Display Innovation Day

The increasing standardization of AR devices based on waveguides has brought attention to the importance of designing and ensuring the durability of waveguides. While ultrashort pulsed lasers hold promise for achieving precise and strong free-form cutting at scale, optimizing the laser process parameters and material compositions of high-index glasses remains a challenge in achieving optimal glass strength. To address this challenge, we have partnered with a reputable producer of specialized glasses to develop a separation process that prioritizes high and predictable bending strength. This process has been integrated into a modular machine concept, allowing for scalability from lab to mass production. Our presentation offers an overview of this fully automated machine solution designed for cost-effective free-form cutting of high-index glass used in AR waveguides. It highlights the thoughtful considerations behind the development and demonstrates how our various process, handling, and quality inspection modules offer high flexibility and scalability.

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ATLANT 3D technology has opened new horizons in the field of micro-optics, offering transformative capabilities for the fabrication of highly complex optical components. ATLANT 3D's technology employs a direct-write approach that enables the deposition of advanced materials at micro-scale resolutions. This precision is essential for applications in photonics, sensors, augmented reality (AR-VR), and biomedical devices, where micro-optical structures are critical for improving functionality, miniaturization, and efficiency. By integrating additive manufacturing principles with micro-fabrication, ATLANT 3D technology eliminates the need for traditional photolithography processes, thus reducing production costs, complexity, and time-to-market for micro-optic devices. The technology’s versatility allows for the direct deposition of multiple materials in a single workflow, facilitating the design of hybrid optical systems with custom properties. This approach not only enhances the performance and adaptability of micro-optics but also broadens the potential for innovation in optics-driven industries. This talk explores the fundamental principles behind ATLANT 3D technology and its significant role in advancing micro-optics applications. It discusses the advantages of this approach and provides insight into its impact on future developments in photonic and optical systems.

This talk gives an overview of color measurement solutions for MicroLED displays. They are essential for ensuring accurate and consistent color reproduction.

Explore how printable piezoelectric polymers are changing the field of sensors. With their ability to convert forces, pressures and mechanical waves into electricity, these advanced materials offer more efficient, precise and durable solutions for a wide range of industrial and technological applications, including human-machine interfaces, sensors for sport and health, and structural control. Join us to explore the competitive advantages they bring to your products.

Organic Photovoltaics (OPV) is a solar energy technology made from earth-abundant materials and is mass-producible at low cost using Roll-to-Roll (R2R) printing methods. OPV is capable of efficiently harvesting light energy in both indoor and outdoor environments while being lightweight, flexible, and partially transparent, enabling a wide range of applications. The light-harvesting layer, or “active layer” of an OPV device is critically important and consists of a blend of two or more organic semiconductors. Modern active layer materials have achieved power conversion efficiencies of ~20%, demonstrating the potential of this technology for widespread use. For mass production, the synthesis of active layer materials should be scalable, sustainable, and Repeatable. This talk will cover advancements in the scale-up production of our Generation 1 (G1) active layer materials for use in large-format OPV panels. The importance of low batch-to-batch variability for the mass production of organic semiconductors will be discussed, along with preliminary results in printed devices.

The global trend for smarter devices has led to a surge in the use of electronic functions often represented by printed circuit boards (PCBs), which contribute to about 7% of global electronic waste (E-waste). Printed electronics technology, utilizing low-impact additive manufacturing techniques, offer a promising alternative to conventional PCB processes as presented by multiple life cycle assessments (LCA) studies. These techniques, thanks to their low thermal budget and reduced chemical use, allows the fabrication of PCB on a variety of lower environmental impact substrates such as cellulose based materials. In CEA-Liten, we address the challenges of high-density multilayer printed PCBs by developing a four-metal layer flexible printed PCB with over 100 thru-hole vias and components assembly on both sides. This approach broadens the applications of printed PCBs to consumer electronics markets, promoting more sustainability in electronics manufacturing and addressing its end of life.

Inorganic Halide Perovskite Thin-films are evaluated as color-conversion layers (CCL) for MicroLED displays. Green and Red-emitting, thin-film CCL exhibit very narrow emission band, opening the possibility to covering 90% of the color space defined by Rec. 2020. They show very high absorption which allows to envisage CCL thicknesses of only ~ 500 nm, which paves the way to reaching pixel-pitches below 1 µm. These films exhibit very promising stability under high optical power. They appear to be very well suited for high demanding Augmented and Mixed reality applications.

