Speaker: Ben Harries | Company: Versarien | Date: 26-27 April 2022 | Full Presentation
Simon and Ben will be introducing some of the opportunities and challenges of implementing 3DCP technology in the construction of buildings and infrastructure, along with some of the emerging benefits of using graphene additives in printing materials.
Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs)
portfolio of expert led masterclass year-round platform
And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor.
To learn more visit
https://www.techblick.com/electronicsreshaped
To see feedback about previous event see https://www.techblick.com/events-agenda
Comentários