InMold Structural Electronics Workshop 2023
12 May 2023
Virtual Workshop
This is a special one day event combining networking with learning and discussions on two themes: (1) screen printing and (2) in-mold electronics.
In this page you can learn more about the activities around in-mold electronics. On the link here, you can learn more activities on screen printing in printed electronics
InMold Electronics is one of the most exciting technologies, enabling the reshaping of electronics into complex 3D shapes combined with mass production ability. The technology however faces a number of challenges to enable widespread adoption.
In this 1-hour session, the following panelists will each first give an update on the state of the art in their respective domains before outlining the open challenges and questions. We will then have a faciliated and open Q&A session.
The panelists include:
Antti Keränen, CTO of Tactotek focusing on status of IME process and roadblocks to commercialization
Dirk Pophusen from Covestro focusing on status, challenges, and open questions for IME substrates [film aspects]
Marius Nolte Covestro focusing on status, challenges, and open questions for IME substrates [resin aspects]
Rahul Raut from MacDermid focusing on Ink portfolio challenges and status for complex IME products
Robert Boks from Panacol-Elosol GmbH focusing on status and challenges of component attached in IME environment and on 3D shapes
Hans-Peter Erfurt from Proell GmbH covering "From Insert Molding to InMold Electronics: Challenges & Opportunities"
The panel will seek to address the following questions and more:
we will design a panel to review the latest and address the following issues:
Material Compatibility: Ensuring that the materials used in IME, such as conductive inks and substrates, are compatible with the molding process.
Reliability: Ensuring the durability and reliability of in-mold electronics under various mechanical stresses, including bending, stretching, and impact.
Design Complexity: Managing the design complexity associated with integrating electronic components within a molded structure, including component placement and interconnections.
Manufacturing Yield: Improving manufacturing yield and reducing defect rates in in-mold electronics production.
Process Integration: Streamlining the integration of in-mold electronics manufacturing processes with existing molding and assembly techniques.
Cost-Effectiveness:
Standardization: Developing industry standards and best practices for in-mold electronics design, materials, and manufacturing processes
IP and licensing issues
Status of adoption by various industries like the auto industry
There will also be an open discussion about the future challenges facing the industry. The aim of the meeting is open discussion and active engagement facilitated by our experts.
Do NOT miss this chance to participate in this event. This is the place to learn and together advance structural electronics together.
2pm - 5pm
CET:
Leading global speakers include:
Full Agenda
The times below is Central European Times (CET).
12 May 2023
Leader
InMold Structural Electronics Workshop
Friday
2:00 PM
Read the abstract
Khasha Ghaffarzadeh
CEO
The panelists include:
Antti Keränen, CTO of Tactotek focusing on status of IME process and roadblocks to commercialization
Dirk Pophusen from Covestro focusing on status, challenges, and open questions for IME substrates [film aspects]
Marius Nolte Covestro focusing on status, challenges, and open questions for IME substrates [resin aspects]
Rahul Raut from MacDermid focusing on Ink portfolio challenges and status for complex IME products
Robert Boks from Panacol-Elosol GmbH focusing on status and challenges of component attached in IME environment and on 3D shapes
Hans-Peter Erfurt from Proell GmbH covering "From Insert Molding to InMold Electronics: Challenges & Opportunities"
InMold Structural Electronics Workshop
2:00 PM
The panelists include:
Antti Keränen, CTO of Tactotek focusing on status of IME process and roadblocks to commercialization
Dirk Pophusen from Covestro focusing on status, challenges, and open questions for IME substrates [film aspects]
Marius Nolte Covestro focusing on status, challenges, and open questions for IME substrates [resin aspects]
Rahul Raut from MacDermid focusing on Ink portfolio challenges and status for complex IME products
Robert Boks from Panacol-Elosol GmbH focusing on status and challenges of component attached in IME environment and on 3D shapes
Hans-Peter Erfurt from Proell GmbH covering "From Insert Molding to InMold Electronics: Challenges & Opportunities"
12 May 2023
Panacol-Elosol GmbH
[Panelist | InMold Electronics] - “Bonding of electronic components for injection molding electronics processes
Friday
2:21PM
Read the abstract
Robert Boks
Director Global Business Development
During the last years more and more attention is given to so called injection molded electronic (IME) components. It saves weight, decreases the number of parts, contributes to the automotive interior lighting trend and even has a much lower CO2 footprint.
