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MC 3: Laser Technology in Mini- and MicroLED Fabrication: from Mass Transfer to Bonding and Repair

MC 3: Laser Technology in Mini- and MicroLED Fabrication: from Mass Transfer to Bonding and Repair
Jan Brune, Muhammad Fatahilah, Heiko Riedelsberger

Coherent

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MC 3: Laser Technology in Mini- and MicroLED Fabrication: from Mass Transfer to Bonding and Repair

Future displays will range from tiny ones, for AR/VR applications, to over 100 inches diagonal, for large wall TVs. Lasers play an essential role in producing state-of-the-art displays especially when it comes to high-end high-resolution displays. This masterclass will cover the laser processes required for microLED display manufacturing. We will present results and beam delivery concepts for Laser Lift-Off, Laser Mass Transfer, and Laser Repair. Further, we will present our latest findings and results about suitable materials and wafer configurations. After the transfer and repair, a final bonding step is required, where our Laser Assisted Bonding shows advantages over reflow ovens. We will present our flexible laser bonding solution.

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