ALL PAST & FUTURE EVENTS AS WELL AS MASTERCLASSES WITH A SINGLE ANNUAL PASS
Printed Electronics Innovation Day
11 December 2024
1pm - 8pm
Berlin Time
Free-To-Attend Online Event
Welcome to the Printed Electronics Innovation Day
This is a free-to-attend online conference and exhibition organized by TechBlick.
This event is co-located with TechBlick Display Innovation Day (online)
We invite all engineers, researchers, entrepreneurs, inventors, and end users active in reshaping the future of electronics to join this wonderful one-day event
The event features cutting-edge talks by leading researchers, inventors and companies in the field, showcasing the latest advances in RESHAPING the FUTURE of Electronics
If you wish to present at this forum email khasha@techblick.com
The main topics will include: Printed Electronics, Additive Electronics, Flexible Electronics, In-Mold Electronics, Textile Electronics, 3D Electronics, Sustainable Electronics, and Wearable Electronics.
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Sub-Topics: Additive Electronics, Screen Printing, Stretchable Electronics, Soft Electronics, Printed Electronics, Inkjet Printing, EHD Printing, MicroDispensing, PCBs, SMTs, Interconnects, Low-T Solder, Stretchable Substrates, Paper Electronics, Conductive Inks, Thermal or Photonic Curing, Aerosol Deposition, Smart Patches, Medical Devices, HMIs, Capacitive Touch, Nanowires, Transparent Heaters, Semiconductor Packaging, Adhesives
Leading global speakers include:
![Panacol-Elosol GmbH](https://static.wixstatic.com/media/090711_54186aea16c54c2ebf36d0a828be7090~mv2.png/v1/fill/w_83,h_45,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_54186aea16c54c2ebf36d0a828be7090~mv2.png)
![Fraunhofer IKTS Dresden](https://static.wixstatic.com/media/090711_6121a6c2eb554de1828771c828480e47~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_6121a6c2eb554de1828771c828480e47~mv2.jpg)
![Saralon GmbH](https://static.wixstatic.com/media/090711_cfe9fe2e31fc46d19bd37e3c3e4ed7ed~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_cfe9fe2e31fc46d19bd37e3c3e4ed7ed~mv2.jpg)
![PRINTUP INSTITUTE](https://static.wixstatic.com/media/090711_20668170791b4df2b24b5cb8b6697579~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_20668170791b4df2b24b5cb8b6697579~mv2.jpg)
![KONICA MINOLTA SENSING EUROPE B.V.](https://static.wixstatic.com/media/090711_43d485194aff45bf99033cdde081dc93~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_43d485194aff45bf99033cdde081dc93~mv2.jpg)
![CEA](https://static.wixstatic.com/media/090711_2a51a653a8a9470d9060e5d62da836e5~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_2a51a653a8a9470d9060e5d62da836e5~mv2.jpg)
![ROARTIS](https://static.wixstatic.com/media/090711_1739610e01fd4f2bae4a6307a383dd7a~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_1739610e01fd4f2bae4a6307a383dd7a~mv2.jpg)
![3D-Micromac AG](https://static.wixstatic.com/media/090711_c7448346ed52484fa76c0e556cb3f515~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_c7448346ed52484fa76c0e556cb3f515~mv2.jpg)
![Arkema](https://static.wixstatic.com/media/090711_6939a8bea12c46f5a691d97865b941e3~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_6939a8bea12c46f5a691d97865b941e3~mv2.jpg)
![Epishine](https://static.wixstatic.com/media/090711_af2179d58503467dbdc8d3e537b1640f~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_af2179d58503467dbdc8d3e537b1640f~mv2.jpg)
![Toray Engineering](https://static.wixstatic.com/media/090711_9a5dc8880fc742529aa802517e26df34~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_9a5dc8880fc742529aa802517e26df34~mv2.jpg)
![Copprium](https://static.wixstatic.com/media/090711_aa003a9e66dc4c99822aa199d8d9165b~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_aa003a9e66dc4c99822aa199d8d9165b~mv2.jpg)
![SCIL Nanoimprint solutions](https://static.wixstatic.com/media/f96639_15b80cda3d30425d928b23f2942c79e5~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/f96639_15b80cda3d30425d928b23f2942c79e5~mv2.jpg)
![ELANTAS Europe GmbH](https://static.wixstatic.com/media/090711_55e1e4d5973b4da5b7cb2319951249eb~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_55e1e4d5973b4da5b7cb2319951249eb~mv2.jpg)
![Polar Light Technologies AB](https://static.wixstatic.com/media/090711_6ee65ec7094445fd901684b1147050f5~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_6ee65ec7094445fd901684b1147050f5~mv2.jpg)
![Eastman Kodak Company](https://static.wixstatic.com/media/090711_d10a138cc5124b70842a88c1e6efda83~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_d10a138cc5124b70842a88c1e6efda83~mv2.jpg)
![Coherent Corp.](https://static.wixstatic.com/media/090711_042a4c71df744223bef34095e980b1cf~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_042a4c71df744223bef34095e980b1cf~mv2.jpg)
![Fraunhofer IFAM](https://static.wixstatic.com/media/99513d_24828038631941bead7e709c2e9c0f25~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/99513d_24828038631941bead7e709c2e9c0f25~mv2.jpg)
![Brilliant Matters](https://static.wixstatic.com/media/090711_8a984adb981547aba31b37d39f8e3646~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_8a984adb981547aba31b37d39f8e3646~mv2.jpg)
![Finetech GmbH & Co. KG](https://static.wixstatic.com/media/090711_e61679a4efa84688ab02b54919677e46~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_e61679a4efa84688ab02b54919677e46~mv2.jpg)
![MAASS](https://static.wixstatic.com/media/090711_e4e83b72007c4400a46f52a63b8a4fd6~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_e4e83b72007c4400a46f52a63b8a4fd6~mv2.jpg)
![tesa SE](https://static.wixstatic.com/media/090711_479441d614914bf3aaf5f52e35d0e67f~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_479441d614914bf3aaf5f52e35d0e67f~mv2.jpg)
![Voltera](https://static.wixstatic.com/media/090711_ce8de1953dfc4dfc86caebd14f83f7e8~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_ce8de1953dfc4dfc86caebd14f83f7e8~mv2.jpg)
![Flexoo](https://static.wixstatic.com/media/090711_1ce8908d5bb7465397f99b742959f088~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_1ce8908d5bb7465397f99b742959f088~mv2.jpg)
![Hamamatsu Photonics Deutschland GmbH](https://static.wixstatic.com/media/090711_e2343a21515a49c58f5fde26076711d5~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_e2343a21515a49c58f5fde26076711d5~mv2.jpg)
![Heraeus Printed Electronics GmbH](https://static.wixstatic.com/media/f96639_2eed63a4e96548e19726aab3d17b7060~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/f96639_2eed63a4e96548e19726aab3d17b7060~mv2.jpg)
![JOANNEUM RESEARCH](https://static.wixstatic.com/media/090711_21e68b89496e49069de82b314e22ee82~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_21e68b89496e49069de82b314e22ee82~mv2.jpg)
![DELO Industrial Adhesives](https://static.wixstatic.com/media/090711_d91f71f1299f471c8c7072000d87e854~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_d91f71f1299f471c8c7072000d87e854~mv2.jpg)
![Coveme](https://static.wixstatic.com/media/090711_c6fd72cf0e944ccca63308b15ad666cd~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_c6fd72cf0e944ccca63308b15ad666cd~mv2.jpg)
![XTPL](https://static.wixstatic.com/media/090711_38597fb9b11f405d81a2373e86cf3d34~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_38597fb9b11f405d81a2373e86cf3d34~mv2.jpg)
![Exxelia Micropen](https://static.wixstatic.com/media/090711_043454cbbc31426a91f0b825c0ec08f3~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_043454cbbc31426a91f0b825c0ec08f3~mv2.jpg)
![C3Nano Inc.](https://static.wixstatic.com/media/090711_ccd5bc36a3f14395b6cd174c95b4695c~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_ccd5bc36a3f14395b6cd174c95b4695c~mv2.jpg)
![Celanese Micromax](https://static.wixstatic.com/media/090711_a24c9840ac1645dba8103dd588af9107~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_a24c9840ac1645dba8103dd588af9107~mv2.jpg)
![VueReal](https://static.wixstatic.com/media/090711_9c2b2f29e7864604aaa92b12ba20af70~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_9c2b2f29e7864604aaa92b12ba20af70~mv2.jpg)
![IDS](https://static.wixstatic.com/media/090711_74361b2188f04ba79cddbca46f7a3cee~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_74361b2188f04ba79cddbca46f7a3cee~mv2.jpg)
