Digital Additive Manufacturing of Electronic Devices: Inkjet, Aerosol, Dispensing, EHD printing and beyond

Additive manufacturing of electronic devices and interconnects continues to advance with the evolution of new printing methods and associated conductive and dielectric material inks. This tutorial will review printing methods, materials, and applications. The ability to print smaller circuit features, ground planes, filled vias and printed “wire bonds” that interconnect the substrate to silicon devices will be described. Recent results from studies on medical and industrial sensors, printed RF components, high-temperature electronics, and high-power wide- bandgap SiC power electronics packages will be included.