In this issue, we dive into technologies shaping the future of printed electronics and additive electronics, smart buildings, and additive manufacturing. From optimizing tool chains for 3D printed electro-mechanical structures to exploring low-volume manufacturing techniques for printed circuit boards (PCBs), this edition showcases advancements and practical applications. Featured companies include Siemens, Murata Manufacturing, Henkel, and BotFactory, each presenting innovations that are redefining industries. Learn how additive manufacturing and advanced materials are driving efficiency and sustainability in electronics production and smart infrastructure. Siemens | Optimizing the tool chain from Design through manufacturing for Printed Electronics Printed Electronics Ltd | Scaling up From Idea to Product With The PEL Open-Access Printable Electronics Production Facility Henkel - Laiier | Connecting surfaces of the smart building to the cloud with sensors enabled through PE Murata Manufacturing | Highly Conductive MXene for Electronics BotFactory | Exploring AM-PCBs for Low-Volume Manufacturing The Future of Electronics RESHAPED USA  is TechBlick's premier event, showcasing the latest innovations in electronics. Join us at UMass Boston on June 11-12, 2025  for an exciting exploration of emerging technologies. You can find more details on the event website   here. EARLY BIRD rates are available until December 20, 2025 – secure your spot now! Register here TechBlick.com S...

...

Author: Jesus Zozaya , CEO at Voltera | sales@voltera.io   As presented at the TechBlick Berlin event in October, our project, a multilayer magnesium zinc battery, validated the compatibility of Saralon’s battery inks printed on a PET substrate.

Watch our Video: Printing a Flexible Magnesium Zinc Battery with Voltera NOVA MATERIALS USED Saral Silver 600A Battery Ink Saral Carbon 700A Carbon Based Conductive Ink Saral Zinc 700 Battery Ink Saral MnO2 800 Battery Ink Saral BatBarrier 600 Battery Ink Saral HotMeltGlue 800 Battery Ink Saral BatElectrolyte 700 Battery Ink SUBSTRATES USED Polyethylene terephthalate (PET) TOOLS AND ACCESSORIES Voltera NOVA materials dispensing system Nordson EFD 7018302 dispensing tip (330 µm ID) Nordson EFD 7018107 dispensing tip (840 µm ID) Nordson EFD 7018260 dispensing tip (410 µm ID) Nordson EFD 7018333 dispensing tip (250 µm ID) Heat press machine Dual asymmetric centrifugal mixer Project Overview Purpose The purpose of this project is to demonstrate how we fabricated a functional multilayer printed battery on a flexible PET substrate, validating the compatibility of PET with a variety of conductive and insulating inks. Image: Printed flexible battery-powering lights in a breadboard Design layout Typically, a printed battery consists of five layers: Current collector layer for the anode Anode layer Separator layer with electrolyte Current collector layer for the cathode Cathode layer Image: Schematic for typical printed batteries We se...

Pyramidal µLEDs, Indium Bump Deposition, InGaN-Based Red Micro-LEDs, Laser and LIFT, VCs In this newsletter, you’ll learn about advancements in microLED technology, deeptech investment, laser-driven manufacturing, and cutting-edge microelectronics. You will also have the opportunity to download the full presentation slides. Polar Light Technologies | Pyramidal µLEDs – a novel - bottom-up concept delivering focused light emission Intlvac Thin Film | Indium Bump Deposition System Kaust | Challenges in InGaN-Based Red Micro-LEDs Technology Coherent  | MicroLED Display Volume Manufacturing Enabled By Laser Technology Imec.xpand | Opportunities and Challenges of Investing in Deeptech Startups The MicroLED Connect conference and exhibition will take place next year at the High Tech Campus in Eindhoven on 24 & 25 Sept 2025. You can learn more here   This year this show will be co-located with our inaugura l AR/VR Connect t echnology, covering all the key innovations in AR/VR display technology, from light engines to waveguides to optics.    EARLY BIRD rates are available until December 20, 2025 – secure your spot now! Register here TechBlick.com Polar Light Technologies | Pyramidal µLEDs – a novel - bottom-up concept delivering focused light emission Lisa Rullik | 2024 Our novel bottom-up concept based on InGaN/GaN uLEDs offers solutions to several challenges that the uLED development is facing right now, namely miniaturization of the die without efficiency droop, sufficient sma...