![Coatema Coating Machinery GmbH](https://static.wixstatic.com/media/090711_950a100e6e78426b8aa5b6e29bc24f8c~mv2.jpg/v1/fill/w_83,h_45,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/090711_950a100e6e78426b8aa5b6e29bc24f8c~mv2.jpg)
![Gradient_edited_edited.jpg](https://static.wixstatic.com/media/090711_2e179c1d9b5c4c089ec4f43a16ce8f7f~mv2.jpg/v1/fill/w_538,h_296,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/Gradient_edited_edited.jpg)
Full Agenda
The times below is Europe Berlin time
Electronics | Session1
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Electronics | Session1
Printed Electronics - Session 1
joint
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
Printed Electronics - Session 1
Arkema
![Arkema](https://static.wixstatic.com/media/090711_6939a8bea12c46f5a691d97865b941e3~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Arkema
Piezoelectric Polymers: Transforming Sensor Technology with Innovative Solutions
1:00 PM
joint
Mickael Pruvost
Global Business and Research developer
Explore how printable piezoelectric polymers are changing the field of sensors. With their ability to convert forces, pressures and mechanical waves into electricity, these advanced materials offer more efficient, precise and durable solutions for a wide range of industrial and technological applications, including human-machine interfaces, sensors for sport and health, and structural control. Join us to explore the competitive advantages they bring to your products.
Piezoelectric Polymers: Transforming Sensor Technology with Innovative Solutions
1:00 PM
Explore how printable piezoelectric polymers are changing the field of sensors. With their ability to convert forces, pressures and mechanical waves into electricity, these advanced materials offer more efficient, precise and durable solutions for a wide range of industrial and technological applications, including human-machine interfaces, sensors for sport and health, and structural control. Join us to explore the competitive advantages they bring to your products.
JOANNEUM RESEARCH
![JOANNEUM RESEARCH](https://static.wixstatic.com/media/090711_21e68b89496e49069de82b314e22ee82~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
JOANNEUM RESEARCH
Sensor systems based on electro-active polymers highly integrated and tailor-made
1:15 PM
joint
Gregor Scheipl
Business Development
At JOANNEUM RESEARCH, we have built-up comprehensive know-how over the years that enables us to design, develop, and manufacture highly complex sensor systems based on electro-active polymers. Due to our end-to-end system expertise, which covers the entire value chain from device fabrication, bonding, and signal processing to system integration as well as software development, we are offering tailor-made solutions for your specific application. By means of our pilot-line, these highly complex systems can now be realized in a customer-friendly and efficient manner. Our technology can be applied to most versatile surfaces and covers a wide range of applications, including monitoring of industrial production processes (precise pressure distribution measurements; vibration measurements for condition monitoring), surveillance of material conditions in the field of structural health monitoring, as well as recording of vital parameters in healthcare (pulse, respiratory rate, balistocaridogram), amongst others. Furthermore, the system can be used as an innovative energy harvester that autonomously supplies energy to sensor nodes. Together with our partners who specialize in upscaling and mass production, we offer this technology as tailored product solutions across various market segments.
Sensor systems based on electro-active polymers highly integrated and tailor-made
1:15 PM
At JOANNEUM RESEARCH, we have built-up comprehensive know-how over the years that enables us to design, develop, and manufacture highly complex sensor systems based on electro-active polymers. Due to our end-to-end system expertise, which covers the entire value chain from device fabrication, bonding, and signal processing to system integration as well as software development, we are offering tailor-made solutions for your specific application. By means of our pilot-line, these highly complex systems can now be realized in a customer-friendly and efficient manner. Our technology can be applied to most versatile surfaces and covers a wide range of applications, including monitoring of industrial production processes (precise pressure distribution measurements; vibration measurements for condition monitoring), surveillance of material conditions in the field of structural health monitoring, as well as recording of vital parameters in healthcare (pulse, respiratory rate, balistocaridogram), amongst others. Furthermore, the system can be used as an innovative energy harvester that autonomously supplies energy to sensor nodes. Together with our partners who specialize in upscaling and mass production, we offer this technology as tailored product solutions across various market segments.
Fraunhofer IFAM
![Fraunhofer IFAM](https://static.wixstatic.com/media/99513d_24828038631941bead7e709c2e9c0f25~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Fraunhofer IFAM
Pinted sensors for structural health monitoring of composite components
1:30 PM
joint
Ingo Wirth
Project Manager Smart Systems
In aviation industry, there exists an increasing demand for structural health monitoring (SHM) of carbon fiber reinforced composite materials (CFRP), which are needed for aerospace structures because of their unique stiffness to weight ratio. The challenge in such a context is to integrate smart systems in composites for lightweight constructions using different sensors without mechanically changing the structural behavior of the host structures (low weight addition and as small as possible stiffness modification). Innovative printing technologies allow the integration of printed sensors in composite parts and components by satisfying these criteria. For this purpose, manufacturing and integration process of sensors in composite parts using printing technologies was investigated. Piezoelectric sensors as well as temperature sensors were deposited directly on composite aeronautics parts representative of the aeronautic industry using screen printing and Aerosol Jet printing technologies. As an architecture network, printed individual sensors can be connected to an overall system.
The great advantage of printing technologies is the possibility to deposit customized sensor structures directly on planar and non-planar surfaces. The usage of printing technologies results in a great accuracy, reliability, and cost reduction also in a later production process. The development of electrical conductive composites allows the deposition of conductive paths between the sensor structures on the part and finally a connection to the power supply unit. This allows for the realization of a complete sensor structure with low added weight and low intrusivity with respect to the host structure. The sensor technology platform itself offers a broad range of variations of piezoelectric sensor candidate architectures into manufacturing process. The printed sensor network consists of several connected piezoelectric sensors, which build a dynamical load and displacement sensitive element. To detect, localize, classify and quantify damage to CFRP parts, composite aeronautic structural elements may be monitored using data from such printed sensors. This innovative sensor technology can thus be used for SHM by providing a complete and continuous observation of the whole system in the aircraft, but also in any other application area having similar requirements.
Printed piezoelectric sensors can be used to detect and monitor structural deformation, damage, or fatigue in aircrafts, helping to ensure the safety and reliability of the aircraft. Furthermore, it can be used to monitor the vibration of aircraft engines, providing early warning of potential issues and helping to prevent costly engine failures. Printed temperature sensors are able to monitor temperature changes even in inaccessible places in engines. Overall, the use of printed piezoelectric sensors in aeronautics can help to improve the safety, efficiency, and performance of aircrafts.
