In-Mold Electronics Design: A Mechanical Perspective

As industries push for seamless, sustainable, and intelligent design, advanced in-mold electronics are redefining how electronic functionality with mounted components can integrate into thin, 3D-formed, smart surfaces. This masterclass will explore this technology and its platforms, highlighting some of the unique challenges that may arise in its application.
Attendees will gain insight into the fundamental principles of integrating printed electronics with mounted components into molded structures, including key technology platforms—2-Films, Light Channels, and Surface Light—and learn what key mechanical engineering considerations must be addressed, such as tolerances in production, conductive ink stretching behavior, and the utilization of simulations. This masterclass is a must-attend for engineers, designers, and decision-makers looking to stay ahead in the smart surface revolution.