The 3D Printed Electronics market is rapidly growing and, according to several research and marketing studies, is estimated to reach multi-billion dollars annually over the next several years with double-digit growth. The 3rd dimension is more than just an additional space to add electronics; it implies a more optimized use of the space, it becomes a powerful tool to enhance products that are currently limited due to shape and size requirements. Adding planar electronics to non-planar or round objects means making the object larger and using bolts, wires and mounts to hold the electronics in place. This is a standard, and even state of the art method, to make an object electrically functional. However, it wastes space, decreases the durability, adds additional steps in manufacturing for integration and imposes constraints on the users. In many cases, adding electronics is not viable given the size constraints or the complexity imposed when adding.
3D Printed Electronics combines electronic packaging with electronic integration. Adding actives with 3D printing implies that electronics can be a part of any 3D printed object. The value of this has not been fully articulated or even imagined, but early demonstrations and the imagination of some reveal that 3D Printed Electronics will not only be the next-generation of electronic packaging, but it will also revolutionize next-generation products. The discussion on CHIPS and the impact is muted without next-generation packaging. 3D Printed Electronics and semiconductor chips are a natural marriage.
In this talk we will explore the advantages of 3D Printed Electronics and the required tools to make complete working circuits. Additionally, we will show why successful 3D Manufacturing using 3D Printed Electronics is more than printing. We will demonstrate the advantages of using 3D manufacturing and multiple tools and processes in a single system. The idea of printing structures, conductors and adding actives opens new opportunities for more electronic functions in smaller form factors. It also allows for more personalized electronics to be viable. We will focus on optimizing next-generation smart tools and smart labs to ensure thousands of layers are perfect every time.
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