Pinted sensors for structural health monitoring of composite components
1:30 PM
In aviation industry, there exists an increasing demand for structural health monitoring (SHM) of carbon fiber reinforced composite materials (CFRP), which are needed for aerospace structures because of their unique stiffness to weight ratio. The challenge in such a context is to integrate smart systems in composites for lightweight constructions using different sensors without mechanically changing the structural behavior of the host structures (low weight addition and as small as possible stiffness modification). Innovative printing technologies allow the integration of printed sensors in composite parts and components by satisfying these criteria. For this purpose, manufacturing and integration process of sensors in composite parts using printing technologies was investigated. Piezoelectric sensors as well as temperature sensors were deposited directly on composite aeronautics parts representative of the aeronautic industry using screen printing and Aerosol Jet printing technologies. As an architecture network, printed individual sensors can be connected to an overall system.
The great advantage of printing technologies is the possibility to deposit customized sensor structures directly on planar and non-planar surfaces. The usage of printing technologies results in a great accuracy, reliability, and cost reduction also in a later production process. The development of electrical conductive composites allows the deposition of conductive paths between the sensor structures on the part and finally a connection to the power supply unit. This allows for the realization of a complete sensor structure with low added weight and low intrusivity with respect to the host structure. The sensor technology platform itself offers a broad range of variations of piezoelectric sensor candidate architectures into manufacturing process. The printed sensor network consists of several connected piezoelectric sensors, which build a dynamical load and displacement sensitive element. To detect, localize, classify and quantify damage to CFRP parts, composite aeronautic structural elements may be monitored using data from such printed sensors. This innovative sensor technology can thus be used for SHM by providing a complete and continuous observation of the whole system in the aircraft, but also in any other application area having similar requirements.
Printed piezoelectric sensors can be used to detect and monitor structural deformation, damage, or fatigue in aircrafts, helping to ensure the safety and reliability of the aircraft. Furthermore, it can be used to monitor the vibration of aircraft engines, providing early warning of potential issues and helping to prevent costly engine failures. Printed temperature sensors are able to monitor temperature changes even in inaccessible places in engines. Overall, the use of printed piezoelectric sensors in aeronautics can help to improve the safety, efficiency, and performance of aircrafts.
CEA
![CEA](https://static.wixstatic.com/media/090711_2a51a653a8a9470d9060e5d62da836e5~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
CEA
Printed processes for PCBs manufacturing: towards sustainable electronics
1:45 PM
joint
Lina Kadura
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
The global trend for smarter devices has led to a surge in the use of electronic functions often represented by printed circuit boards (PCBs), which contribute to about 7% of global electronic waste (E-waste). Printed electronics technology, utilizing low-impact additive manufacturing techniques, offer a promising alternative to conventional PCB processes as presented by multiple life cycle assessments (LCA) studies. These techniques, thanks to their low thermal budget and reduced chemical use, allows the fabrication of PCB on a variety of lower environmental impact substrates such as cellulose based materials. In CEA-Liten, we address the challenges of high-density multilayer printed PCBs by developing a four-metal layer flexible printed PCB with over 100 thru-hole vias and components assembly on both sides. This approach broadens the applications of printed PCBs to consumer electronics markets, promoting more sustainability in electronics manufacturing and addressing its end of life.
Printed processes for PCBs manufacturing: towards sustainable electronics
1:45 PM
The global trend for smarter devices has led to a surge in the use of electronic functions often represented by printed circuit boards (PCBs), which contribute to about 7% of global electronic waste (E-waste). Printed electronics technology, utilizing low-impact additive manufacturing techniques, offer a promising alternative to conventional PCB processes as presented by multiple life cycle assessments (LCA) studies. These techniques, thanks to their low thermal budget and reduced chemical use, allows the fabrication of PCB on a variety of lower environmental impact substrates such as cellulose based materials. In CEA-Liten, we address the challenges of high-density multilayer printed PCBs by developing a four-metal layer flexible printed PCB with over 100 thru-hole vias and components assembly on both sides. This approach broadens the applications of printed PCBs to consumer electronics markets, promoting more sustainability in electronics manufacturing and addressing its end of life.
Flexoo
![Flexoo](https://static.wixstatic.com/media/090711_1ce8908d5bb7465397f99b742959f088~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Flexoo
Excellence in European Manufacturing: Focus on Contract Manufacturing and R&D Services
2:00 PM
joint
Thomas Rohland
Head of Printing Operations
Technologically advanced problems demand technically advanced solutions. This session will highlight the capabilities in contract manufacturing and R&D services within the field of printed electronics. Emphasis will be placed on providing customer-tailored solutions, from monitoring temperature in battery stacks to 12m high bioreactors. Leveraging a state-of-the-art technology park, innovative concepts can be transformed into practical, real-world applications. Attendees will gain insights into how cutting-edge capabilities are employed to turn ideas into reality.
Excellence in European Manufacturing: Focus on Contract Manufacturing and R&D Services
2:00 PM
Technologically advanced problems demand technically advanced solutions. This session will highlight the capabilities in contract manufacturing and R&D services within the field of printed electronics. Emphasis will be placed on providing customer-tailored solutions, from monitoring temperature in battery stacks to 12m high bioreactors. Leveraging a state-of-the-art technology park, innovative concepts can be transformed into practical, real-world applications. Attendees will gain insights into how cutting-edge capabilities are employed to turn ideas into reality.
Networking Break
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Networking Break
Exhibition & Refreshment Break
2:15 PM
joint
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
Exhibition & Refreshment Break
2:15 PM
Electronics | Session 2
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Electronics | Session 2
Printed Electronics - Track 1 Session 2
joint
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
Printed Electronics - Track 1 Session 2
Saralon GmbH
![Saralon GmbH](https://static.wixstatic.com/media/090711_cfe9fe2e31fc46d19bd37e3c3e4ed7ed~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Saralon GmbH
Conducting Copper Ink for Printed Electronics: An Application-Based Journey
2:45 PM
joint
Steve Paschky
Managing Director Sales & Marketing
Silver based conductive ink is the backbone of the Printed Electronics. However, volatile silver prices necessitate the development of conductive inks with lower cost underlying Materials. Such an alternative must provide comparable conductivity while ensuring stable conductivity levels over time, and easy processability using conventional printing technologies (i.e.screen printing). Introducing a novel low-cost Saral Copper Ink, this presentation guides you through the high-demand application areas, discusses the benefits and addresses how to overcome challenges.
Conducting Copper Ink for Printed Electronics: An Application-Based Journey
2:45 PM
Silver based conductive ink is the backbone of the Printed Electronics. However, volatile silver prices necessitate the development of conductive inks with lower cost underlying Materials. Such an alternative must provide comparable conductivity while ensuring stable conductivity levels over time, and easy processability using conventional printing technologies (i.e.screen printing). Introducing a novel low-cost Saral Copper Ink, this presentation guides you through the high-demand application areas, discusses the benefits and addresses how to overcome challenges.
Panacol-Elosol GmbH
![Panacol-Elosol GmbH](https://static.wixstatic.com/media/090711_54186aea16c54c2ebf36d0a828be7090~mv2.png/v1/fill/w_109,h_75,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.png)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Panacol-Elosol GmbH
Adhesive Solutions for Perovskite-based and Organic Photovoltaic Applications
3:15 PM
joint
Lena Reinke
Business Development Manager
Nowadays adhesives are more than just simple fasteners and enable the implementation of new technological concepts. Various industries and a variety of applications are thus offered great growth potential. In the field of sustainable energy generation there are numerous tasks that can be addressed with the help of adhesives. In particular, the potential of novel photovoltaic technologies remains large in view of the increasing demand for alternative energy sources and has a direct influence on the success of the energy transition.Flexible photovoltaic technologies present a significant advancement in the solar energy sector, offering lightweight, adaptable and potentially lower-cost solutions in comparison to traditional rigid solar panels. A critical component of those OPV or perovskite-based systems is the adhesive material, which helps to ensure integrity, efficiency and longevity of the cells. In this talk we will focus on adhesives for encapsulation and electrically conductive adhesives, discussing their respective advantages and limitations in regard of the key requirements as mechanical support, electrical properties and environmental protection.
