MicroLEDs, AR/VR Displays, Micro-Optics: Innovations, Start-Ups, Market Trends

Despite their promise, microLED displays have yet to achieve mass commercialization, with yield improvement being a critical hurdle. Effective testing is essential to overcoming this challenge. This talk will explore the two major functional testing methodologies—photoluminescence (PL) and electroluminescence (EL)—and demonstrate why EL is the superior approach for accurate defect detection and performance assessment. We will discuss the key advantages of EL testing and examine what the industry needs in order to adopt this methodology at scale, ultimately driving microLED technology toward widespread adoption.

Plastic reflective waveguides have significantly contributed to reducing manufacturing costs and minimizing the form factor of augmented reality (AR) smartglasses while delivering high-quality visuals through OLED microdisplays. This presentation will introduce LetinAR’s latest developments in optimizing AR systems for seamless integration with artificial intelligence (AI). The focus is on enhancing visual performance and power efficiency to enable all-day use of intelligent, context-aware AI experiences. Novel design methodologies for plastic reflective waveguides are introduced, which improve optical efficiency and display quality. Strategies for incorporating AI processing capabilities into AR smartglasses without compromising compactness or battery life are also discussed. Experimental results demonstrate substantial improvements in visual clarity and energy consumption, highlighting the potential for practical, AI-driven AR applications in everyday use.

UQ research team has developed perovskite-MOF glass composite material with improved optical properties and stability. This composite is manufactured using scalable and cost-effective solid-state processing techniques. Compared to pure metal halide perovskite, UQ’s composite exhibits orders of magnitude brighter photoluminescence, with a high quantum yield and enhanced light emission. The material demonstrates exceptional stability, maintaining photoluminescence for over 10,000 hours underwater and more than two years in ambient temperatures. Additionally, the composite is resistant to heat, organic solvents, and mechanical stress, and it stabilises in a functionally favourable crystal phase. These properties make it suitable for practical applications in photocatalysis and white light-emitting diodes (LEDs). Our technology addresses significant barriers faced by metal halide perovskites, such as polymorphism, stability, heavy metal leaching, and deep trap electronic states. The composite material also provides in situ heavy metal sequestration, further enhancing its practical utility. This innovation is protected by national phase patents and is available for licensing, investment, and collaborative research opportunities.

This presentation explores the evolving role of Micro LED and other technologies in shaping the future of automotive screens, displays, and lighting. It focuses on how luxury automotive brands are redefining customer experiences within digital cockpits by prioritizing exclusivity, simplicity, and delight. Key insights address the importance of creating timeless digital experiences that integrate seamlessly with high-performance vehicles, balancing cutting-edge design with user-centric functionality. Attendees will gain an understanding of how Micro LED advancements are transforming in-car displays, with a focus on minimizing interface frustration, reducing overwhelming options, and curating content to meet customer expectations. The presentation also highlights strategies for designing hardware and systems that age gracefully, maintaining their aesthetic and functional appeal over time. This session provides actionable insights for professionals interested in leveraging innovative display technologies to elevate automotive user experiences.

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With the growing popularity of electronic Paper (“ePaper”) and the increasing need to deploy sustainable signage solutions, Jonathan Margalit will review the latest advancements in ePaper technology. With the introduction of new color platforms and sizes, Jonathan will discuss the pros and cons of ePaper technology and go over examples of use cases and deployments in retail, hospitality, public information, DOOH, and others, followed by a Q&A session.

Quantum Dot (QD) materials are emerging as promising candidates for color conversion in MicroLED displays, offering significant advantages over traditional RGB emitting backplanes. The Fraunhofer IAP has developed exceptionally stable QDs with enhanced properties, including high quantum efficiencies under blue illuminance and improved solubility for ink formulation. These advancements are crucial for the practical application of QDs in display technology. Furthermore, the talk will showcase the application of EHD-Jet printing techniques to achieve high-resolution printing of 10 µm and less, even on multi-nozzle systems. This demonstration paves the way for future up-scaling to industrial processes, potentially revolutionizing the manufacturing of MicroLED displays.

Microdisplays” exhibit pixel densities of significantly more than 1000ppi at screen sizes of about 0.1..1.4". Therefore, they have become key components for assisted-, augmented-, virtual and mixed-reality (short: extended-reality “XR”) devices. Specifically, their use in wearables (e.g., Smart Glasses) or electronic viewfinders puts strong performance requirements on such components, due to limited space, weight and battery capacity, e.g., in spectacles’ frames. Particularly, "emissive" microdisplays, comprising light AND image source in a single component (e.g., OLED-on-silicon, or LED-on-silicon) are able provide very small footprint, and consume ultra-low power only for long battery life, while maintaining maximum pixel count for high-resolution screen content. This talk is to summarize recent microdisplay backplane IC design and frontplane light source as well as optics integration approaches and achievements towards future all-day wearable XR devices.

