Author: Dr. Lena Reinke | lena.reinke@panacol.de Perovskite-based (PSC) and organic photovoltaic (OPV) cells represent a promising frontier in renewable energy generation technologies due to their potential for lightweight, flexible and potentially cost-effective solar power generation. However one of the critical challenges in the commercialization and long-term reliability of OPV cells is their encapsulation. Effective encapsulation protects the delicate photoactive materials from environmental factors such as moisture, oxygen and mechanical stress. Adhesives play a crucial role in this encapsulation process, offering not only mechanical stability but also environmental protection. This article focuses on the various types of adhesives used in the encapsulation of OPV or PSC cells. We are exhibiting! Visit our booth at the flagship TechBlick event in Berlin on 23-24 October 2024. Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D. Encapsulation adhesives for OPV or PSC cells must meet several stringent criteria: Moisture and Oxygen Barrier: As the active materials are sensitive towards humidity and/or oxygen, the adhesive should therefore provide good barrier properties to prevent a degradation caused by moisture or oxygen ingress. The adhesive barrier properties can be tuned using to different strategies. One can either use quite hydrophobic raw materials to chemically prevent the ingress o...

In this newsletter, you can learn about the following technologies. We will have the opportunity to download the full slides. ISC Konstanz - Screen-printed Cu-pastes for highly efficient back-contact silicon solar cells Oxford Suzhou - Efficient and Stable Inverted Perovskite Solar Cell with modified Al as a Cathode OE Technologies - Roll2Roll High-Volume Manufacturing of OPVs Perovskia Solar AG - Perovskite solar cells for low-light applications   The Future of Electronics RESHAPED Europe is the flagship TechBlick event. This event will take place at the Estrel Hotel and Convention Center (ECC) in Berlin on 23-24 October 2024 . Explore the preliminary agenda here. 1. Screen-printed Cu-pastes for highly efficient back-contact silicon solar cells ISC Konstanz  |  March 2022 Screen printed Cu-pastes for high efficient back-contact silicon solar cells? In this slide deck you can learn about: ✅Accelerated growth of photovoltaics ✅Market growth of PVs and impact on silver consumption ✅Benefits of Copper vs Silver ✅Requirements for Cu based metallization ✅Properties of copper ink from Copprint ✅Back contact solar cells: ISC’s ZEBRA cell ✅Replacement of Bus Bars in ZEBRA ✅Line resistance Cu busbars ✅Results cell IV characteristic ✅Peel force results: soldering and ECA ✅Climate chamber tests ✅Thermal cycling results ✅Damp heat results ✅Conclusion and Outlook Download Presentation Slides 2. Efficient and Stable Inverted Perovskite Solar Cell with modified Al as a Cathode Oxford ...

Author: Mr Naveen Balla, info@hamamatsu.de The production of printed electronics represents a transformative approach to manufacturing electronic devices. Switching from complex technologies like etching or lithography to a printing process significantly simplifies production, offering a cost-effective, versatile, and straightforward pathway to fabricating electronic components on various substrates. As a result, printed electronics are used in a wide range of devices, including flexible displays, thin-film transistors, sensors, and photovoltaic cells. While already common in various industries, production equipment for printed electronics still has room for improvement to optimize manufacturing efficiency. One important aspect of this optimization, especially when using metal nanoparticle inks, is the sintering process. The sintering step includes fusing the metal nanoparticles in ink ensuring the required low resistivity of the finished circuits. For this task, heating ovens, NIR emitters, and broadband flash lamps are established technologies, but they suffer from drawbacks that limit the speed or efficiency of production. In this article, we present five aspects of printing equipment that can be improved by switching to laser sintering. Table 1: Comparison of different sintering methods We are exhibiting! Visit our booth at the flagship TechBlick event in Berlin on 23-24 October 2024. Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Fle...

In this newsletter, you can learn about the following technologies. We will have the opportunity to download the full slides. anthos iD | i-components | High Performance Barrier Solutions for Thin Film PV Applications Coatema | The pathway to digital fabrication of printed electronic products Crystalsol | Printed CZTS photovoltaic technology FOM Technologies | The role of slot-die coating in the
future of photovoltaics Verico Technology Holdings Inc | Verde | Speeding commercialization through early engagement with contract manufacturers   The Future of Electronics RESHAPED Europe is the flagship TechBlick event. This event will take place at the Estrel Hotel and Convention Center (ECC) in Berlin on 23-24 October 2024 . Explore the preliminary agenda here. 1. i-components | High-Performance Barrier Solutions for Thin Film PV Applications anthos iD |  DEC 2022 In this slide you can learn about high performance barrier solutions for thin film PV: ✅CIGS module structure and the appropriate barrier sheet/foil ✅Module certification with Full Test Sequence - IEC 61215 ✅Module quality tests ✅Module certification results (Damp Heat, thermal cycling & humidity freeze tests) ✅Insulation & wet leakage current tests Download Presentation Slides 2. The pathway to digital fabrication of printed electronic products Coatema |  JUNE 2022 In this slide deck you can learn about upscaling OPV production with slot die coating ✅Overview of the different solar cell types ✅Production chain...

