TechBlick The Future of Electronics RESHAPED - Why You Should Join Us We have prepared a world-class agenda for you, featuring over 70 superb invited talks from around the world, 12 industry- or expert-led masterclasses, 4 tours, and over 80 onsite exhibitors. In this article, we discuss two themes of (1) Green and Sustainable Electronics and (2) Printing in Photovoltaics and Fuel Cells, highlighting talks, masterclasses and tours from the likes of Essemtec, imec, Holst Centre, Jiva Materials, RISE, VTT, ISC Konstanz, Fraunhofer ISE, Coatema, FOM Technologies, Panacol, etc #GreenElectronics #CircularElectronics #AdditiveElectronics #BioBasedElectronicMaterials #FineLineMetallization #FuelCells #LIFT #PerovskiteSiTandemCells #CopperMetallization #SlotDieCoating #Repair #Jetting #FR4Alternative In future articles, we will highlight more contributions on this theme as well as other key themes such as materials innovations, additive and 3D electronics, wearables and electronic textiles, volume manufacturing, etc. Stay tuned!
Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Sustainable, green, and circular economy The first theme to be discussed is sustainable, green, and circular economy . This is a crucial driver for the additive electronics industry since additive processes can reduce material and energy consumption and enhance circularity vs. subtractive processes. Essemtec will outline how their automatic repair tools with no human interaction en...

ATLANT 3D’s Direct Atomic Layer Processing (DALP®) is set to transform the semiconductor landscape with its groundbreaking direct-write technology based on ALD. This cutting-edge process enables swift transition from conceptualization to prototype, reducing the time from idea to physical realization to mere hours. It simplifies exploring new materials and structures for semiconductor devices to just a week, opening doors to multi-functional devices previously deemed unattainable. With DALP®, you gain access to a wide range of designs, including various 2D shapes, multidirectional thickness gradients, and complex overlapping patterns. The flexibility extends to the materials, DALP opens the ability to utilize standard ALD materials and create tailored multilayers to prototype novel semiconductor devices. To showcase DALP® capability, we’ve fabricated a sample wafer using TiO2 on a 4-inch Si/SiO2 substrate, with a maximum deposited thickness of 30 nm. The vibrant and distinct color variations stem different thicknesses of the TiO2 layer and showcase thickness steps of 0.3 nm separated by 1 micron. Traditional methods in the industry require extensive time and effort for such variations, often involving multiple masks or complicated process. Novel processing methods such as inkjet lack the vertical resolution to provide filled patterns with this level of control. DALP® streamlines this process. From the initial design concept to the start of processing, it takes just 2 hours. T...

Visit The Latest Industry and Research Highlights On 22 October 2024, the day before the Future of Electronics RESHAPED conference and exhibition opens its doors, you can participate in a day of industry- and expert-led masterclasses and tours. See the program below. In addition to the tours and masterclasses you will have access to ✅ 75 invited onsite conference talks ✅ 83 onsite exhibitors ✅ 12 expert-led masterclasses ✅  4 tours ✅ Annual online access to TechBlick platform Library of content featuring over 1500 talks (PDF and video) from all past online as well as onsite events around the world Access to all future online events within access period Access to on-demand version of all talks and masterclasses at upcoming onsite events including MicroLED Connect (Eindhoven, Sept 2024) and Future of Electronics RESHAPED (Boston, June 2025) Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Tour Themes After the masterclasses, you’ll have the option to participate in one of the following themed tours: Fraunhofer IZM Fraunhofer IZM’s focus is on packaging technology and the integration of multifunctional electronics into systems. Fraunhofer IZM was founded in 1993 and is today one of the global leaders in microelectronics and microsystems packaging The guided tour at Fraunhofer IZM is organized by three working groups:  System on Flex  This group is working on advancing flexible hybrid electronics, stretchable electronics, and electronic textiles. During ...

Ayer, MA September 2024 - Creative Materials Inc., an innovator of materials for the electronics industry, is pleased to announce the launch of two new high performance ink products: 125-10ADP Economical Conductive Ink and 130-05GL High Dielectric Strength Ink. These advanced inks represent a significant advancement in the realm of electronic manufacturing providing enhanced performance, reduced costs, and greater reliability. 125-10ADP Economical Conductive Ink The 125-10ADP Economical Conductive Ink is designed to meet the growing demand for cost-effective solutions without compromising performance. This ink is user friendly, offers high mechanical strength, electrical conductivity and excellent adhesion to a variety surfaces, making it ideal for use in a variety of applications including membrane switches, flexible electronics, printed circuit boards (PCBs), and sensors. Key features of the 125-10ADP ink include: Reliability: Delivers consistent electrical performance with low resistivity. Cost-Effectiveness: Provides a high-quality solution at a competitive price, enabling cost savings for manufacturers. Versatility: Suitable for use on a wide range of substrates, including treated and untreated polyester, urethanes and polyimide. 130-05GL High Dielectric Strength Ink In parallel, the 130-05GL High Dielectric Strength Ink addresses the critical need for materials with outstanding insulation properties. This novel ink is engineered to provide high dielectric strength...

