inkjet printed polymer dielectric materials is its high coefficient of thermal expansion (CTE). By incorporating carbon nanotubes into the dielectric materials with a patent pending printing technique, we have dramatically decreased the CTEs of the dielectric materials we are using, as well as increased their mechanical properties and thermal stabilities.
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