The present work describes a method for the RGB handling and the electrical bonding of Micro-LED arranged onto a host substrate emulating a display. The assembly technology will be presented which relies on a three-step sequential soldering for RGB-connecting of several thousands of small-sized (ca. 20x20 µm) LED mechanical chips mimicking "RGB" source LEDs to a large substrate in a 150x150 matrix array, leading to a 99.5% success rate at R&D scale.

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As the AR market diversifies, each device category must address distinct user priorities—from ultra-low-power, 24-hour wearables to advanced headsets demanding high-fidelity tracking—making adaptability paramount. A single, universal AR design is neither realistic nor desirable. Instead, eye-tracking solutions must seamlessly align with varying form factors, power constraints, and performance requirements. In this talk, we explore how Inseye’s photosensor-based technology meets these demands - delivering ultra-low power consumption and compact form factors for everyday wearables, unlocking AI-driven contextual awareness, leveraging 1000Hz tracking insights and making user experience more natural. Learn how flexible eye-tracking fits diverse priorities across the AR spectrum, enabling truly intuitive, context-rich experiences without imposing a one-size-fits-all design.

MicroLED technology has the potential to revolutionize augmented reality (AR) glasses by offering high-performance displays, but its success depends on aligning with the needs of AR developers and the markets they serve. In this talk, I will share insights from an AR system developer’s perspective, focusing on the role of MicroLED in various AR use cases across industries. We will discuss: Optical layouts and system architectures in AR glasses, Critical microdisplay requirements: resolution, brightness, efficiency, size, and power consumption, How MicroLED can be best implemented to address the unique challenges of AR systems,Key factors that MicroLED companies should consider to deliver added value for AR developers and differentiate themselves from alternative display technologies.By understanding the expectations and constraints of AR system development, MicroLED technology providers can better position their solutions to drive adoption, attract AR developers, and unlock opportunities across diverse markets, from consumer electronics to medical, defense, and industrial applications.

High efficiency of near-eye-display optics is achieved by maximizing light coupling between its’ three main components: the image generator, the collimating optics, and the waveguide itself. Image generator based on microLED have relatively large area and high beam divergence, thereby generating light beams characterized by high Etendue value. Inherent properties of reflective waveguides enable efficient coupling of these beams despite their high divergence (Etendue). This talk will review these properties, while reviewing the waveguides architecture and method of production. For comparison, the talk will also include ‘back-of-envelope’ efficiency calculation assuming various image generators (micro-LED or LCOS) when implemented onto the various waveguides (reflective or diffractive). In doing so, we will consider standard optical parameters such as aperture size, F-number or dispersion, and their individual impact on total system efficiency.

Micro LED technology is revolutionizing the display industry with its exceptional brightness, energy efficiency, and scalability. This presentation explores the Micro LED driver IC technologies behind Micro LED advancements and their integration into diverse applications, including automotive displays, transparent displays, and large-scale installations. By addressing key challenges such as miniature circuitry, mass transfer, and cost-effectiveness, we highlight the possible innovations enabling Micro LED to meet the demands of various industries. Join us as we delve into how Micro LED is shaping the future of display technology, offering unparalleled performance and unlocking new possibilities across applications.

AR see-through applications challenge the display design as it is desired to provide digital layered
information on top of the see through view of the user, in the same way as a human vision. It is not
trivial to create displays as the native human vision in terms of field-of-view (FoV) size, and foveated
resolution distribution. A common practice is to use high-resolution, large arrays of display (e.g.,OLEDs, micro-LEDs, DLP, etc.) so that the resolution could meet the fovea native resolution, and the size of the display to meet the FOV requirement. However, such a practice is not optimal. The large
displays are costly and consume more power, as they need more light to provide sufficient brightness. An elegant solution for the foveated resolution was proposed previously, utilizing Laser-Beam-Scanning (LBS). In LBS displays present a paradigm shift in pixelization, as in LBS it is done by using timing and not fixed elements. LBS it time based display whereas standard displays are positioned based. That said, the agility and flexibility of pixel-wise scanning propose a smaller, cost-effective alternative to array-based displays. Maradin presents a novel LBS system that enables innovative content display capabilities to see-through AR displays. These capabilities surpass state-of-the-art display technologies and bring a new paradigm for utilizing LBS in high-end see-through devices.