Author: Dennis Kuppens – Product Manager at SUSS Microtec Netherlands b.v. At SUSS MicroTec, our vision is to lead the way in enabling innovative semiconductor advanced backend and photomask solutions. In this article, we will explore how this vision extends beyond our own innovations to enable third-party innovation through SUSS PiXDRO inkjet technology. For years, the SUSS LP50 R&D Inkjet printer, featuring PiXDRO technology, has set the standard for researchers and engineers in developing and validating inkjet inks and processes, from R&D to high-volume production, across universities, research institutes, high-tech startups, and multinational companies. Whether you start in an ink development phase, a prototype development phase or a pilot-production phase, the LP50 printer can be configured and even field-upgraded to suit your current and future development needs. The 500+ research papers which are published on Google Scholar are a firm testimony to this. These articles highlight a wide variety of innovative applications where inkjet technology is being used for functional devices. All the papers have been submitted by users of SUSS LP50 printers, with more than 400 printers installed and used daily by researchers worldwide. Below are three abstracts of the most recent publications that can be found on Google Scholar. Development of a Screening Platform for Optimizing Chemical Nanosensor Materials (Published: Aug 24, 2024) https://www.mdpi.com/1424-8220/24/17/5565 Inkjet...

On 22 October 2024, the day before the Future of Electronics RESHAPED conference and exhibition opens its doors, you can participate in a day of industry- and expert-led masterclasses. These sessions offer a unique blend of technology, application, and practical insights, providing a valuable opportunity to learn the latest advancements, acquire new skills, or refresh your existing knowledge. Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Masterclass Themes Material Innovations, Developments, and Application Advances Polymer Thick Films : This topic has always been, and will remain, fundamentally important to the entire printed electronics industry. The instructor for this class is Saeed Madadi from Celanese. Liquid Metals : One of the most exciting emerging materials in printed, soft, and stretchable electronics, liquid metals offer amazing properties. This class will be instructed by leading researcher Mahmoud Tavakoli from the University of Coimbra . Electroactive Polymers : This is an important class for anyone interested in haptics, actuators, and sensors based on piezoelectric technology. The class will be jointly instructed by Fabrice Domingues Dos Santos from Arkema and Valerio Zerillo from Kemet. Wearables and E-Textiles Manufacturing Wearable Sensors:  In this class, you will learn about wearable sensors and their typical applications. Additionally, you'll gain insights into the technical requirements and materials commonly used in print...

TechBlick The Future of Electronics RESHAPED - Why You Should Join Us. 23 & 24 October 2024 | Berlin, Germany TechBlick have prepared a world-class agenda for you, featuring over 70 superb invited talks, 12 industry- or expert-led masterclasses, 4 tours, and over 80 onsite exhibitors. You can explore the full program here . In this article series, we highlight various talks in the program, outlining the technologies and applications that will be showcased.  In this article, we discuss the theme of   Additive and 3D Electronics, highlighting talks, masterclasses and tours from the likes of Airbus, Semikron Danfoss, Ceradrop, NeoTech AMT GmbH, Hasselt University, Karlsruhe Institute of Technology, Hahn-Schickard Institute, PERC, Binghamton University, University of Texas El Paso, Tecnalia. Note that this is the second article on the theme of Additive and 3D Electronics . In the previous article, we highlighted contributions from the European Space Agency, Yole Group, Decathlon, LPKF Laser & Electronics, Exxelia Micropen, Fuji Corp, Elephant, Nano OPS, Notion Systems, and Henkel and Tecna-Print, Printed Electronics Ltd, ImageXpert, Quantica. Explore and Register Before 11 October When The FINAL Early Bird Rate Ends Airbus  will share their findings on the durability of 3D printed and hybrid electronics under aeronautic conditions. The motivation here is the direct integration of electronics on composite structures. In this case, flexible hybrid electronics embedded in TPU foils ...

Author: Thibaut Soulestin, PhD; Senior Application Engineer, Henkel Adhesive Technologies - Printed Electronics;  thibaut.soulestin@henkel.com Henkel Adhesive Technologies holds leading market positions worldwide in the industrial and consumer business. As a global leader in the adhesives, sealants, and functional coatings markets, Henkel has developed a large material portfolio of LOCTITE® conductive inks and coatings suitable for printing electronic circuitry, that is thin, lightweight and flexible. The LOCTITE® Printed Electronics portfolio offers more than 100 different material solutions of which more than 20 are silver inks. Driven by the megatrend of digitalization, printed electronics offer a complementary solution to traditional electronic circuitry, opening new opportunities for electronics integration and miniaturization across industries. To achieve surface integrability, with limited visibility to the human eye, the printing of fine line structures has become increasingly important. To achieve high-performing fine line printed circuitry, it requires conductive inks having fine silver particles and adapted viscosity e.g. LOCTITE® ECI 1006. We are exhibiting! Visit our booth at the flagship TechBlick event in Berlin on 23-24 October 2024.   Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D.    1. LOCTITE® ECI 1006 Among the large range of Henkel silver inks, LOCTITE® ECI 1006 is speci...