This is a special one day event combining networking with learning and discussions on two themes: (1) screen printing and (2) in-mold electronics.
In this page you can learn more about the activities around in-mold electronics. On the link here, you can learn more activities on screen printing in printed electronics
InMold Electronics is one of the most exciting technologies, enabling the reshaping of electronics into complex 3D shapes combined with mass production ability. The technology however faces a number of challenges to enable widespread adoption.
In this 1-hour session, the following panelists will each first give an update on the state of the art in their respective domains before outlining the open challenges and questions. We will then have a faciliated and open Q&A session.
The panelists include:
Antti Keränen, CTO of Tactotek focusing on status of IME process and roadblocks to commercialization
Dirk Pophusen from Covestro focusing on status, challenges, and open questions for IME substrates [film aspects]
Marius Nolte Covestro focusing on status, challenges, and open questions for IME substrates [resin aspects]
Rahul Raut from MacDermid focusing on Ink portfolio challenges and status for complex IME products
Robert Boks from Panacol-Elosol GmbH focusing on status and challenges of component attached in IME environment and on 3D shapes
Hans-Peter Erfurt from Proell GmbH covering "From Insert Molding to InMold Electronics: Challenges & Opportunities"
The panel will seek to address the following questions and more:
we will design a panel to review the latest and address the following issues:
Material Compatibility: Ensuring that the materials used in IME, such as conductive inks and substrates, are compatible with the molding process.
Reliability: Ensuring the durability and reliability of in-mold electronics under various mechanical stresses, including bending, stretching, and impact.
Design Complexity: Managing the design complexity associated with integrating electronic components within a molded structure, including component placement and interconnections.
Manufacturing Yield: Improving manufacturing yield and reducing defect rates in in-mold electronics production.
Process Integration: Streamlining the integration of in-mold electronics manufacturing processes with existing molding and assembly techniques.
Cost-Effectiveness:
Standardization: Developing industry standards and best practices for in-mold electronics design, materials, and manufacturing processes
IP and licensing issues
Status of adoption by various industries like the auto industry
There will also be an open discussion about the future challenges facing the industry. The aim of the meeting is open discussion and active engagement facilitated by our experts.
Do NOT miss this chance to participate in this event. This is the place to learn and together advance structural electronics together.
Leader
Khasha Ghaffarzadeh
CEO
InMold Structural Electronics Workshop
The panelists include:
Antti Keränen, CTO of Tactotek focusing on status of IME process and roadblocks to commercialization
Dirk Pophusen from Covestro focusing on status, challenges, and open questions for IME substrates [film aspects]
Marius Nolte Covestro focusing on status, challenges, and open questions for IME substrates [resin aspects]
Rahul Raut from MacDermid focusing on Ink portfolio challenges and status for complex IME products
Robert Boks from Panacol-Elosol GmbH focusing on status and challenges of component attached in IME environment and on 3D shapes
Hans-Peter Erfurt from Proell GmbH covering "From Insert Molding to InMold Electronics: Challenges & Opportunities"
RISE Research Institute of Sweden
Peter Andersson Ersman
Senior Scientist, Project Manager
[Talk] The rise of screen printed electronics: components, systems and applications
RISE Research Institutes of Sweden develops a broad range of printed electronic components and systems on flexible substrates, most often by solely using screen printing for the deposition of the materials. Electrochromic displays, organic electrochemical transistors and sensors are all examples of components in which improved performance and high manufacturing yield recently have been demonstrated, thereby allowing for further utilization within flexible electronics upon system integration. The presentation provides an overview of this development: device architectures, materials, screen printing processes, system integration, device characterization and application areas.
Sefar
Daniel Gilsdorf
Vice President Sales
[Talk] Innovations in screen making technologies, especially to support fineline screen printing [TBC]
Suzhou Maxwell Technologies
Peter Wolf
VP Sales Overseas
[Talk] Latest developments in screen printing in photovoltaics (PERC, HJT and IBC PVs)
e2ip
Fernando Zicarelli
Product Manager of Printed Electronics
The Future of Screen Printing for Printed Electronics Panel
Curated by Mr. Fernando Zicarelli, this distinguished panel brings together world-class experts in screen printing for an interactive and insightful discussion.
The panelists bring a combined industry experience of more than 100 years. They include:
Ron Hayden from RH Solutions LLC with a focus on Screen Printing and Auxiliary Equipment
David Eisenbeiss from Kissel + Wolf Group with a focus on emulsion Technology, including the latest Laser Imaging developments
Fernando Zicarelli from Fernando's Consulting (formerly at Asada Mesh) with a focus on Mesh Technology and Tooling
Erika Rebrosova from Sun Chemical with a focus on functional ink technology
Julie Ferrigno from e2ip focusing on on applications for fineline screen printing
A review of the different materials meshes being used in the Screen Printing Industry from synthetic to metallic. Fernando will give us his opinion on their capabilities and his own experiences using them.