Electrical resistance heating is an efficient way of applying heat directly to the surfaces requiring it. Also referred to as Joule heating, such devices can take many forms. Printed conductive inks and pastes present a versatile approach to apply heater patterns and electronic circuitry onto a variety of substrates materials like metals, textile fabrics, rigid and stretchable polymer films, leather and many more. Providing uniform heating power over a large area efficiently directs the heat to the intended surface without the need for heat spreaders or padding to prevent the heater being seen or felt. The heating elements can be printed with fixed resistance pastes, or positive temperature coefficient of resistance (PTC) paste can be used to reduce power as operating temperature is achieved and to reduce overall power consumption.

New laser induced forward transfer to be used as digital fabrication method for high viscous and big particle in combination with energy efficient laser drying.

Displays are our window into the connected world. Nearly every consumer device today has a display. Lasers play an essential role to produce state-of-the-art displays especially when it comes to high-end high-resolution displays. Today we are talking mainly about OLED displays for smart phones, next will be the adoption of OLED displays in the IT sector, and beyond there is an incremental market opportunity for MicroLED displays from the very small range in AR to the very large 4K TV market. Over the last years more and more UV short wavelengths lasers are implemented and required in the production due to the display material combinations, increase of active display areas, and pixel sizes down to the Micron level.

The conductive ink market is undergoing significant transformations driven by advancements in technology and growing demands for efficient, cost-effective solutions. While silver-based conductive inks have long been the standard, their high cost, limited availability, and sustainability issues are raising concerns across the industry. This session will explore the current state of the conductive ink market, highlighting the economic and environmental challenges associated with silver. We will delve into the potential of copper-based conductive inks as a viable alternative, discussing recent innovations, performance comparisons, and market trends. Attendees will gain insights into how copper-based solutions can address the pressing issues of cost and sustainability, offering a more stable and eco-friendly option for future applications. Join us to understand how transitioning to copper-based inks can help industries navigate the uncertainties of the conductive ink market and achieve long-term resilience.

Presentation of coated PET substrates that combine printable and hydrophilic properties. Currently mainly used in biosensor strip manufacturing, recent approval for skin contact opens up to wearable applications.

When things have to be attached together, glue offer several advantages in our daily life. In highly automated industrial mass production processes glue is called adhesive. Adhesives are functional polymer materials, which offer several benefits and can be tailored to customers process and needs. The shrinking pad and pitches for upcoming miniLED and microLED necessitate new conductive materials, which can be dispensed on rigid as well as flexible substrates. Besides the electrical and mechanical connection, functional polymer materials offer versatile dispensing process capabilities. In contrast to isotropic materials mask openings can be increased and lead to smoother printing process.

DuPont’s silver nanowire-based Activegrid® inks and films deliver excellent optical clarity, conductivity, and flexibility, making them ideal for a wide range of automotive applications. These include transparent heaters, smart surfaces, LiDAR systems, in- mold electronics (IME), transparent EMI shielding, and infrared (IR) reflection. Activegrid® inks can be applied onto diverse substrates such as polycarbonate (PC), polyethylene terephthalate (PET), cyclic olefin polymer (COP), polyimide (PI), glass, and more, possibly at low process temperature (less than 60 °C). These inks are compatible with various solution coating techniques, including spray, dip, flow coating, and roll-to-roll slot-die processes, allowing application to both flat and curved surfaces with ease. In addition, DuPont offers Activegrid® films as a pre-coated film product on various substrates with Activegrid® inks, which can be laminated or molded onto target surfaces to meet specific design needs. By leveraging DuPont’s silver nanowire technology, we enable cutting-edge innovation, driving the development of next-generation automotives.

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The pursuit of a more resource-efficient society is driving digitalization, leading to a rapidly growing need for connected sensors. These sensors typically rely on batteries, necessitating costly maintenance to replace them every few years and contributing to a significant negative environmental impact. By harnessing ambient light, the lifespan of batteries can be extended, and in many cases, make them obsolete. While this concept is straightforward in principle, this new technology comes with integration challenges. With this in mind, a vertically integrated light energy harvesting platform based on state-of-the-art hybrid electronics circumvents many challenges associated with integration complexity and creates a plug & play solution, dubbed the self-charging battery.