Our group is in the process of developing　a display that excites fluorescent materials with ultraviolet (UV) μLED to obtain full colors. At the same time, we have examined the application of three types of visible LEDs (i.e., red, green, and blue). We have used Al x In y Ga 1-x-y N-based materials to prepare red, green, and blue (RGB) μLEDs and conducted comparative evaluations of their electrical characteristics with that of UV μLEDs. The result showed that, for a size of 24 μm × 48 μm, the external quantum efficiency (EQE) of the red μLED at the current density of 25 [A/cm 2 ] was 2.0%. Moreover, for a size of 12 μm × 24 μm, the EQE of the green μLED at the same current density was 17.6%, while that of the blue and UV were 23.2% and 21.5%, respectively. Compared to UV μLEDs, not only the miniaturization of red μLEDs is more difficult, but EQE is significantly inferior, the drive voltage differs depending on the emission color, and electrical characteristics vary widely. In addition, since the wavelength shift due to current dependence is large, it was confirmed that there are many problems to be solved for display.

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Nanoimprint lithography (NIL) is a powerful technique for nano-structuring inorganic materials by patterning sol-gel liquid formulations and colloidal suspensions onto a surface. Originally inspired by embossing techniques, NIL was first developed for processing soft polymer materials, either as final functional components or as intermediate layers in fabrication processes. Over time, this method has been fully adapted to hard, inorganic materials with high dielectric constants, such as metal oxides (e.g. SiO2, TiO2). Thanks to the versatility of sol-gel chemistry, NIL enables the structuring of a broad range of chemical compositions, making it a highly flexible and precise fabrication method. Due to its capability to produce nano-scale patterns with excellent resolution and reproducibility, NIL has matured into a scalable, high-throughput technique with significant potential for industrial applications. In this work, we will first introduce the fundamental principles of sol-gel dip-coating and NIL, focusing on their application to metal oxides such as SiO₂, TiO₂, and ZrO₂. These materials offer the possibility of achieving high-refractive-index coatings, with values reaching up to 2.57 for dense TiO₂. We will then discuss some of our recent advancements in this field, including the fabrication of both ordered and disordered optical metasurfaces, structural coloration effects, and anti-reflection coatings designed for both flat and curved surfaces. Finally, we will demonstrate the scalability of NIL, showing that the method can be successfully extended to large-area substrates, including 200 mm wafers of silicon and glass. This capability allows for the production of both ordered and disordered nanopatterns with high fidelity and reproducibility, further establishing NIL as a key enabling technology for future advancements in structural colour, metalenses, AR, sensing and much more.

Thin film emitters in the form of microleds had great promise but could not deliver due to challenges in solving the mass transfer problem. TPR’s nano emitter technology does not need mass transfer. TPR will present both monochrome and full visual spectrum devices with enhanced EQE are presented with the projected fabrication process.

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The next-generation displays built on nitride-micro-LEDs aim to provide high brightness and resolution covering a large display area. They therefore require driving transistors in their active-matrix arrays capable of delivering a high current density within a limited footprint and can be fabricated cost-effectively over a large-area substrate. We show that ordered defect compound semiconductor CuIn 5 Se 8 , which forms regular defect complexes with defect-pair compensation, can simultaneously achieve high performance and scalable solution processability. After printing from their molecular precursors which decompose after a low temperature (370 o C) annealing, the uniform thin films of CuIn 5 Se 8 can be incorporated as the semiconductor channel of thin-film transistors, exhibiting defect-tolerant, band-like electron transport supplying an output current above 35 microamperes per micrometer, with a large on/off ratio greater than 10 6 , a small subthreshold swing of 189 ± 21 millivolts per decade, and a high field-effect mobility of 58 ± 10 square centimeters per volt per second, with excellent device uniformity and stability, superior to devices built on its less defective parent compound CuInSe 2 , analogous binary compound In 2 Se 3 , and other solution-deposited semiconductors. CuIn 5 Se 8 transistors can be monolithically integrated with carbon nanotube transistors to form high-speed and low-voltage three-dimensional complementary logic circuits with a short stage delay of 75 ns under a low supply voltage of 6 V. They can also be fabricated directly on top of GaN micro- LED arrays under a low thermal budget. Their high performance allows them to drive these micro-LEDs to a high current density above 200 amperes per square centimeter and realize high-resolution active-matrix displays with pixels per inch greater than 500.

