3 April 2025
Material Innovations: QD color conversion, copper inks for printed electronics, indium solder bumps for microLEDs, battery Safety in Na batteries, and more
Fraunhofer IAP | Quantum Dot Color Conversion in MicroLED – A Material Perspective - Quantum Dot (QD) materials for color conversion in MicroLED displays. Key topics include high quantum efficiency QDs, tailored ink formulations, and EHD-Jet printing techniques for high-resolution applications. The session explores QD stability, ligand optimization, and methods to close the green and red gap in MicroLED displays. Saralon GmbH | Conducting Copper Ink for Printed Electronics: An Application-Based Journey - Saral Copper Ink as an alternative to costly silver-based inks for printed electronics. The session covers copper ink’s stable conductivity, processability via conventional screen printing, and its application in low-cost, high-demand sectors. It highlights challenges and benefits for future electronics manufacturing. INTLVAC THIN FILM | ICARUS: Indium Solder Bump Deposition System- Focusing on improving indium solder bump deposition, addressing pattern hole closure, dendritic growth prevention, and enhancing bump quality. Insights on system stability and reliability for semiconductor assembly and MEMS packaging will also be discussed. Flexoo | Excellence in European Manufacturing: Focus on Contract Manufacturing and R&D Services- Exploring mass-customization in high-end sensing solutions. Topics include the production of BaMoS and MiniMoS sensors, battery behavior analysis at the cell level, advanced wiring solutions, and the role of digitalized processes in manufacturing ef...
27 March 2025
Wearable Neurotechnology, Printed Dielectrics, OTFTs, Jetting Electronics, R2R OPV for Energy Harvesting
Wearable neurotechnology, printed electronics, OTFT displays, and light energy harvesting. Researchers at Stanford University are developing innovative neurosensing and neuromodulation technologies, including fNIRS headbands for monitoring mental states, ultrasound neuro-immunomodulation for treating Parkinson’s disease and stroke, and e-Skin EMG sensors for improved prosthetic control and gait correction. ChemCubed is advancing inkjet printing for multilayer electronics, using ElectroJet™ nanoparticle-free silver conductive ink and high-performance dielectric materials to create advanced circuit boards for capacitors, sensors, and antennas. SmartKem is scaling up its low-temperature OTFT technology for AMOLED and MicroLED displays, leveraging TruFlex™ organic materials that enable flexible, solution-based electronics with low-NRE processing and ULEF integration for ultra-low energy consumption. Epishine is eliminating the need for disposable batteries in connected sensors by harnessing ambient light energy, creating self-charging battery technology that extends device lifespan and reduces environmental impact. Essemtec is optimizing conductive adhesive dispensing for printed electronics manufacturing, improving reliability and efficiency through rheology optimization and jetting technology. Stanford University | Looking ahead – Research topics in wearable neurotechnology innovations from Stanford University ChemCubed | Printing Dielectric Layers in Multilayer/Multimaterial...
21 March 2025
Time To Explore The World of Additive, Sustainable, Hybrid, Wearable, and 3D Electronics!
Join the the Future of Electronics RESHAPED USA conference and exhibition in Boston (11 & 12 June) - Where the global Additive and 3D Electronics industry connects. No other event in the world offers a deeper, more immersive experience in Additive, Sustainable, Hybrid, and 3D Electronics than TechBlick's Electronics RESHAPED event. Don't miss this opportunity to connect, learn, and RESHAPE the Future of Electronics, making it Additive, Sustainable, Hybrid, Wearable or 3D. Explore & RESHAPE The Future of Electronics NOW Register before 9 May before the next early bird expires Conference Agenda You can explore the full agenda here Rochester Institute of Technology | On-Demand Jetting of Molten Metal Droplets for Power Electronics Applications 09:15:00, 2025-06-11 Denis Cormier, United States Spark Biomedical | Wearable flexible circuit for Women's health 09:15:00, 2025-06-11 Alejandro Covalin United States University of Maryland | High temperature Copper inks with oxidation and corrosion resistance 09:15:00, 2025-06-11 Shenqiang Ren, United States Human Systems Integration, Inc. | Physiological Monitoring Garment for Air Crew Applications* 09:35:00, 2025-06-11 Brian Farrell, United States NASA (Goddard Space Flight Center) | 3D Printed Electronics for space flight missions 09:35:00, 2025-06-11 Margaret H Samuels, United States Priways | Air-stable cupper-nickel complex inks for Printed Electronics 09:35:00, 2025-06-11 Dr. Takeo Minari, Japan Boeing Research & Technolog...
12 March 2025
Voltera: Printing Silver Conductive Ink on Cotton Fabric
Printing on fabric is a popular method for creating wearable electronics, with one key application being heated gloves and mittens that use heating elements to keep hands warm. Commonly used in outdoor activities like skiing, they also have medical uses, such as improving blood circulation. <embed YouTube video: Printing Silver Ink on Cotton > Contact: sales@voltera.io or +1 888-381-3332 ext: 1 Summary of Materials and Tools MATERIALS USED ● ACI SH5025 Printed Fixed Resistance Heater Ink SUBSTRATES USED ● Cotton fabric TOOLS AND ACCESSORIES ● NOVA materials dispensing system ● Heat press machine ● Voltera branded mitten ● Fleece liner ● Kapton tape ● Metal snaps ● FLIR TG165 thermal camera We are Exhibiting! Visit our booth at the TechBlick event on 11-12 June 2025 in Boston Project Overview Purpose The purpose of this project was to create a heated mitten utilizing silver conductive ink printed directly onto cotton fabric, as well as validate optimal print settings for working with cotton fabric as a substrate. Design We designed a heating element pattern made up of meander lines that resemble a hand with a trace width of 5 mm. We left an opening near the wrist for inserting metal snaps that connect the printed circuit to the power source. We planned to print on both sides of the fabric to allow the ink to penetrate the fibers evenly. Figure 1: The heat element circuit Desired outcome The goal was to create a functi...