With the increasing demand for wearable sensors and smart devices, printed electronics has gained momentum in the recent years. Printed electronics offers more flexible, thinner and lighter products compared with traditional technologies. Choosing the right transfer technology for conductive and nonconductive adhesives is a challenge. Attributes like particle size, form, metal load, density, etc., have an enormous influence on rheology and, consequently, on the dispensability of the adhesives. The parametrization and transfer technology shall be chosen and adjusted accordingly. In this talk, we will discuss how Essemtec can help you choose the right dispensing–jetting technology to address your challenges. Test cases will be presented, along with a glimpse of our solutions and know-how.

Novel dielectric materials that are polymer-nanocomposite based are now available for use in additive manufacturing products. Lightweight and thermoformable, the Wave-Pro material is the next generation dielectric material for a variety of different antenna and space applications. Using the Micropen to direct write patterns on thermoformed shapes has opened the door to a wide range of technology options where bare alumina was unable to compete. The direct printing system, Micropen, is a CAD/CAM driven capillary dispensing tool akin to an ultra- precise micro-dispense gun. If a material is flowable and can be loaded into a syringe, the Micropen can print it onto virtually any surface. It’s a non-contact, additive printing technique that dispenses the precise amount of material needed. This makes it beneficial when using novel, expensive or rare inks. The efficient use of materials and the ease of changing them provides product designers with increased prototype control as well as reducing time-to-market. Direct printing is an ideal way to form many different patterns on 2D substrates giving them superior electrical characteristics. However, the capabilities of the Micropen don’t stop at 2D substrates. Printers have been designed with 5-axis of movement. This allows many different medical device form factors to be printed such as thin, flexible, irregular, and highly three-dimensional shapes. This talk will provide an overview of the Micropen additive dispense integration of the new Wave-Pro material set and custom CMI formulated ink system.

Focal Plane Array (FPA) imaging and detector devices, such as infrared (IR) thermal imaging sensors, Quantum computing processors and micro LED displays are seeing higher demand as more practical applications requiring these components are coming into research and development, military, industrial and consumer markets. This paired with higher pixel and Qubit count and interconnect density on larger and larger chips is driving hybridization and monolithic integration in these technologies. This is showing a marked increase in demand for fine pitch micro Indium Bump Interconnect (IBI) flip chip die bonding. However, some critical challenges facing these technologies are: larger component sizes mean higher density interconnections over increasing surface area. Sub-micron accuracy is required to align fine pitch micro interconnect arrays. This together with the challenges facing the materials that are becoming the industry standard for these applications, such as the requirement for the assembled components to remain stable in extreme conditions such as cryogenic application environments, combined with low loss high strength mechanical / electrical interconnect requirements on components containing sensitive materials, structures and unmatched coefficient of thermal expansion (CTE) means that processing gases such as formic acid or high temperature reflow bonding can no longer be used to bond these devices. These challenges mean that the industry is fast approaching the limitations of even state-of-the-art die bonders and die bonding methods on the market today. This paper is going to highlight these challenges and the methods used to address them to produce large format, high density Infrared (IR) thermal imaging devices, Quantum processors and micro LED displays using fine pitch micro Indium Bump Interconnections (IBI) that meet today's industry requirements.

Technologically advanced problems demand technically advanced solutions. This session will highlight the capabilities in contract manufacturing and R&D services within the field of printed electronics. Emphasis will be placed on providing customer-tailored solutions, from monitoring temperature in battery stacks to 12m high bioreactors. Leveraging a state-of-the-art technology park, innovative concepts can be transformed into practical, real-world applications. Attendees will gain insights into how cutting-edge capabilities are employed to turn ideas into reality.