Adhesive Solutions for Perovskite-based and Organic Photovoltaic Applications
3:15 PM
Nowadays adhesives are more than just simple fasteners and enable the implementation of new technological concepts. Various industries and a variety of applications are thus offered great growth potential. In the field of sustainable energy generation there are numerous tasks that can be addressed with the help of adhesives. In particular, the potential of novel photovoltaic technologies remains large in view of the increasing demand for alternative energy sources and has a direct influence on the success of the energy transition.Flexible photovoltaic technologies present a significant advancement in the solar energy sector, offering lightweight, adaptable and potentially lower-cost solutions in comparison to traditional rigid solar panels. A critical component of those OPV or perovskite-based systems is the adhesive material, which helps to ensure integrity, efficiency and longevity of the cells. In this talk we will focus on adhesives for encapsulation and electrically conductive adhesives, discussing their respective advantages and limitations in regard of the key requirements as mechanical support, electrical properties and environmental protection.
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
TBC
3:30 PM
joint
TBC
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
TBC
3:30 PM
Hamamatsu Photonics Deutschland GmbH
![Hamamatsu Photonics Deutschland GmbH](https://static.wixstatic.com/media/090711_e2343a21515a49c58f5fde26076711d5~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Hamamatsu Photonics Deutschland GmbH
Lasers for sintering of metal particle based inks in Printed Electronics
3:45 PM
joint
Naveen Balla
Technical Marketing Engineer
Hamamatsu Photonics offers a wide selection of NIR semiconductor lasers along with beam shaping optics for sintering of metal particle based inks in the manufacture of printed electronics. These lasers offer several advantages like high energy efficiency, selective heating of inks, easy power scalability and long lifetimes which make them interesting for end use customers as well as system integrators. Hamamatsu Photonics has also developed process know-how on sintering of metal particle based inks to support prospective customers to test our lasers for sintering and to develop custom solutions.
Lasers for sintering of metal particle based inks in Printed Electronics
3:45 PM
Hamamatsu Photonics offers a wide selection of NIR semiconductor lasers along with beam shaping optics for sintering of metal particle based inks in the manufacture of printed electronics. These lasers offer several advantages like high energy efficiency, selective heating of inks, easy power scalability and long lifetimes which make them interesting for end use customers as well as system integrators. Hamamatsu Photonics has also developed process know-how on sintering of metal particle based inks to support prospective customers to test our lasers for sintering and to develop custom solutions.
Networking Break
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Networking Break
Exhibition & Refreshment Break
4:00 PM
joint
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
Exhibition & Refreshment Break
4:00 PM
Electronics | Session 3
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Electronics | Session 3
Printed Electronics - Session 3
joint
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
Printed Electronics - Session 3
Eastman Kodak Company
![Eastman Kodak Company](https://static.wixstatic.com/media/090711_d10a138cc5124b70842a88c1e6efda83~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Eastman Kodak Company
TBC
4:30 PM
joint
TBC
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
TBC
4:30 PM
Coatema Coating Machinery GmbH
![Coatema Coating Machinery GmbH](https://static.wixstatic.com/media/090711_950a100e6e78426b8aa5b6e29bc24f8c~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Coatema Coating Machinery GmbH
LIFT Printing for high viscous materials in combination with laser drying.
4:45 PM
joint
![Thomas Kolbusch](https://static.wixstatic.com/media/090711_436fe272e27c418a8e30bb6efe7d2556~mv2.jpg/v1/fill/w_70,h_70,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon_edited.jpg)
Thomas Kolbusch
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
New laser induced forward transfer to be used as digital fabrication method for high viscous and big particle in combination with energy efficient laser drying.
LIFT Printing for high viscous materials in combination with laser drying.
4:45 PM
New laser induced forward transfer to be used as digital fabrication method for high viscous and big particle in combination with energy efficient laser drying.
Epishine
![Epishine](https://static.wixstatic.com/media/090711_af2179d58503467dbdc8d3e537b1640f~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Epishine
Reimagining the Capture of Light : Innovations in Light Energy Harvesting for a Battery-Free Future
5:00 PM
joint
Thomas Osterberg
RnD Director
The pursuit of a more resource-efficient society is driving digitalization, leading to a rapidly growing need for connected sensors. These sensors typically rely on batteries, necessitating costly maintenance to replace them every few years and contributing to a significant negative environmental impact. By harnessing ambient light, the lifespan of batteries can be extended, and in many cases, make them obsolete. While this concept is straightforward in principle, this new technology comes with integration challenges. With this in mind, a vertically integrated light energy harvesting platform based on state-of-the-art hybrid electronics circumvents many challenges associated with integration complexity and creates a plug & play solution, dubbed the self-charging battery.
Reimagining the Capture of Light : Innovations in Light Energy Harvesting for a Battery-Free Future
5:00 PM
The pursuit of a more resource-efficient society is driving digitalization, leading to a rapidly growing need for connected sensors. These sensors typically rely on batteries, necessitating costly maintenance to replace them every few years and contributing to a significant negative environmental impact. By harnessing ambient light, the lifespan of batteries can be extended, and in many cases, make them obsolete. While this concept is straightforward in principle, this new technology comes with integration challenges. With this in mind, a vertically integrated light energy harvesting platform based on state-of-the-art hybrid electronics circumvents many challenges associated with integration complexity and creates a plug & play solution, dubbed the self-charging battery.
Brilliant Matters
![Brilliant Matters](https://static.wixstatic.com/media/090711_8a984adb981547aba31b37d39f8e3646~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Brilliant Matters
Scale-Up of Active Layer Materials for Organic Photovoltaics.
5:15 PM
joint
Arthur Hendsbee
Project Manager
Organic Photovoltaics (OPV) is a solar energy technology made from earth-abundant materials and is mass-producible at low cost using Roll-to-Roll (R2R) printing methods. OPV is capable of efficiently harvesting light energy in both indoor and outdoor environments while being lightweight, flexible, and partially transparent, enabling a wide range of applications. The light-harvesting layer, or “active layer” of an OPV device is critically important and consists of a blend of two or more organic semiconductors. Modern active layer materials have achieved power conversion efficiencies of ~20%, demonstrating the potential of this technology for widespread use. For mass production, the synthesis of active layer materials should be scalable, sustainable, and Repeatable. This talk will cover advancements in the scale-up production of our Generation 1 (G1) active layer materials for use in large-format OPV panels. The importance of low batch-to-batch variability for the mass production of organic semiconductors will be discussed, along with preliminary results in printed devices.
Scale-Up of Active Layer Materials for Organic Photovoltaics.
5:15 PM
Organic Photovoltaics (OPV) is a solar energy technology made from earth-abundant materials and is mass-producible at low cost using Roll-to-Roll (R2R) printing methods. OPV is capable of efficiently harvesting light energy in both indoor and outdoor environments while being lightweight, flexible, and partially transparent, enabling a wide range of applications. The light-harvesting layer, or “active layer” of an OPV device is critically important and consists of a blend of two or more organic semiconductors. Modern active layer materials have achieved power conversion efficiencies of ~20%, demonstrating the potential of this technology for widespread use. For mass production, the synthesis of active layer materials should be scalable, sustainable, and Repeatable. This talk will cover advancements in the scale-up production of our Generation 1 (G1) active layer materials for use in large-format OPV panels. The importance of low batch-to-batch variability for the mass production of organic semiconductors will be discussed, along with preliminary results in printed devices.
