Chip Interconnections for Flexible Printed Electronics.

In this masterclass we will learn the packaging hierarchy and learn how the chip interfaces and structure can help us in building a reliable electronic system. We will see how wire bonding, although famous, is not suitable for the flexible electronic eco-systems and than we see how flip chip bonding is better but still has it disadvantages.
We will see how solders and conductive adhesive has their pros and cons and how they both suffer from thermal mechanic stresses when bonding in elevated temperatures. Therefore, we will see why there is a motivation for lowering this temperature not only because the materials cannot withstand these elevated temperatures.