In aviation industry, there exists an increasing demand for structural health monitoring (SHM) of carbon fiber reinforced composite materials (CFRP), which are needed for aerospace structures because of their unique stiffness to weight ratio. The challenge in such a context is to integrate smart systems in composites for lightweight constructions using different sensors without mechanically changing the structural behavior of the host structures (low weight addition and as small as possible stiffness modification). Innovative printing technologies allow the integration of printed sensors in composite parts and components by satisfying these criteria. For this purpose, manufacturing and integration process of sensors in composite parts using printing technologies was investigated. Piezoelectric sensors as well as temperature sensors were deposited directly on composite aeronautics parts representative of the aeronautic industry using screen printing and Aerosol Jet printing technologies. As an architecture network, printed individual sensors can be connected to an overall system.
The great advantage of printing technologies is the possibility to deposit customized sensor structures directly on planar and non-planar surfaces. The usage of printing technologies results in a great accuracy, reliability, and cost reduction also in a later production process. The development of electrical conductive composites allows the deposition of conductive paths between the sensor structures on the part and finally a connection to the power supply unit. This allows for the realization of a complete sensor structure with low added weight and low intrusivity with respect to the host structure. The sensor technology platform itself offers a broad range of variations of piezoelectric sensor candidate architectures into manufacturing process. The printed sensor network consists of several connected piezoelectric sensors, which build a dynamical load and displacement sensitive element. To detect, localize, classify and quantify damage to CFRP parts, composite aeronautic structural elements may be monitored using data from such printed sensors. This innovative sensor technology can thus be used for SHM by providing a complete and continuous observation of the whole system in the aircraft, but also in any other application area having similar requirements.
Printed piezoelectric sensors can be used to detect and monitor structural deformation, damage, or fatigue in aircrafts, helping to ensure the safety and reliability of the aircraft. Furthermore, it can be used to monitor the vibration of aircraft engines, providing early warning of potential issues and helping to prevent costly engine failures. Printed temperature sensors are able to monitor temperature changes even in inaccessible places in engines. Overall, the use of printed piezoelectric sensors in aeronautics can help to improve the safety, efficiency, and performance of aircrafts.

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Hamamatsu Photonics offers a wide selection of NIR semiconductor lasers along with beam shaping optics for sintering of metal particle based inks in the manufacture of printed electronics. These lasers offer several advantages like high energy efficiency, selective heating of inks, easy power scalability and long lifetimes which make them interesting for end use customers as well as system integrators. Hamamatsu Photonics has also developed process know-how on sintering of metal particle based inks to support prospective customers to test our lasers for sintering and to develop custom solutions.

Over the past five years, Heraeus Printed Electronics has developed the Prexonics turnkey solution that enables selective inkjet printing for semiconductor mass production. The technology has now been successfully established in a mass production environment. This approach is the answer to the industry's increasing demand for design flexibility and efficiency, particularly in the context of miniaturisation. Join us for an insight into the journey from lab scale to mass production, highlighting key milestones and challenges along the way. Discover how this innovation is shaping the future of semiconductor manufacturing.

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Every day there is more news about microLED manufacturers planning to scale up their microLED production. What will it take to get the industry over the hump, and past the pilot line phase to widespread mass production? In this presentation, we will offer a brief overview of the challenges in microLED inspection, why Electroluminescence (EL) must be adopted as the testing methodology for improving yields, and how InZiv’s technology overcomes the previously seemingly insurmountable obstacles.

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At JOANNEUM RESEARCH, we have built-up comprehensive know-how over the years that enables us to design, develop, and manufacture highly complex sensor systems based on electro-active polymers. Due to our end-to-end system expertise, which covers the entire value chain from device fabrication, bonding, and signal processing to system integration as well as software development, we are offering tailor-made solutions for your specific application. By means of our pilot-line, these highly complex systems can now be realized in a customer-friendly and efficient manner. Our technology can be applied to most versatile surfaces and covers a wide range of applications, including monitoring of industrial production processes (precise pressure distribution measurements; vibration measurements for condition monitoring), surveillance of material conditions in the field of structural health monitoring, as well as recording of vital parameters in healthcare (pulse, respiratory rate, balistocaridogram), amongst others. Furthermore, the system can be used as an innovative energy harvester that autonomously supplies energy to sensor nodes. Together with our partners who specialize in upscaling and mass production, we offer this technology as tailored product solutions across various market segments.