Coveme
![Coveme](https://static.wixstatic.com/media/090711_c6fd72cf0e944ccca63308b15ad666cd~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Coveme
TBD
5:30 PM
joint
TBD
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
TBD
5:30 PM
Networking Break
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Networking Break
Exhibition & Refreshment Break
5:45 PM
joint
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
Exhibition & Refreshment Break
5:45 PM
Electronics | Session 4 - Track 1
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Electronics | Session 4 - Track 1
Printed Electronics - Track 1 Session 4
joint
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
Printed Electronics - Track 1 Session 4
PRINTUP INSTITUTE
![PRINTUP INSTITUTE](https://static.wixstatic.com/media/090711_20668170791b4df2b24b5cb8b6697579~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
PRINTUP INSTITUTE
Functional inks for smart label design
6:15 PM
joint
![Vincent Noel](https://static.wixstatic.com/media/f96639_07c8a8fb499447d3ba26d67e417c69c6~mv2.jpg/v1/fill/w_70,h_70,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon_edited.jpg)
Vincent Noel
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
Based on its expertise in nanochemistry, the PRINTUP institute develops customized inks for several applications such as health and environment. Recently, we have developed an innovative grafting method on Ag nanoparticles allowing us the introduction of a wide range of functions on their surface. We have illustrated the potential of this methodology by producing inks with controlled and intense Raman signatures. Such inks have attracted great interest in recent years for their use as security labels in anti-counterfeiting applications. Indeed, they are promising alternatives to luminescent inks, which suffer from several limitations including emission peak overlap, toxicity and photobleaching. To overcome this issue, we develop a new generation of security labels based on silver nanoparticles (Ag NPs) functionalized by aryl diazonium salts, carrying various substituents (–NO2, –CN, –CCH) with distinguishable Raman fingerprints. The resulting tags were fully characterized by scanning electron microscopy (SEM), transmission electron microscopy (TEM), UV-vis absorption and SERS. Then, they were incorporated into ink formulations to be printed on polyethylene naphthalate (PEN) substrates, using handwriting or inkjet printing.
Functional inks for smart label design
6:15 PM
Based on its expertise in nanochemistry, the PRINTUP institute develops customized inks for several applications such as health and environment. Recently, we have developed an innovative grafting method on Ag nanoparticles allowing us the introduction of a wide range of functions on their surface. We have illustrated the potential of this methodology by producing inks with controlled and intense Raman signatures. Such inks have attracted great interest in recent years for their use as security labels in anti-counterfeiting applications. Indeed, they are promising alternatives to luminescent inks, which suffer from several limitations including emission peak overlap, toxicity and photobleaching. To overcome this issue, we develop a new generation of security labels based on silver nanoparticles (Ag NPs) functionalized by aryl diazonium salts, carrying various substituents (–NO2, –CN, –CCH) with distinguishable Raman fingerprints. The resulting tags were fully characterized by scanning electron microscopy (SEM), transmission electron microscopy (TEM), UV-vis absorption and SERS. Then, they were incorporated into ink formulations to be printed on polyethylene naphthalate (PEN) substrates, using handwriting or inkjet printing.
MAASS
![MAASS](https://static.wixstatic.com/media/090711_e4e83b72007c4400a46f52a63b8a4fd6~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
MAASS
TBD
6:45 PM
joint
![JF Brandon](https://static.wixstatic.com/media/090711_43c166990f8047bdac243e6a688f5def~mv2.jpg/v1/fill/w_70,h_70,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon_edited.jpg)
JF Brandon
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
TBD
6:45 PM
Exxelia Micropen
![Exxelia Micropen](https://static.wixstatic.com/media/090711_043454cbbc31426a91f0b825c0ec08f3~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Exxelia Micropen
Thermoformable and lightweight dielectric materials for use in 3D additive manufacturing
7:00 PM
joint
![Roberta Greco](https://static.wixstatic.com/media/090711_92a01f3e63cf4e1699a603c75bcdb31e~mv2.webp/v1/fill/w_70,h_70,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon_edited.webp)
Roberta Greco
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
Novel dielectric materials that are polymer-nanocomposite based are now available for use in additive manufacturing products. Lightweight and thermoformable, the Wave-Pro material is the next generation dielectric material for a variety of different antenna and space applications. Using the Micropen to direct write patterns on thermoformed shapes has opened the door to a wide range of technology options where bare alumina was unable to compete. The direct printing system, Micropen, is a CAD/CAM driven capillary dispensing tool akin to an ultra- precise micro-dispense gun. If a material is flowable and can be loaded into a syringe, the Micropen can print it onto virtually any surface. It’s a non-contact, additive printing technique that dispenses the precise amount of material needed. This makes it beneficial when using novel, expensive or rare inks. The efficient use of materials and the ease of changing them provides product designers with increased prototype control as well as reducing time-to-market. Direct printing is an ideal way to form many different patterns on 2D substrates giving them superior electrical characteristics. However, the capabilities of the Micropen don’t stop at 2D substrates. Printers have been designed with 5-axis of movement. This allows many different medical device form factors to be printed such as thin, flexible, irregular, and highly three-dimensional shapes. This talk will provide an overview of the Micropen additive dispense integration of the new Wave-Pro material set and custom CMI formulated ink system.
Thermoformable and lightweight dielectric materials for use in 3D additive manufacturing
7:00 PM
Novel dielectric materials that are polymer-nanocomposite based are now available for use in additive manufacturing products. Lightweight and thermoformable, the Wave-Pro material is the next generation dielectric material for a variety of different antenna and space applications. Using the Micropen to direct write patterns on thermoformed shapes has opened the door to a wide range of technology options where bare alumina was unable to compete. The direct printing system, Micropen, is a CAD/CAM driven capillary dispensing tool akin to an ultra- precise micro-dispense gun. If a material is flowable and can be loaded into a syringe, the Micropen can print it onto virtually any surface. It’s a non-contact, additive printing technique that dispenses the precise amount of material needed. This makes it beneficial when using novel, expensive or rare inks. The efficient use of materials and the ease of changing them provides product designers with increased prototype control as well as reducing time-to-market. Direct printing is an ideal way to form many different patterns on 2D substrates giving them superior electrical characteristics. However, the capabilities of the Micropen don’t stop at 2D substrates. Printers have been designed with 5-axis of movement. This allows many different medical device form factors to be printed such as thin, flexible, irregular, and highly three-dimensional shapes. This talk will provide an overview of the Micropen additive dispense integration of the new Wave-Pro material set and custom CMI formulated ink system.
IDS
![IDS](https://static.wixstatic.com/media/090711_74361b2188f04ba79cddbca46f7a3cee~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
IDS
TBD
7:30 PM
joint
![Dov Phillips](https://static.wixstatic.com/media/f96639_87ca99a895954440a0a46c5e2bf9ddff~mv2.jpg/v1/fill/w_70,h_70,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon_edited.jpg)
Dov Phillips
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
TBD
7:30 PM
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
End
7:45 PM
joint
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
End
7:45 PM
Printed Electronics
Display (sessions 1,2,3) + Printed Electronics (session 4)
Displays | Sesson 1
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Displays | Sesson 1
Displays - Session 1
joint
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
Displays - Session 1
Polar Light Technologies AB
![Polar Light Technologies AB](https://static.wixstatic.com/media/090711_6ee65ec7094445fd901684b1147050f5~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Polar Light Technologies AB
A novel bottom-up approach for InGaN/GaN based pyramidal micro-LEDs
1:15 PM
joint
Per Olof Holtz
CSO
New 3D uLED-structures based on a novel bottom-up approach based on InGaN/GaN pyramidal quantum well structures. The pyramidal uLEDs are fabricated by means of a re-growth process on lithographically patterned SiN-masked GaN templates. Quantum wells on the facets of the um-sized pyramids act as the active emitters. The emission from pyramidal uLEDs have recently demonstrated with a high brightness and external quantum efficiency (EQE) in a wide spectral range. The high quality of homogeneous pyramidal uLED structures combined with a flexible design paves a promising route for uLEDs
A novel bottom-up approach for InGaN/GaN based pyramidal micro-LEDs
1:15 PM
New 3D uLED-structures based on a novel bottom-up approach based on InGaN/GaN pyramidal quantum well structures. The pyramidal uLEDs are fabricated by means of a re-growth process on lithographically patterned SiN-masked GaN templates. Quantum wells on the facets of the um-sized pyramids act as the active emitters. The emission from pyramidal uLEDs have recently demonstrated with a high brightness and external quantum efficiency (EQE) in a wide spectral range. The high quality of homogeneous pyramidal uLED structures combined with a flexible design paves a promising route for uLEDs
Coherent Corp.