The whole production process starts with a foil onto which components must be electrically contacted by conductive adhesives. Soldering is no option as the melting temperature of solder paste conflicts with the temperature resistance of for example PC or PMMA foils. This is where adhesive technology comes into the game; low temperature curing is the right track – flexible electrically conductive materials are nice to have and curing speed is relevant as injection molding is one of the following steps in the production process.
Having over 10 years of experience on adhesive development for this industry, I am excited that Techblick offers a platform for learning and discussions. I see this as a great step towards their live event “the future of electronics” in Berlin later this year.
[Panelist | InMold Electronics] - “Bonding of electronic components for injection molding electronics processes
2:21PM
During the last years more and more attention is given to so called injection molded electronic (IME) components. It saves weight, decreases the number of parts, contributes to the automotive interior lighting trend and even has a much lower CO2 footprint.
The whole production process starts with a foil onto which components must be electrically contacted by conductive adhesives. Soldering is no option as the melting temperature of solder paste conflicts with the temperature resistance of for example PC or PMMA foils. This is where adhesive technology comes into the game; low temperature curing is the right track – flexible electrically conductive materials are nice to have and curing speed is relevant as injection molding is one of the following steps in the production process.
Having over 10 years of experience on adhesive development for this industry, I am excited that Techblick offers a platform for learning and discussions. I see this as a great step towards their live event “the future of electronics” in Berlin later this year.
12 May 2023
Pröll GmbH
[Panelist | InMold Electronics] - From Insert Molding to InMold Electronics: IMD/FIM Technology + Printed Electronics
Friday
2.35PM
Read the abstract
Hans-Peter Erfurt
IMD Manager, R&D
- Choosing the appropriate black between carbon-free & carbon-containing blacks
- Non-conductive black and silver shades for functional panels and displays
- Strategies to choose the most suitable layer construction in IME
- Advantages of screen printing versus other printing techniques
- Highly resistant, tactile protective screen printing lacquers for first surface decoration
- Second surface ink layer combinations, with optimized climate & hydrolyses resistance and improved interlayer cohesion
[Panelist | InMold Electronics] - From Insert Molding to InMold Electronics: IMD/FIM Technology + Printed Electronics
2.35PM
- Choosing the appropriate black between carbon-free & carbon-containing blacks
- Non-conductive black and silver shades for functional panels and displays
- Strategies to choose the most suitable layer construction in IME
- Advantages of screen printing versus other printing techniques
- Highly resistant, tactile protective screen printing lacquers for first surface decoration
- Second surface ink layer combinations, with optimized climate & hydrolyses resistance and improved interlayer cohesion
12 May 2023
SPEED DATING!
Round-Robin Speed Dating
Friday
3:30 PM
Read the abstract
Round-Robin Speed Dating
Participate in a round-robin speed dating session, where you'll engage in 6-minute one-on-one video conversations with another randmoly-assigned attendee before moving on to the next person. This effective approach allows you to meet potential partners and establish lasting relationships, all in a short span of time
Round-Robin Speed Dating
3:30 PM
Participate in a round-robin speed dating session, where you'll engage in 6-minute one-on-one video conversations with another randmoly-assigned attendee before moving on to the next person. This effective approach allows you to meet potential partners and establish lasting relationships, all in a short span of time
12 May 2023
RISE Research Institute of Sweden
[Talk] The rise of screen printed electronics: components, systems and applications
Friday
4.15PM
Read the abstract
Peter Andersson Ersman
Senior Scientist, Project Manager
RISE Research Institutes of Sweden develops a broad range of printed electronic components and systems on flexible substrates, most often by solely using screen printing for the deposition of the materials. Electrochromic displays, organic electrochemical transistors and sensors are all examples of components in which improved performance and high manufacturing yield recently have been demonstrated, thereby allowing for further utilization within flexible electronics upon system integration. The presentation provides an overview of this development: device architectures, materials, screen printing processes, system integration, device characterization and application areas.
