E-Textiles: Integration techniques

This masterclass presents an in-depth exploration of integration techniques for e-textiles, specifically focusing on the journey from concept to process in e-textile bonding. It examines reliable methods for contacting electronic modules with multiple contacts to textile circuits, drawing on foundational principles of flip-chip bonding adapted for textile applications. The multi-compatible integration technology discussed enables the incorporation of electronic modules (PCBs) into a variety of textile forms, including woven, non-woven, knitted, and embroidered circuits. Significant durability is highlighted, with contacts designed to withstand 100 washing cycles. Attendees will gain insights into process development, an introduction to the research machine, and a discussion of ongoing and future activities in the field of e-textiles.