Micro-LED is known as the best display technology for the next generation displays, however real commercialization has been repeatedly delayed due to lack of advanced process technologies. Besides the mass transfer, RGB integration and enhancing efficiency of the small LED die appears more critical to be resolved. The biggest hurdle for RGB integration is making small red LED die having comparable efficiency to the blue and green. AlGaInP native red, quantum dot, and InGaN reds have been widely attempted. While AlGaInP red appears to be a strong contender, however, fatal disadvantage is an outrageously low efficiency due to sidewall defects formed by mesa dry etching, thus, defect-free mesa etching technology has been highly sought. Recently, we have achieved a crucial breakthrough in developing mesa etching of the AlGaInP native red micro-LED by “defect-free” wet chemical etching. In the past most of the efforts have been focused on the post dry etching recovery, However, they are helpful for partial recovery only. More importantly, they are not effective for the small die because sidewall defect penetration depth is close to or excess of the micro-LED die. According to our cathodoluminescence results, the sidewall defect penetration depth of the dry etched micro-LED is more than 7 m, while it is less than 0.2 m for the wet etched micro-LED. Thus, effective mesa area of the dry etched red micro-LED is only 28% of the wet etched, which implies that almost no or negligible number of defects exist in the wet etched red micro-LED. Further, our wet etching is capable to etch thicker than 6 m AlGaInP epi layers with etch rate similar to dry etching. In particular, it is one-step etching for any combination of binary, trinary, and quaternary compound semiconductor alloys without need for multiple photo-lithography processes. The chip sidewall is highly vertical and anisotropic; thus, no undercuts are observed after mesa etching. Both defect-free etching and promising etch profile results indicate that our wet etching technology is ready to apply for mass production process for mesa etching of the phosphide-base native red micro-LEDs.

The company's PERCEPT technology, based on the Single Photon Active Event Sensor (SPAES), enables low-power, low-latency eye tracking and spatial awareness for intuitive human-device interaction. The patented SPAES architecture implements efficient 3D perception through a laser-beam scanner that generates and detects sparse optical signals with single-photon sensitivity. The system samples signal locations at up to 100e6 samples per second through a serialized triangulation system. Key features include robust ambient light compensation and immunity to optical interference. The technology supports both depth sensing and eye-tracking applications.

The evolution of MicroDisplay technology is driving a new era of smart glasses, ranging from information-focused wearables to fully immersive Augmented Reality (AR) solutions. This talk will explore the role of passive Microdisplay in applications that require minimal yet effective visual overlays—such as displaying real-time stats, GPS navigation, health tracking, and sports performance metrics—while also examining the breakthrough potential of high-resolution self-aligned MicroDisplay for ultimate
AR experiences. For information-driven glasses, power efficiency and clarity are paramount. Passive Microdisplay provides a low-power, high-contrast solution for delivering critical information without unnecessary visual clutter, ensuring extended usability and seamless integration into everyday wearables. These displays are ideal for applications like navigation assistance, fitness tracking, and enterprise data visualization, where discreet yet effective data presentation enhances user experience. On the other end of the spectrum, achieving truly immersive AR experiences requires a leap in display technology. By leveraging a high-resolution, self-aligned manufacturing process, CMOS based MicroDisplay solutions enable ultra-compact form factors while
delivering exceptional brightness, contrast, and image clarity. These advanced displays bridge the gap between digital and physical environments, ensuring a natural and interactive experience suitable for next-generation AR applications.
This discussion highlights the necessity of tailored MicroDisplay solutions, demonstrating how passive MicroDisplay can optimize power and functionality for lightweight information glasses, while high-resolution self-aligned MicroDisplay drive the future of
AR immersion. Attendees will gain insight into the latest technological advancements, industry trends, and the strategic development of displays that align with the evolving needs of wearable and AR technology.

For AR/VR applications, the display panel requires exceptional brightness to perform in outdoor sunlight and offset transmission losses in complex optical systems. However, driving OLEDs with high brightness conditions reduces their lifetime. Segment-type PMOLED can show excellent high brightness with a distinct application advantage through ongoing improvement in OLED materials structural design, and panel encapsulation. PMOLED’s simpler display circuitry allows greater flexibility in panel layout. Optimized process design integrates diverse display elements—high-transparency regions, reflective arrays, pointers, dots, and medium-transparency Icons—each with unique structural and process requirements. By refining optical application solutions and combining these structures, we minimize stray light during panel production, ensuring superior brightness and display quality.