![Coherent Corp.](https://static.wixstatic.com/media/090711_042a4c71df744223bef34095e980b1cf~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Coherent Corp.
Lasers are a Key Enabling Manufacturing Technology for microLED Displays
1:30 PM
joint
Oliver Haupt
Director Strategic Marketing
MicroLED displays are a promising technology for very small and large displays. The market adoption strongly depends on costs of the display. Shrinking microLED sizes with additional high throughput and yield are the key to success. The use of pulsed UV laser systems to manipulate microLEDs is enabling the development and production of microLED displays.
Lasers are a Key Enabling Manufacturing Technology for microLED Displays
1:30 PM
MicroLED displays are a promising technology for very small and large displays. The market adoption strongly depends on costs of the display. Shrinking microLED sizes with additional high throughput and yield are the key to success. The use of pulsed UV laser systems to manipulate microLEDs is enabling the development and production of microLED displays.
SCIL Nanoimprint solutions
![SCIL Nanoimprint solutions](https://static.wixstatic.com/media/f96639_15b80cda3d30425d928b23f2942c79e5~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
SCIL Nanoimprint solutions
Waferscale nanoimprint with ultra-low distortions for wafer-scale MicroLED integration
1:45 PM
joint
Marc Verschuuren
Director & Chief Technology Officer
Achieving high efficiency MicroLED based micro- and pico-displays still has many challenges. With desired pixel sizes below 5 micron this leads to significant challenges in re-combination to RGB display chips and low LED efficiency due to the large surface ratio of the LED chip edges to the LED emission area. It is possible to produce / grow an all nitride RGB LED chips by nano-patterned templated growth on a single wafer, e.g. nano-wire LEDs. This would eliminate the re-combination steps and increase LED efficiency due to damage free LED edges. To do so, there is a need to accurately pattern sub-50nm patterns with less than 1nm size variation and overlay alignment of ~ 500nm, preferably sub-100nm, on a wafer that is bowed and not flat anymore due to topology from previous LED growth runs. Accurate placement of the sub-pixels on the epi-wafer is also required when the LED chips are bonded to the driver IC’s. Any pattern distortions will add to potential losses due to bad connections. Conventional (deep) UV lithography uses light to define patterns and is therefore limited by the diffraction limit and related critical depth of focus issue. Nanoimprint lithography, or NIL, uses a physical process of a stamp that has the pattern information coded into it in height / depth. On stamp contact with the wafer, liquid resist will flow into the nano-features before hardening into a 3D inverse shape of the stamp. NIL therefore is not limited by the diffraction limit and can faithfully replicate complex shapes and features with sub-10nm resolution. The disadvantage with NIL is that intimate physical contact needs to be made over the whole wafer. To allow this, the industry has moved to stamps that are flexible in order to accommodate for wafer bow, thickness variations and topology. However, the flexibility of the stamp hinders the overlay alignment accuracy. We’ll demonstrate that by using the proper processes for stamp fabrication, the NIL step, stamp release and resist material systems, we are able to achieve sub-500nm overlay alignment over full 300mm wafers and show the potential to reach sub-100nm overlay alignment.
Waferscale nanoimprint with ultra-low distortions for wafer-scale MicroLED integration
1:45 PM
Achieving high efficiency MicroLED based micro- and pico-displays still has many challenges. With desired pixel sizes below 5 micron this leads to significant challenges in re-combination to RGB display chips and low LED efficiency due to the large surface ratio of the LED chip edges to the LED emission area. It is possible to produce / grow an all nitride RGB LED chips by nano-patterned templated growth on a single wafer, e.g. nano-wire LEDs. This would eliminate the re-combination steps and increase LED efficiency due to damage free LED edges. To do so, there is a need to accurately pattern sub-50nm patterns with less than 1nm size variation and overlay alignment of ~ 500nm, preferably sub-100nm, on a wafer that is bowed and not flat anymore due to topology from previous LED growth runs. Accurate placement of the sub-pixels on the epi-wafer is also required when the LED chips are bonded to the driver IC’s. Any pattern distortions will add to potential losses due to bad connections. Conventional (deep) UV lithography uses light to define patterns and is therefore limited by the diffraction limit and related critical depth of focus issue. Nanoimprint lithography, or NIL, uses a physical process of a stamp that has the pattern information coded into it in height / depth. On stamp contact with the wafer, liquid resist will flow into the nano-features before hardening into a 3D inverse shape of the stamp. NIL therefore is not limited by the diffraction limit and can faithfully replicate complex shapes and features with sub-10nm resolution. The disadvantage with NIL is that intimate physical contact needs to be made over the whole wafer. To allow this, the industry has moved to stamps that are flexible in order to accommodate for wafer bow, thickness variations and topology. However, the flexibility of the stamp hinders the overlay alignment accuracy. We’ll demonstrate that by using the proper processes for stamp fabrication, the NIL step, stamp release and resist material systems, we are able to achieve sub-500nm overlay alignment over full 300mm wafers and show the potential to reach sub-100nm overlay alignment.
KONICA MINOLTA SENSING EUROPE B.V.
![KONICA MINOLTA SENSING EUROPE B.V.](https://static.wixstatic.com/media/090711_43d485194aff45bf99033cdde081dc93~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
KONICA MINOLTA SENSING EUROPE B.V.
Accurate display measurement within AR/VR headsets by using a complete optical
solution
2:00 PM
joint
Kedar Sathaye
Product Manager Light and Display
The application of augmented and virtual reality (AR/VR) devices is growing rapidly in industries as diverse as gaming, military, education, transportation, and medicine. The increasing importance of AR/VR technology demands control solutions that ensure visual performance. However, achieving a quality, seamless visual experience poses a challenge for device designers and manufacturers due to the limitations of measurement systems. Measuring the display characteristics of AR/VR headsets involves evaluating various parameters to ensure they meet the required standards for clarity, accuracy, and user comfort. To help manufacturers ensure display quality, various optical solutions comprised of AR/VR and XRE lenses paired with an Imaging Photometer or Colorimeter provide unique optics engineered for measuring near-eye displays, such as those integrated into virtual, mixed, and augmented reality headsets. The innovative new geometry of the lens design simulates the size, position, and binocular field of view of the human eye. Unlike traditional lenses where the aperture is located inside the lens, the aperture of the AR/VR and XRE lens is located on the front of the lens to enable the connected imaging system to replicate the location of the human eye in an AR/VR device headset and capture the entire FOV available to the user. The optical solution can be paired with a powerful software, which would enable analysing accurately different optical characteristics namely. 1. Resolution (The number of pixels per eye). 2. Field of View (FOV: The extent of the observable environment, measured in degrees). 3. Pixel Density (Pixels Per Inch – PPI - The number of pixels per inch on the display. Calculated using the resolution and the diagonal size of the display. 4. Optical Distortion: Distortion of the image caused by the lenses. 5. Colour Accuracy: The accuracy of the colours displayed compared to the real world. 6. Brightness and Contrast- The luminance of the display, measured in nits (cd/m²). 7. Image Clarity and Sharpness - Detail and clarity of the displayed to measure Modulation Transfer Function (MTF), which quantifies the display’s ability to reproduce fine details. By systematically measuring these characteristics, the manufacturers can evaluate the performance and quality of AR/VR displays accurately. AR/VR display test solution is an unique measurement system with unique optical components that replicate the human pupil size and position within AR/VR goggles and headsets to capture a display FOV to 120° horizontal. The system offers the high resolution and efficiency AR/VR device makers require, employing a compact camera/lens solution to capture all details visible across the near-eye display in a single image to quickly evaluate the human visual experience. Therefore, by leveraging advanced optical components and replicating human vision, AR/VR headsets can achieve high standards in display measurement, ensuring immersive and realistic user experiences.