[Talk] The rise of screen printed electronics: components, systems and applications
4.15PM
RISE Research Institutes of Sweden develops a broad range of printed electronic components and systems on flexible substrates, most often by solely using screen printing for the deposition of the materials. Electrochromic displays, organic electrochemical transistors and sensors are all examples of components in which improved performance and high manufacturing yield recently have been demonstrated, thereby allowing for further utilization within flexible electronics upon system integration. The presentation provides an overview of this development: device architectures, materials, screen printing processes, system integration, device characterization and application areas.
12 May 2023
Meet the Speaker
Meet the Speaker
Friday
5.15PM
Read the abstract
Meet the Speaker
5.15PM
12 May 2023
e2ip
The Future of Screen Printing for Printed Electronics Panel
Friday
5:35PM
Read the abstract
Fernando Zicarelli
Product Manager of Printed Electronics
Curated by Mr. Fernando Zicarelli, this distinguished panel brings together world-class experts in screen printing for an interactive and insightful discussion.
The panelists bring a combined industry experience of more than 100 years. They include:
Ron Hayden from RH Solutions LLC with a focus on Screen Printing and Auxiliary Equipment
David Eisenbeiss from Kissel + Wolf Group with a focus on emulsion Technology, including the latest Laser Imaging developments
Fernando Zicarelli from Fernando's Consulting (formerly at Asada Mesh) with a focus on Mesh Technology and Tooling
Erika Rebrosova from Sun Chemical with a focus on functional ink technology
Julie Ferrigno from e2ip focusing on on applications for fineline screen printing
A review of the different materials meshes being used in the Screen Printing Industry from synthetic to metallic. Fernando will give us his opinion on their capabilities and his own experiences using them.
The Future of Screen Printing for Printed Electronics Panel
5:35PM
Curated by Mr. Fernando Zicarelli, this distinguished panel brings together world-class experts in screen printing for an interactive and insightful discussion.
The panelists bring a combined industry experience of more than 100 years. They include:
Ron Hayden from RH Solutions LLC with a focus on Screen Printing and Auxiliary Equipment
David Eisenbeiss from Kissel + Wolf Group with a focus on emulsion Technology, including the latest Laser Imaging developments
Fernando Zicarelli from Fernando's Consulting (formerly at Asada Mesh) with a focus on Mesh Technology and Tooling
Erika Rebrosova from Sun Chemical with a focus on functional ink technology
Julie Ferrigno from e2ip focusing on on applications for fineline screen printing
A review of the different materials meshes being used in the Screen Printing Industry from synthetic to metallic. Fernando will give us his opinion on their capabilities and his own experiences using them.
12 May 2023
Sun Chemical Corp
[Panelist | Future of Screen Printing] Functional Ink Technologies
Friday
5.42PM
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Erika Rebrosova
Global Technology Manager
Erika will discuss the state-of-art status of functional inks for electronics manufacturing, with the focus on key benefits and challenges for electronic materials. The emerging printed electronics applications, for example transparent electronics, printed sensors, wearables for wellness and healthcare, and 3D formable and stretchable circuits, are presenting opportunities for ink technology innovation. The talk will summarize the most recent advances in inks for these emerging applications in electronics.
[Panelist | Future of Screen Printing] Functional Ink Technologies
5.42PM
Erika will discuss the state-of-art status of functional inks for electronics manufacturing, with the focus on key benefits and challenges for electronic materials. The emerging printed electronics applications, for example transparent electronics, printed sensors, wearables for wellness and healthcare, and 3D formable and stretchable circuits, are presenting opportunities for ink technology innovation. The talk will summarize the most recent advances in inks for these emerging applications in electronics.
