In this newsletter, you’ll learn about advancements in additive manufacturing, flexible electronics, sustainable electronics manufacturing, printed electronics, and microfabrication. You will also have the opportunity to download the full presentation slides.
DoMicro | Insights in Electronic Design and Integration For FHE-Application
Hummink | Pushing The Boundaries of Microbump Fabrication: The HPCaP Approach
Elephantech | Making the world sustainable with new manufacturing technologies
NanoPrintek | Dry Multimaterial Printing: Printed Electronics WITHOUT Inks or Drying
Fuji Corporation | Innovation in electronics by integration of additive manufacturing and SMT
The Future of Electronics RESHAPED Boston is the flagship TechBlick event. This event will take place at the UMass Boston, USA on the 11-12 June 2025. Visit the event website here.
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DoMicro | Insights in Electronic Design and Integration For FHE-Application
Marcel Grooten | April 2024
In this presentation you will learn about the following:
Conventional and flexible hybrid electronics
Creating flexible hybrid electronics
In-house electronics test lab: electronic development competence in quality management tools, electronics development tools and in-house electronics test lab
Product & prototyping
Hummink | Pushing The Boundaries of Microbump Fabrication: The HPCaP Approach
Sahar Al Kamand | April 2024
High aspect ratio microbumps are vital in packaging applications, yet typical methods lack the control needed for dimension. HPCAP (High Precision Capillary Printing) Technology addresses this, offering high control over microbump fabrication & exceptional versatility in dimensions & materials. Based on Atomic Force Microscopy (AFM) , HPCAP simplifies complex microbump manufacturing into a single-step procedure. During this presentation, we will delve into the workings of HPCAP technology. Our aim is to provide a detailed exploration of how this groundbreaking technology facilitates the creation of microbumps. Furthermore, the presentation will underscore the vital role that HPCAP technology plays in both packaging and semiconductor repair applications.
In this presentation you will learn the following:
The working principle of HPCaP
The macro resonator
Capillarity is the only driving force
Adding a new dimension to printing
Gaps at the submicron scaleunmatched precision & accuracy in EHD, Inkjet, UPD, HPCaP
Common sense physical boundaries in rheology & drying, particle size, surface energy
Elephantech | Making the world sustainable with new manufacturing technologies
Masaaki Sugimoto | March 2024
In this presentation you will learn the following:
Pure Additive Method: A novel approach using metal inkjet printing for electronics.
PCB Industry Impact: Why the subtractive process is wasteful and its environmental costs.
Sustainable Solutions: Cost-effective methods for greener PCB manufacturing.
Mass Production Breakthrough: The first mass production plant for inkjet-printed PCBs in Aichi, Japan.
Join us on December 11, 2024, for the FREE-TO-ATTTEND Printed Electronics & Display Innovation Day, a free online event by TechBlick and the MicroLED Association. Connect with industry leaders shaping the future of displays. View the agenda here.
NanoPrintek | Dry Multimaterial Printing: Printed Electronics WITHOUT Inks or Drying
Masoud Mahjouri-Samani | April 2024
In this presentation, you will learn about a flexible method to integrate advanced materials and devices onto various objects
Challenges with Current AME Printers: Issues like complex supply chains, costly ink formulations, and sustainability problems.
A Comprehensive Solution: Learn about a dry multi-material printer that consolidates the entire supply chain and manufacturing process into one machine.
Advanced Imaging Techniques: Insights from scanning transmission electron microscopy (STEM) of laser-generated nanoparticles.
Adhesion Testing: Results of adhesion tests for ANM-printed silver (Ag) films.
Impact of Sintering: Understanding how laser power density and printing passes affect substrate integrity and reduce paper burning.
Fuji Corporation | Innovation in electronics by integration of additive manufacturing and SMT
Ryojiro Tominaga | Berlin 2023
In recent years, 3D printer technology that can manufacture bare PCBs using digital printing technology for both conductors and insulators has been developed. However, it is essential to optimize the SMT process in accordance with the transformation of the bare PCBs manufacturing process for the practical application of this technology. Fuji will introduce a novel machine that combines the additive manufacturing process of bare PCBs and low-temperature SMT technology optimized for this purpose.
In this presentation, you will learn about Low temperature SMT and Fast and smooth data flow
Integrated machine of AME + SMT
AME capability establishment of specific SMT process suites for AME
Target interconnect structure and Ultra low temperature SMT process
Direct flow from designing to manufacturing
Fast testing cycles utilizing FPM-Trinity and the data flow
Join us on December 11, 2024, for the FREE-TO-ATTTEND Printed Electronics & Display Innovation Day, a free online event by TechBlick and the MicroLED Association. Connect with industry leaders shaping the future of displays. View the agenda here.
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