This class introduces a detailed view on polymer thick film paste conductor technology. It comprises a descriptions of its main constituents, their respective functions and its critical parameters. An insight into resin and metal powder technology is given and the range of substrate materials and their properties discussed. Paste manufacturing steps and functional testing schemes for quality
assurance are summarized. Beyond screen printing alternative off- and on-contact deposition technologies as well as downstream processes are reviewed. The class closes with an overview of typical industrial applications.

When it comes to stretchable electronics, e-textile, smart gloves, and wearable patches, Liquid Metals (LMs) are becoming the number one choice for most researchers. But research on LMs are also entering fields of energy storage, thermal interfaces, displays, energy harvesting, and even carbon capture. This is due to the excellent combination of electrical and thermal conductivity and fluidic deformability, that makes liquid metals the first choice for many applications. However, unlike the electrically conductive inks and pastes, LMs are not easy to deposit and pattern, they are smearing, and interfacing them with microchips is not straight forward. The good news is that these problems are being addresses rapidly, and there are already some steps toward commercialization of LM based electronics.

In this master class I will summarize the research on liquid metals during the last 15 years, and will demonstrate various aspects of liquid metals. The talk will be divided into 3 sections: Materials (Liquid Metals, LM composites, LM micro and Nano droplets), Fabrication Techniques (Deposition, Patterning and Microchip Interfacing) and Applications. I will talk about the results of electromechanical testing, and durability of circuits when subjects to over 100, 000 strain cycles. I will as well talk about the applications in the space of smart textiles, wearable patches, additive manufacturing, and mechanical sensing, and how some of the top manufacturers (e.g. in automotive sector) are already adopting solutions. If time permits, I will briefly talk about how LMs are entering the energy storage field, both as current collectors, and as active electrodes.

Electronic waste (e-waste) poses a pressing global challenge with the World Health Organization (WHO) reporting a staggering annual generation that exceeds 50 million tonnes. Less than 20% of this waste is recycled, highlighting severe environmental and health risks associated with the disposal of hazardous materials such as lead, mercury, and flame retardants. This challenge is further compounded by the overreliance of the global economy on rare earth elements and critical raw materials. Addressing this crisis requires a concerted effort to align with the United Nations Sustainable Development Goals (SDGs), particularly Goal 12 (Responsible Consumption and Production), which emphasizes reducing waste generation and promoting sustainable practices. Achieving this goal requires a paradigm shift in the electronics industry. Our course delves into the urgent need for sustainable materials and manufacturing methods within electronics. We explore alternatives to synthetic, often non-sustainable materials like PFAS (per- and polyfluoroalkyl substances) which persist in the environment and harm ecosystems. - Enter biobased materials—nature-inspired alternatives: Derived from renewable sources like trees, plants and algae, these materials offer a greener path. We’ll explore their properties, applications, and potential to revolutionize electronic design. - Additive Manufacturing and Printed Electronics: Create intricate electronic components layer by layer, minimizing waste and energy consumption for thin flexible solar panels, printed circuit boards, sensors, displays and more. We explore how these innovative techniques can reduce environmental impact. Join us on this journey toward sustainable electronics. Let’s design a future where innovation meets responsibility.

In this masterclass we will learn the packaging hierarchy and learn how the chip interfaces and structure can help us in building a reliable electronic system. We will see how wire bonding, although famous, is not suitable for the flexible electronic eco-systems and than we see how flip chip bonding is better but still has it disadvantages.
We will see how solders and conductive adhesive has their pros and cons and how they both suffer from thermal mechanic stresses when bonding in elevated temperatures. Therefore, we will see why there is a motivation for lowering this temperature not only because the materials cannot withstand these elevated temperatures.