In this edition, we explore exciting breakthroughs shaping the future of electronics. Fernando Zicarelli (E2IP Technologies) dives into the design and challenges of screen-printed heaters, comparing resistive and wire heaters while spotlighting transparent heater advancements. Ram Prasad Gandhiraman (Space Foundry) shares insights into plasma jet printing and its applications in aerospace, tackling issues like adhesion and material performance. Shavi Spinzi (Nano Dimension) showcases the move from 2D to 3D Additively Manufactured Electronics (AME), unlocking new possibilities for compact, high-performing devices. Finally, Marco Galiazzo (Applied Materials) highlights how advanced screen-printing is revolutionizing medical sensor production, offering a cost-effective way to create wearable health-monitoring devices. E2IP Technologies | Screen-printing Heating Devices: Limits and Challenges Space Foundry | Precision digital plasma deposition: deposit multilayer structure without curing Nano Dimension | Roadmap for 3D AME Designs Applied Materials | Advanced Screen-Printing: Manufacture a Medical Sensor by Screen-Printing The Future of Electronics RESHAPED USA  is TechBlick's premier event, showcasing the latest innovations in electronics. Join us at UMass Boston on June 11-12, 2025  for an exciting exploration of emerging technologies. You can find more details on the event website   here. EARLY BIRD rates are available until December 20, 2025 – secure your spot now! Registe...

In this newsletter, explore the advancements in solar technology, featuring InterPhases Solar's pioneering in-line roll-to-roll processes for flexible, thin-film devices, Crystalsol OÜ's innovations in CZTS photovoltaic technology, Taiwan Perovskite Solar's approach to large-scale perovskite production, Pixel Voltaic's laser-assisted glass encapsulation for perovskite photovoltaics, and University of Colorado Boulder's strategies to tackle degradation in perovskite solar panels. InterPhases Solar | Versatile in-line roll-to-roll process for flexible, thin film devices Crystalsol OÜ | Printed CZTS photovoltaic technology Taiwan Perovskite Solar | Large-scale perovskite production: materials, processes, and challenges Pixel Voltaic | Laser-assisted glass encapsulation for perovskite photovoltaics University of Colorado Boulder | Understanding & preventing degradation in perovskite solar panels The Future of Electronics RESHAPED USA  is TechBlick's premier event, showcasing the latest innovations in electronics. Join us at UMass Boston on June 11-12, 2025  for an exciting exploration of emerging technologies. You can find more details on the event website   here. EARLY BIRD rates are available until December 20, 2025 – secure your spot now! Register here TechBlick.com InterPhases Solar  | Versatile in-line roll-to-roll process for flexible, thin film devices Shalini Menezes | 2024 Fabricating devices with non-vacuum roll-to-roll processes that intrinsically host nano-scale ...

In this newsletter, you’ll explore cutting-edge innovations in additive electronics manufacturing, bioprinting, and printed electronics. Gain insights from industry leaders and download the full presentation slides to dive deeper into these transformative technologies. ImageXpert | Inkjet & Dispensing for Printed Electronics: R&D to prototype and Pilot Production University of Montreal | Drop-on-demand laser-assisted bioprinting of cells & hydrogels Fraunhofer IAP | Inkjet printable stretchable electrodes for organic electronic applications NRCC | Material & Process development for additive manufacturing TNO at Holst | 3D Additive Lithography for Electronics The Future of Electronics RESHAPED Boston  is the flagship TechBlick event. This event will take place at the UMass Boston, USA on the 11-12 June 2025. Visit the event website  here. EARLY BIRD rates are available until December 20, 2025 – secure your spot now! Register here TechBlick.com ImageXpert | Inkjet & Dispensing for Printed Electronics: R&D to prototype and Pilot Production Paul Best  | 2023 In this presentation, ImageXpert will discuss new technologies in inkjet for evaluating and optimizing processes in R&D and production. These tools allow you to build a better understanding of your inkjet process, improve the performance, and accelerate the rate of development. We will explore the latest analysis tools, from new dropwatching technologies to smarter prototyping printers. In this presentation you will learn...

Author: Steve Paschky ( steve.paschky@saralon.com ) I recently read an insightful article on Nature about the challenges facing the scale-up of the Printed Electronics industry [1]. The article effectively highlights how disruptive technologies, like those in our industry, are reshaping the electronics landscape. While we often associate this sector with innovation, not every innovation is truly disruptive. Disruptive innovations fundamentally change industries, even society and lifestyle. PE innovations don’t just add value; they also revolutionize how electronics are produced, replacing traditional methods. As a materials supplier for PE industry, Saralon GmbH has started with engaging into emerging markets that didn’t exist before. Some of our best-selling Saral Inks© with high demands from these markets include SaralBattery Inks and Stretchable Saral Inks © among many others. However, as disruptive innovations evolve and mature, the key challenge becomes aligning them with mainstream markets. This is where the concept of product-market fit becomes critical. Saral Copper 200 is our latest generation of copper conductive ink designed with product-market fit in mind. While it has the potential to be used in conventional PCB manufacturing (thanks to its solderability), the primary market we are focusing on is smart labelling, smart packaging, and antenna technology at the core—specifically RFID and NFC tags and inlays. Before diving into the details of Saral Copper 200, I’...