Accurate display measurement within AR/VR headsets by using a complete optical
solution
2:00 PM
The application of augmented and virtual reality (AR/VR) devices is growing rapidly in industries as diverse as gaming, military, education, transportation, and medicine. The increasing importance of AR/VR technology demands control solutions that ensure visual performance. However, achieving a quality, seamless visual experience poses a challenge for device designers and manufacturers due to the limitations of measurement systems. Measuring the display characteristics of AR/VR headsets involves evaluating various parameters to ensure they meet the required standards for clarity, accuracy, and user comfort. To help manufacturers ensure display quality, various optical solutions comprised of AR/VR and XRE lenses paired with an Imaging Photometer or Colorimeter provide unique optics engineered for measuring near-eye displays, such as those integrated into virtual, mixed, and augmented reality headsets. The innovative new geometry of the lens design simulates the size, position, and binocular field of view of the human eye. Unlike traditional lenses where the aperture is located inside the lens, the aperture of the AR/VR and XRE lens is located on the front of the lens to enable the connected imaging system to replicate the location of the human eye in an AR/VR device headset and capture the entire FOV available to the user. The optical solution can be paired with a powerful software, which would enable analysing accurately different optical characteristics namely. 1. Resolution (The number of pixels per eye). 2. Field of View (FOV: The extent of the observable environment, measured in degrees). 3. Pixel Density (Pixels Per Inch – PPI - The number of pixels per inch on the display. Calculated using the resolution and the diagonal size of the display. 4. Optical Distortion: Distortion of the image caused by the lenses. 5. Colour Accuracy: The accuracy of the colours displayed compared to the real world. 6. Brightness and Contrast- The luminance of the display, measured in nits (cd/m²). 7. Image Clarity and Sharpness - Detail and clarity of the displayed to measure Modulation Transfer Function (MTF), which quantifies the display’s ability to reproduce fine details. By systematically measuring these characteristics, the manufacturers can evaluate the performance and quality of AR/VR displays accurately. AR/VR display test solution is an unique measurement system with unique optical components that replicate the human pupil size and position within AR/VR goggles and headsets to capture a display FOV to 120° horizontal. The system offers the high resolution and efficiency AR/VR device makers require, employing a compact camera/lens solution to capture all details visible across the near-eye display in a single image to quickly evaluate the human visual experience. Therefore, by leveraging advanced optical components and replicating human vision, AR/VR headsets can achieve high standards in display measurement, ensuring immersive and realistic user experiences.
Networking Break
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Networking Break
Exhibition & Refreshment Break
2:15 PM
joint
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
Exhibition & Refreshment Break
2:15 PM
Displays | Session 2
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Displays | Session 2
Displays - Track 2 Session 2
joint
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
Displays - Track 2 Session 2
3D-Micromac AG
![3D-Micromac AG](https://static.wixstatic.com/media/090711_c7448346ed52484fa76c0e556cb3f515~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
3D-Micromac AG
Laser cutting for separating waveguides for AR devices
2:45 PM
joint
![René Liebers](https://static.wixstatic.com/media/090711_36456db7c1674c69b5893dca1a4e00e9~mv2.jpg/v1/fill/w_70,h_70,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon_edited.jpg)
René Liebers
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
The increasing standardization of AR devices based on waveguides has brought attention to the importance of designing and ensuring the durability of waveguides. While ultrashort pulsed lasers hold promise for achieving precise and strong free-form cutting at scale, optimizing the laser process parameters and material compositions of high-index glasses remains a challenge in achieving optimal glass strength. To address this challenge, we have partnered with a reputable producer of specialized glasses to develop a separation process that prioritizes high and predictable bending strength. This process has been integrated into a modular machine concept, allowing for scalability from lab to mass production. Our presentation offers an overview of this fully automated machine solution designed for cost-effective free-form cutting of high-index glass used in AR waveguides. It highlights the thoughtful considerations behind the development and demonstrates how our various process, handling, and quality inspection modules offer high flexibility and scalability.
Laser cutting for separating waveguides for AR devices
2:45 PM
The increasing standardization of AR devices based on waveguides has brought attention to the importance of designing and ensuring the durability of waveguides. While ultrashort pulsed lasers hold promise for achieving precise and strong free-form cutting at scale, optimizing the laser process parameters and material compositions of high-index glasses remains a challenge in achieving optimal glass strength. To address this challenge, we have partnered with a reputable producer of specialized glasses to develop a separation process that prioritizes high and predictable bending strength. This process has been integrated into a modular machine concept, allowing for scalability from lab to mass production. Our presentation offers an overview of this fully automated machine solution designed for cost-effective free-form cutting of high-index glass used in AR waveguides. It highlights the thoughtful considerations behind the development and demonstrates how our various process, handling, and quality inspection modules offer high flexibility and scalability.
Finetech GmbH & Co. KG
![Finetech GmbH & Co. KG](https://static.wixstatic.com/media/090711_e61679a4efa84688ab02b54919677e46~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Finetech GmbH & Co. KG
TBD
3:15 PM
joint
![Travis Scott](https://static.wixstatic.com/media/f96639_eb453c52246e41bfbf50cb45564a467a~mv2.jpg/v1/fill/w_70,h_70,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon_edited.jpg)
Travis Scott
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
TBD
3:15 PM
XTPL
![XTPL](https://static.wixstatic.com/media/090711_38597fb9b11f405d81a2373e86cf3d34~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
XTPL
Advancements in Microdispensing: Additive Electronics for Semiconductor Packaging
3:30 PM
joint
Piotr Kowalczewski
R&D Manager
Additive manufacturing of electronics offers substantial benefits for the packaging of next-generation semiconductor devices, such as miniaturization, design flexibility, and cost efficiency. We will review the state of the art of microdispensing, highlighting its advantages over existing fabrication methods. Additionally, we will discuss the challenges for the widespread use of microfabrication in production lines, such as yield and repeatability. We will provide practical solutions to overcome these limitations.
Advancements in Microdispensing: Additive Electronics for Semiconductor Packaging
3:30 PM
Additive manufacturing of electronics offers substantial benefits for the packaging of next-generation semiconductor devices, such as miniaturization, design flexibility, and cost efficiency. We will review the state of the art of microdispensing, highlighting its advantages over existing fabrication methods. Additionally, we will discuss the challenges for the widespread use of microfabrication in production lines, such as yield and repeatability. We will provide practical solutions to overcome these limitations.