12 May 2023
RH Solutions LLC
[Panelist | Future of Screen Printing] Exploring Levels of Screen Printing Machines, Auxiliary Equipment and High Precision Automation
Friday
5.49PM
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Ron Hayden
Owner
This podcast segment covers various levels of automated ATMA and SPS screen printing machines, auxiliary equipment, and options specifically designed for printed electronics and a wide range of high-end functional applications. Here I will highlight automated machines/ equipment for R&D Labs (academic and new product developments), Pilot Lines, and Production Lines. Some of these screen printing machines will feature High Precision Fully Automatic CCD Camera Registration for Flatbed Presses and Roll to Roll Screen Printing Lines. With integrating CCD Cameras and Auto-Alignment technology print accuracy is ≤ 20 microns. Lastly, I will introduce the latest new four-post SPS ASTRON QX series Cylinder Press which is fully servo driven and equipped with CCD camera image registration.
[Panelist | Future of Screen Printing] Exploring Levels of Screen Printing Machines, Auxiliary Equipment and High Precision Automation
5.49PM
This podcast segment covers various levels of automated ATMA and SPS screen printing machines, auxiliary equipment, and options specifically designed for printed electronics and a wide range of high-end functional applications. Here I will highlight automated machines/ equipment for R&D Labs (academic and new product developments), Pilot Lines, and Production Lines. Some of these screen printing machines will feature High Precision Fully Automatic CCD Camera Registration for Flatbed Presses and Roll to Roll Screen Printing Lines. With integrating CCD Cameras and Auto-Alignment technology print accuracy is ≤ 20 microns. Lastly, I will introduce the latest new four-post SPS ASTRON QX series Cylinder Press which is fully servo driven and equipped with CCD camera image registration.
12 May 2023
Kissel + Kiwo Group
[Panelist | Future of Screen Printing] Emulsion Technology Including The Newest Laser Imaging Developments
Friday
5.56PM
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[Panelist | Future of Screen Printing] Emulsion Technology Including The Newest Laser Imaging Developments
5.56PM
12 May 2023
e2ip
[Panelist | Future of Screen Printing] Applications for Fine Line Printing:
Friday
6.03PM
Read the abstract
Julie Ferringo
Engineer - Printed Electronics Industry
Fine conductive lines are an indispensable element in the production of electronic devices, and their versatility makes them valuable in a variety of applications. This presentation will explore the various applications that leverage the use of fine conductive lines in the printing industry. Specifically, the discussion will focus on potential applications, such as 5G Smart Surfaces, printed heaters, and capacitive touch technology.
[Panelist | Future of Screen Printing] Applications for Fine Line Printing:
6.03PM
Fine conductive lines are an indispensable element in the production of electronic devices, and their versatility makes them valuable in a variety of applications. This presentation will explore the various applications that leverage the use of fine conductive lines in the printing industry. Specifically, the discussion will focus on potential applications, such as 5G Smart Surfaces, printed heaters, and capacitive touch technology.
12 May 2023
Q& A Panel
Q&A Panel
Friday
6:10 PM
Read the abstract
Q&A Panel
6:10 PM
12 May 2023
SPEED DATING!
Round-Robin Speed Dating
Friday
6.55PM
Read the abstract
Participate in a round-robin speed dating session, where you'll engage in 6-minute one-on-one video conversations with another randmoly-assigned attendee before moving on to the next person. This effective approach allows you to meet potential partners and establish lasting relationships, all in a short span of time
Round-Robin Speed Dating
6.55PM
Participate in a round-robin speed dating session, where you'll engage in 6-minute one-on-one video conversations with another randmoly-assigned attendee before moving on to the next person. This effective approach allows you to meet potential partners and establish lasting relationships, all in a short span of time