The application of augmented and virtual reality (AR/VR) devices is growing rapidly in industries as diverse as gaming, military, education, transportation, and medicine. The increasing importance of AR/VR technology demands control solutions that ensure visual performance. However, achieving a quality, seamless visual experience poses a challenge for device designers and manufacturers due to the limitations of measurement systems. Measuring the display characteristics of AR/VR headsets involves evaluating various parameters to ensure they meet the required standards for clarity, accuracy, and user comfort. To help manufacturers ensure display quality, various optical solutions comprised of AR/VR and XRE lenses paired with an Imaging Photometer or Colorimeter provide unique optics engineered for measuring near-eye displays, such as those integrated into virtual, mixed, and augmented reality headsets. The innovative new geometry of the lens design simulates the size, position, and binocular field of view of the human eye. Unlike traditional lenses where the aperture is located inside the lens, the aperture of the AR/VR and XRE lens is located on the front of the lens to enable the connected imaging system to replicate the location of the human eye in an AR/VR device headset and capture the entire FOV available to the user. The optical solution can be paired with a powerful software, which would enable analysing accurately different optical characteristics namely. 1. Resolution (The number of pixels per eye). 2. Field of View (FOV: The extent of the observable environment, measured in degrees). 3. Pixel Density (Pixels Per Inch – PPI - The number of pixels per inch on the display. Calculated using the resolution and the diagonal size of the display. 4. Optical Distortion: Distortion of the image caused by the lenses. 5. Colour Accuracy: The accuracy of the colours displayed compared to the real world. 6. Brightness and Contrast- The luminance of the display, measured in nits (cd/m²). 7. Image Clarity and Sharpness - Detail and clarity of the displayed to measure Modulation Transfer Function (MTF), which quantifies the display’s ability to reproduce fine details. By systematically measuring these characteristics, the manufacturers can evaluate the performance and quality of AR/VR displays accurately. AR/VR display test solution is an unique measurement system with unique optical components that replicate the human pupil size and position within AR/VR goggles and headsets to capture a display FOV to 120° horizontal. The system offers the high resolution and efficiency AR/VR device makers require, employing a compact camera/lens solution to capture all details visible across the near-eye display in a single image to quickly evaluate the human visual experience. Therefore, by leveraging advanced optical components and replicating human vision, AR/VR headsets can achieve high standards in display measurement, ensuring immersive and realistic user experiences.

One of the 'Holy Grails' of Additive Manufacturing is creating mixed metal and polymer composite objects at a scale and cost that goes beyond prototyping and directly competes with existing industry techniques. Our startup MAASS has developed a revolutionary solid-state manufacturing approach that eliminates all moving parts and contact-based processes, combining digital light projection, laser machining, and nano-ink metallization. Unlike traditional methods requiring inkjet printheads, physical masks, or contact-based tools, our system relies entirely on stationary optical and laser systems, enabling exceptional reliability and unprecedented material versatility. The process employs direct light projection and engineering resins with our patented material switching technology to create multi-polymer structures, while precision fiber lasers micro-machine and bond metal films enhanced by nano-inks. This robust, solid-state approach processes an extensive range of materials - from high-performance polymers to specialized metals - fabricating precision electronic components within complex structures at speeds and costs competitive with traditional manufacturing, but without the mechanical complexity and wear inherent to conventional methods

Based on its expertise in nanochemistry, the PRINTUP institute develops customized inks for several applications such as health and environment. Recently, we have developed an innovative grafting method on Ag nanoparticles allowing us the introduction of a wide range of functions on their surface. We have illustrated the potential of this methodology by producing inks with controlled and intense Raman signatures. Such inks have attracted great interest in recent years for their use as security labels in anti-counterfeiting applications. Indeed, they are promising alternatives to luminescent inks, which suffer from several limitations including emission peak overlap, toxicity and photobleaching. To overcome this issue, we develop a new generation of security labels based on silver nanoparticles (Ag NPs) functionalized by aryl diazonium salts, carrying various substituents (–NO2, –CN, –CCH) with distinguishable Raman fingerprints. The resulting tags were fully characterized by scanning electron microscopy (SEM), transmission electron microscopy (TEM), UV-vis absorption and SERS. Then, they were incorporated into ink formulations to be printed on polyethylene naphthalate (PEN) substrates, using handwriting or inkjet printing.

Nowadays adhesives are more than just simple fasteners and enable the implementation of new technological concepts. Various industries and a variety of applications are thus offered great growth potential. In the field of sustainable energy generation there are numerous tasks that can be addressed with the help of adhesives. In particular, the potential of novel photovoltaic technologies remains large in view of the increasing demand for alternative energy sources and has a direct influence on the success of the energy transition.Flexible photovoltaic technologies present a significant advancement in the solar energy sector, offering lightweight, adaptable and potentially lower-cost solutions in comparison to traditional rigid solar panels. A critical component of those OPV or perovskite-based systems is the adhesive material, which helps to ensure integrity, efficiency and longevity of the cells. In this talk we will focus on adhesives for encapsulation and electrically conductive adhesives, discussing their respective advantages and limitations in regard of the key requirements as mechanical support, electrical properties and environmental protection.