DELO Industrial Adhesives
![DELO Industrial Adhesives](https://static.wixstatic.com/media/090711_d91f71f1299f471c8c7072000d87e854~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
DELO Industrial Adhesives
Benefits of Adhesive for Connecting miniLED and microLEDs in Industrial Dispensing Processes
3:45 PM
joint
Tim Cloppenborg
Product manager
When things have to be attached together, glue offer several advantages in our daily life. In highly automated industrial mass production processes glue is called adhesive. Adhesives are functional polymer materials, which offer several benefits and can be tailored to customers process and needs. The shrinking pad and pitches for upcoming miniLED and microLED necessitate new conductive materials, which can be dispensed on rigid as well as flexible substrates. Besides the electrical and mechanical connection, functional polymer materials offer versatile dispensing process capabilities. In contrast to isotropic materials mask openings can be increased and lead to smoother printing process.
Benefits of Adhesive for Connecting miniLED and microLEDs in Industrial Dispensing Processes
3:45 PM
When things have to be attached together, glue offer several advantages in our daily life. In highly automated industrial mass production processes glue is called adhesive. Adhesives are functional polymer materials, which offer several benefits and can be tailored to customers process and needs. The shrinking pad and pitches for upcoming miniLED and microLED necessitate new conductive materials, which can be dispensed on rigid as well as flexible substrates. Besides the electrical and mechanical connection, functional polymer materials offer versatile dispensing process capabilities. In contrast to isotropic materials mask openings can be increased and lead to smoother printing process.
Networking Break
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Networking Break
Exhibition & Refreshment Break
4:00 PM
joint
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
Exhibition & Refreshment Break
4:00 PM
Displays | Session 3
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Displays | Session 3
Displays - Track 2 Session 3
joint
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
Displays - Track 2 Session 3
Networking Break
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Networking Break
Exhibition & Refreshment Break
5:45 PM
joint
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
Exhibition & Refreshment Break
5:45 PM
Electronics | Session 4 - Track 2
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Electronics | Session 4 - Track 2
Printed Electronics - Track 2 Session 4
joint
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
Printed Electronics - Track 2 Session 4
tesa SE
![tesa SE](https://static.wixstatic.com/media/090711_479441d614914bf3aaf5f52e35d0e67f~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
tesa SE
Innovative sustainable adhesive solutions
6:15 PM
joint
Andreas Lendlein
Head of Technology & Knowledge Growth
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
Innovative sustainable adhesive solutions
6:15 PM
ELANTAS Europe GmbH
![ELANTAS Europe GmbH](https://static.wixstatic.com/media/090711_55e1e4d5973b4da5b7cb2319951249eb~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
ELANTAS Europe GmbH
Challenge of Copper Ink for membrane switches in combination with Carbon and dielectric inks.
6:30 PM
joint
![Philipp Hölzl](https://static.wixstatic.com/media/090711_c55a9fe7d8144dd4bd9bc04c52b1f248~mv2.jpg/v1/fill/w_70,h_70,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon_edited.jpg)
Philipp Hölzl
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
Challenge of Copper Ink for membrane switches in combination with Carbon and dielectric inks.
6:30 PM
Copprium
![Copprium](https://static.wixstatic.com/media/090711_aa003a9e66dc4c99822aa199d8d9165b~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Copprium
Navigating the Conductive Ink Market: The Case for Copper Amidst Silver Supply Challenges
6:45 PM
joint
![Edward Tierney](https://static.wixstatic.com/media/f96639_85632a559e1848539c9a9a53d67a1a3a~mv2.jpg/v1/fill/w_70,h_70,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon_edited.jpg)
Edward Tierney
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
The conductive ink market is undergoing significant transformations driven by advancements in technology and growing demands for efficient, cost-effective solutions. While silver-based conductive inks have long been the standard, their high cost, limited availability, and sustainability issues are raising concerns across the industry. This session will explore the current state of the conductive ink market, highlighting the economic and environmental challenges associated with silver. We will delve into the potential of copper-based conductive inks as a viable alternative, discussing recent innovations, performance comparisons, and market trends. Attendees will gain insights into how copper-based solutions can address the pressing issues of cost and sustainability, offering a more stable and eco-friendly option for future applications. Join us to understand how transitioning to copper-based inks can help industries navigate the uncertainties of the conductive ink market and achieve long-term resilience.
Navigating the Conductive Ink Market: The Case for Copper Amidst Silver Supply Challenges
6:45 PM
The conductive ink market is undergoing significant transformations driven by advancements in technology and growing demands for efficient, cost-effective solutions. While silver-based conductive inks have long been the standard, their high cost, limited availability, and sustainability issues are raising concerns across the industry. This session will explore the current state of the conductive ink market, highlighting the economic and environmental challenges associated with silver. We will delve into the potential of copper-based conductive inks as a viable alternative, discussing recent innovations, performance comparisons, and market trends. Attendees will gain insights into how copper-based solutions can address the pressing issues of cost and sustainability, offering a more stable and eco-friendly option for future applications. Join us to understand how transitioning to copper-based inks can help industries navigate the uncertainties of the conductive ink market and achieve long-term resilience.
C3Nano Inc.
![C3Nano Inc.](https://static.wixstatic.com/media/090711_ccd5bc36a3f14395b6cd174c95b4695c~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
C3Nano Inc.
TBD
7:00 PM
joint
TBC
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
TBD
7:00 PM
Celanese Micromax
![Celanese Micromax](https://static.wixstatic.com/media/090711_a24c9840ac1645dba8103dd588af9107~mv2.jpg/v1/fill/w_109,h_75,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon.jpg)
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
Celanese Micromax
PTC Film Heaters – Materials, Design and Applications
7:15 PM
joint
![Andree](https://static.wixstatic.com/media/090711_9643b832987144f3b2256dacee3a9779~mv2.jpg/v1/fill/w_63,h_71,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/TechBlick-favicon_edited.jpg)
Andree
Maindok
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
Electrical resistance heating is an efficient way of applying heat directly to the surfaces requiring it. Also referred to as Joule heating, such devices can take many forms. Printed conductive inks and pastes present a versatile approach to apply heater patterns and electronic circuitry onto a variety of substrates materials like metals, textile fabrics, rigid and stretchable polymer films, leather and many more. Providing uniform heating power over a large area efficiently directs the heat to the intended surface without the need for heat spreaders or padding to prevent the heater being seen or felt. The heating elements can be printed with fixed resistance pastes, or positive temperature coefficient of resistance (PTC) paste can be used to reduce power as operating temperature is achieved and to reduce overall power consumption.
PTC Film Heaters – Materials, Design and Applications
7:15 PM
Electrical resistance heating is an efficient way of applying heat directly to the surfaces requiring it. Also referred to as Joule heating, such devices can take many forms. Printed conductive inks and pastes present a versatile approach to apply heater patterns and electronic circuitry onto a variety of substrates materials like metals, textile fabrics, rigid and stretchable polymer films, leather and many more. Providing uniform heating power over a large area efficiently directs the heat to the intended surface without the need for heat spreaders or padding to prevent the heater being seen or felt. The heating elements can be printed with fixed resistance pastes, or positive temperature coefficient of resistance (PTC) paste can be used to reduce power as operating temperature is achieved and to reduce overall power consumption.
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
TBD
7:30 PM
joint
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
TBD
7:30 PM
![joint-presentations.png](https://static.wixstatic.com/media/090711_898715ad78f1404cb69835d91fa228ed~mv2.png/v1/fill/w_20,h_20,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/joint-presentations.png)
End
7:45 PM
joint
![](https://static.wixstatic.com/media/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_737dffad8ece4aafa8cb0bfe790679ea~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
![](https://static.wixstatic.com/media/090711_208c765fc7134616a98373e509ba9ccd~mv2.png/v1/fill/w_24,h_24,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/090711_208c765fc7134616a98373e509ba9ccd~mv2.png)
End
7:45 PM