top of page

Electronics Packaging Symposium

4-5 November 2021
10am - 5pm

CET

Virtual Event

This is a virtual symposium with live presentations. Binghamton University  State University of New York

This event will be available as on-demand talks only. This was originally organized by the Integrated Electronics Engineering Center (IEEC) of Binghamton University. Topics covered include Future of Semiconductor Technology | Heterogeneous Integration | AI Hardware | Supercomputers | Quantum Computing | On-Package Integration | Panel Level Packaging | Chiplets and Die Block Assembly | 5G Architectures and Packaging| Materials for Neuromorphic Computing | Photonic Packaging | Printed Microwave Packaging | Future of Semiconductors | High Density Fan-Out Packages | Chiplets and SiP | Liquid Metal | 3D Printed Electronics | Printed Electronics | Energy Storage E-Textiles | Interconnects and Die Attach Technologies | Scaling in interconnects | E-Textiles | Wearable Sensors

Gradient_edited_edited.jpg
Leading global speakers include:
GE Research
Lockheed Martin
ASE
Defense Advanced Research Projects Agency (DARPA)
NC State University
Auburn
NC State University
IBM
University at Buffalo
University of Minnesota
Fraunhofer IZM
IBM Research
Corning Incorporated
HP Labs
Griffis AF Base
Intel
SUNY Polytechnic Institute
GE Research
Binghamton University
Fraunhofer IZM
Łukasiewicz - ITR
Tampere University of Technology
Raytheon Missiles and Defense Systems
ASE
Prismark Partners
US Army Research Laboratory
NSWC Crane Division
IBM
NSWC Crane Division
Georgia Institute of Technology
Rochester Institute of Technology
Binghamton University
Binghamton University

Full Agenda

The times below is Central European Times (CET).
On the platform the times will automatically be changed to your time zone

Track 1
Track 2
bottom of page