TechBlick The Future of Electronics RESHAPED - Why You Should Join Us We have prepared a world-class agenda for you, featuring over 70 superb invited talks from around the world, 12 industry- or expert-led masterclasses, 4 tours, and over 80 onsite exhibitors. In this article series, we highlight various talks in the program, outlining the technologies and applications that will be showcased. In this article, we discuss the theme of volume manufacturing with printed electronics highlighting talks, masterclasses and tours from the likes of Flexoo, Avery Dennison Smartrac, SPGPrints, db-Matik, Beckermus Technologies, Printed Electronics Limited, Voltera, Tracxon, ImageXpert, Fraunhofer IZM, Quantica, Inuru, ScreenTec, etc In a previous article, we have already highlighted some of the talks focused on wearable, bio, and/or medical sensors as well as on digital and 3D additive electronics. In future articles, we will highlight more contributions on this theme as well as other key themes such as sustainable electronics, materials innovations, additive and 3D electronics, wearables and electronic textiles, medical electronics, photovoltaics, packaging, novel materials, lighting applications, etc. Stay tuned! Flexoo will outline their ability to offer mass customization as well as mass production with a specific focus on smart sensors and labels. Flexoo - a spin-off from InnovationLab GmbH with the direct acquisition of Heidelberg Printed Electronics GmbH - has created unique cap...

Why You Should Join TechBlick's The Future of Electronics RESHAPED? We have prepared a world-class agenda for you, featuring over 70 superb invited talks from around the world, 12 industry- or expert-led masterclasses, 4 tours, and over 80 onsite exhibitors. In this article series, we highlight various talks in the program, outlining the technologies and applications that will be showcased in the program. In this article, we discuss the theme of Smart Surfaces and Sensors  including  the automotive and human-machine interface sections. highlighting talks, masterclasses, and tours from the likes of Forvia, Momentive and BSC Computer, Motherson Innovations, Global Access Diagnostics (GADx), Datwyler, Würth Elektronik Group, Metafas, Holst Centre, and Arkema and KEMET. In a previous article, we already highlighted talks focused on wearable, bio, and/or medical sensors.   In future articles, we will highlight more contributions on this theme as well as other key themes such as sustainable electronics, materials innovations, additive and 3D electronics, wearables and electronic textiles, medical electronics, photovoltaics, packaging, novel materials, lighting applications, etc. Stay tuned! Forvia  - a global automotive supplier - will join us to give an invited keynote talk, outlining their strategy for automotive interiors using printed electronics including smart surfaces. The presentation will cover the specific use cases under development, and will zoom in on specific applica...

25 & 26 Sept 2024 | High Tech Campus, Eindhoven, Netherlands Introducing the Program - MicroLED and AR/VR Market Forecasts, Technology Roadmap, Value Chain Analysis, and Strategies MicroLED Connect is the world's first dedicated MicroLED conference and exhibition. We have put together a fantastic world-class program of talks, masterclass, exhibitors, and company tours, featuring the likes of Google, Meta, TCL CSOT, Continental, GlobalFoundries, Konica Minolta, Toray Engineering, Coherent, Applied Materials, Aixtron, and many others.
In this article series, we highlight various talks in the program, outlining the technologies and applications that will be showcased in the program. Here, we discuss the theme of MicroLED and AR/VR Market Forecasts, Technology Roadmap, Value Chain Analysis, and Strategies , highlighting talks, masterclasses, and tours from the likes of Yole, Omdia, Hendy Consulting, and UBI Research. The microLED industry is backed by the largest companies in the display industry, and has the support of the world's consumer electronics industry. But the technology is still at an early stage, and the road to success is not yet clear. MicroLED-Connect will present a great opportunity to understand the current status of the industry, learn the different roadmaps, understand the key application areas and what the near- and far-future holds for microLEDs. Yole Intelligence: They will present a talk on MicroLED Status and Roadmap, outlining the market, the value cha...

Why Join TechBlick's Future of Electronics RESHAPED? We have prepared a world-class agenda for you, featuring over 70 superb invited talks from around the world, 12 industry- or expert-led masterclasses, 4 tours, and over 80 onsite exhibitors. In this article series, we highlight various talks in the program, outlining the technologies and applications that will be showcased in the program. In this article, we discuss the theme of wearables, e-textiles, and printed medical sensors , highlighting contributions from the likes of Meta, Air Force Research Laboratory, X-Trodes, Creative Materials, PolyPhotonix, Light Tree Venture Group, Nagase ChemteX, Texavie, Danish Technological Institute, Sun Chemical, Nanoleq, Profactor, ScreenTec, and Elitac Wearables. In follow-up articles, we highlight many more contributions on this theme as well as other key themes such as sustainable electronics, materials innovations, smart surfaces, additive and 3D electronics, medical electronics, photovoltaics, packaging, novel materials, lighting applications, etc. Stay tuned! Wearable Sensors Meta wil join us from the US to present, offering an overview of the current state of non-invasive biopotential sensors for future wearable electronics including EEG, ECG, and EMG. Non-invasive biopotential wearable sensors offer many clear benefits over conventional approaches, hence the growing market interest. Furthermore, Meta will highlight the challenges as well as promising future prospects for thes...