New 3D uLED-structures based on a novel bottom-up approach based on InGaN/GaN pyramidal quantum well structures. The pyramidal uLEDs are fabricated by means of a re-growth process on lithographically patterned SiN-masked GaN templates. Quantum wells on the facets of the um-sized pyramids act as the active emitters. The emission from pyramidal uLEDs have recently demonstrated with a high brightness and external quantum efficiency (EQE) in a wide spectral range. The high quality of homogeneous pyramidal uLED structures combined with a flexible design paves a promising route for uLEDs

Achieving high efficiency MicroLED based micro- and pico-displays still has many challenges. With desired pixel sizes below 5 micron this leads to significant challenges in re-combination to RGB display chips and low LED efficiency due to the large surface ratio of the LED chip edges to the LED emission area. It is possible to produce / grow an all nitride RGB LED chips by nano-patterned templated growth on a single wafer, e.g. nano-wire LEDs. This would eliminate the re-combination steps and increase LED efficiency due to damage free LED edges. To do so, there is a need to accurately pattern sub-50nm patterns with less than 1nm size variation and overlay alignment of ~ 500nm, preferably sub-100nm, on a wafer that is bowed and not flat anymore due to topology from previous LED growth runs. Accurate placement of the sub-pixels on the epi-wafer is also required when the LED chips are bonded to the driver IC’s. Any pattern distortions will add to potential losses due to bad connections. Conventional (deep) UV lithography uses light to define patterns and is therefore limited by the diffraction limit and related critical depth of focus issue. Nanoimprint lithography, or NIL, uses a physical process of a stamp that has the pattern information coded into it in height / depth. On stamp contact with the wafer, liquid resist will flow into the nano-features before hardening into a 3D inverse shape of the stamp. NIL therefore is not limited by the diffraction limit and can faithfully replicate complex shapes and features with sub-10nm resolution. The disadvantage with NIL is that intimate physical contact needs to be made over the whole wafer. To allow this, the industry has moved to stamps that are flexible in order to accommodate for wafer bow, thickness variations and topology. However, the flexibility of the stamp hinders the overlay alignment accuracy. We’ll demonstrate that by using the proper processes for stamp fabrication, the NIL step, stamp release and resist material systems, we are able to achieve sub-500nm overlay alignment over full 300mm wafers and show the potential to reach sub-100nm overlay alignment.

Silver based conductive ink is the backbone of the Printed Electronics. However, volatile silver prices necessitate the development of conductive inks with lower cost underlying Materials. Such an alternative must provide comparable conductivity while ensuring stable conductivity levels over time, and easy processability using conventional printing technologies (i.e.screen printing). Introducing a novel low-cost Saral Copper Ink, this presentation guides you through the high-demand application areas, discusses the benefits and addresses how to overcome challenges.

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Additive manufacturing of electronics offers substantial benefits for the packaging of next-generation semiconductor devices, such as miniaturization, design flexibility, and cost efficiency. We will review the state of the art of microdispensing, highlighting its advantages over existing fabrication methods. Additionally, we will discuss the challenges for the widespread use of microfabrication in production lines, such as yield and repeatability. We will provide practical solutions to overcome these limitations.

After experiencing a slowdown in 2022 and 2023, the augmented reality (AR) market is now poised for resurgence, fueled by compelling AI-driven use cases. At the same time, microLED displays are emerging as a superior solution for AR devices, providing the high brightness and energy efficiency essential for daylight visibility within sleek form factors. This talk will explore the technical challenges unique to AR display requirements and explain why microLED technology is expected to surpass established solutions like LCoS by 2028. We will also discuss the remaining efforts needed to drive this technology toward a projected $900M market by 2030.

Hybrid polymers have become valuable in industry due to their ability to merge glass-like properties with the processability of UV-curable polymers. These polymers feature a siloxane backbone covalently bonded with organic side chains, yielding isotropic materials through sol-gel synthesis. This method produces materials with superior optical characteristics, stability, and high transmission from visible to near-infrared wavelengths, making them ideal for micro-lenses, waveguides, and other optical elements. At the same time they hybrid polymers offer great flexibility concerning different manufacturing technologies from UV-replication to Inkjet printing. In this presentation we will highlight novel developments for highly reliable hybrid polymer products suitable for the most demanding applications