In this newsletter you can learn about the latest advances in Additive, Sustainable, Hybrid and 3D Electronics! via the following highlighted short videos, each being less than 2min, saving you learning time. These are all key points and advances in the field, advancing the art and cutting-edge.
LIFT: R2R Digital Printing of High Viscosity Materials | Coatema
How does Gravure Printing work in Printed Electronics? | Komori
How to print micro bumps in a single step for semiconductor electronic packaging? | Hummink
Can copper paste be used in Si TOPCon solar cell metal lisation to reduce silver consumption per cell and per watt? | ISC Konstanz and Copprint
How an actual inkjet printer prints functional and optoelectrical materials on a HUGE 8.5-Gen (2200 x 2500 mm2) display glass? | Kateeva
Can we inkjet print screen printable and high viscosity pastes? | Quantica
Laser-based additive electronics to simplify the RDL metallization process | Akoneer
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R2R Digital Printing of High Viscosity Materials?
This is where inkjet struggled due to requirement for low viscosity inks and also nozzle clogging. LIFT can be a solution enabling R2R digital printing of materials with a range of viscosity levels, finally addressing a key industry limitation?
Here in this short video Thomas Kolbusch from Coatema explains how R2R LIFT process works.
This is a great explanation so we recommend watching it
Video length: 1.5 min
How does Gravure Printing work in Printed Electronics?
Ever wondered how gravure printing actually works - especially in printed electronics? Hear Doug Schardt from Komori Corporation give a concise 2-min explanation of this wonderful process able to achieve very fine feature with all manners of inks, resists, etc at great scale and throughput.
Video length: 2min
How to print micro bumps in a single step for semiconductor electronic packaging?
High Precision Capillary Printing (HPCaP) developed by Hummink enables the ability to print in a single step micro-bumps with ability to control diameter and aspect ratio. This capability enables amazing applications in semiconducting packaging. In particular, in laboratory and prototyping settings, this can accelerate the development process despite the actual printing step being relatively slow, since it eliminates many process steps.
Video length: 1.2min
Can copper paste be used in Si TOPCon solar cell metallisation to reduce silver consumption per cell and per watt?
If silver consumption per solar wafer remains unchanged, silver shortages will limit the growth of the photovoltaic industry. It is thus vital to switch away from silver or reduce silver consumption. But adding printed copper with the right performance and reliability has been difficult to achieve and demonstrate. Here, ISC Konstanz has demonstrated that YES one CAN use indeed Cu paste with excellent performance AND high stability!!
Here you can see the results from Ag consumption has been reduced from 126 mg to 60 mg (with additional of 97mg of Cu as bus bars) with same or higher performance. Furthermore, the solar cells are stabe passing
• 3x IEC @ TCT (600 cycles) requirements passed without considerable degradation
• 2x IEC @ DHT (2000h) requirements passed without considerable degradation
• 3x IEC @ DHT (3000h) requirements passed without any degradation by the group with the encapsulation material EVA
Video length: 1.2min
How an actual inkjet printer prints functional and optoelectrical materials on a HUGE 8.5-Gen (2200 x 2500 mm2) display glass?
Inkjet in printed electronics is often a small desktop machine throwing up the question can it ever be scaled up to huge areas. Here you can see see that yes it can. This is an example of area printing but still a great demonstrator.
This video by Kateeva shows this beast of a machine and wonderful engineering in action demonstrating the inkjet can be truly scaled in additive and printed electronics
Video length: 30s
Can we inkjet print screen printable pastes?
Inkjet has this major limitation of not being able to print high viscosity or even mid viscosity pastes. This limitation has truly held back inkjet in the world of additive and printed electronics.
Quantica has developed a printer head that could enable direct inkjet printing of high viscosity pastes. This could be a game changer provided some challenges are addressed. Learn more here including about some of the challenges such as drying of paste during print at elevated temperature.
Video length: 1.3min
Can mask-less Additive Electronics simplify the RDL metallization process (both via and conductor layers) reducing number of process steps from ca. 11 down to 2-4 without any masks?
This would be a superb achievement? Tadas Kildušis explains how SSAIL (Selective Surface Activation Induced by Laser) process (PI coat, laser pattern, activate, plate) can achieve this
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