31 March 2025
Additive Printed Electronics Advances: 3D Additive Lithography, R2R Pilot Line, Micro-Dispensing, Gravure Printed Micro-Bumps, Ultra Fineline Metallisation, Anisotropic Conductive Adhesives
In this newsletter you can learn about the latest advances in Additive, Sustainable, Hybrid and 3D Electronics! via the following highlighted short videos, each being less than 2min, saving you learning time. These are all key points and advances in the field, advancing the art and cutting-edge. R2R pilot hybrid electric manufacturing line for wearable sensors? | VTT What are the real applications of ACFs (anisotropic conductive films)? | CondAlign How is micro-dispensing positioned and how fast can it print? | XTPL How to print silver lines finer than human hair on Si photovoltaics | Fraunhofer ISE How does the 3D additive lithography for additive electronic work? | Holst Centre Why is there a need for direct gravure printing of manufacturing solder bumps? | Komori The Future of Electronics RESHAPED USA Conference and Exhibition #AdditiveElectronics #3DElectronics #PrintedElectronics #WearableElectronics #FlexibleHybridElectronics #WearableElectronics #SustainableElectronics #ElectronicTextiles 🗓️ 11 & 12 June 2025 📍 Boston, USA 🔗 Agenda & Registration: https://www.techblick.com/electronicsreshapedusa 🎤 70+ World-Class Speakers 🏢 75+ Global Exhibitors 👥 550+ Participants from Around the World 🛑🛑 In addition to the early bird rates, there is a special one-time promotion offering an additional 200 USD discount. Get your coupon here . The early bird rates expire on 25 April 2025. 🛑🛑 R2R pilot hybrid electric manufacturing line for wearable sen...
25 March 2025
Introducing the Program: Process Innovations | Molten metal jetting, R2R LIFT printing, microscale laser sintering for 3D interconnects, DLP for complex interposes, direct write ALD, stable AJP
TechBlick's The Future of Electronics RESHAPED USA - Why You Should Join Us? The Future of Electronics RESHAPED USA is less than three months away. It features a world-class agenda with over 70 presentations covering exciting material breakthroughs, process innovations, manufacturing advances, application developments, and product launches. See the program here. In this article series, we highlight various talks in the program, outlining the technologies and applications that will be showcased. In this particular article, we focus on process innovation, highlighting a diverse set of technologies, including multi-head molten metal jetting, R2R LIFT printing, microscale laser sintering for 3D metal interconnect, DLP for complex interposes, direct write spatial atomic layer deposition, and stable aerosol jetting. In subsequent articles, we will focus on wearable and printed electronics, 3D electronics, sustainable electronics, material breakthroughs, manufacturing advances, novel applications, process innovations, and more.
It is time to join the global Additive, Printed and 3D Electronics movement: The Future of Electronics RESHAPED USA
🗓️ 11 & 12 June 2025 📍 Boston, USA 🔗 Agenda & Registration 🎤 70+ World-Class Speakers 🏢 75+ Global Exhibitors 👥 550+ Participants from Around the World The early bird rates expire on 25 April 2025 .
In addition to the early bird rates, a special one-time promotion offers an
additional 200 USD discount.
Do NOT forget to bo...
21 March 2025
Additive and 3D Electronics: LIFT for high viscosity, gravure printing, micro-bump Printing, Cu in Si TOPcon PV, inkjet on 8.5-Gen glass, high viscosity IJP, laser additive process for RDLs, etc
In this newsletter you can learn about the latest advances in Additive, Sustainable, Hybrid and 3D Electronics! via the following highlighted short videos, each being less than 2min, saving you learning time. These are all key points and advances in the field, advancing the art and cutting-edge. LIFT: R2R Digital Printing of High Viscosity Materials | Coatema How does Gravure Printing work in Printed Electronics? | Komori How to print micro bumps in a single step for semiconductor electronic packaging? | Hummink Can copper paste be used in Si TOPCon solar cell metal lisation to reduce silver consumption per cell and per watt ? | ISC Konstanz and Copprint How an actual inkjet printer prints functional and optoelectrical materials on a HUGE 8.5-Gen (2200 x 2500 mm2) display glass? | Kateeva Can we inkjet print screen printable and high viscosity pastes? | Quantica Laser-based additive electronics to simplify the RDL metallization process | Akoneer Time To Explore The World of Additive, Sustainable, Hybrid and 3D Electronics! Join the Electronics RESHAPED USA conference and exhibition in Boston (11 & 12 June) - Where the global Additive and 3D Electronics industry connects. Explore & RESHAPE The Future of Electronics NOW R2R Digital Printing of High Viscosity Materials? This is where inkjet struggled due to requirement for low viscosity inks and also nozzle clogging. LIFT can be a solution enabling R2R digital printing of materials with a range of viscosity levels, f...
28 February 2025
Battery Technology: Solid-State Batteries & Sustainable Manufacturing
In this edition, featuring the Solid-State Batteries and Battery Materials Virtual Event in February 2025, we explore battery manufacturing and energy storage. Experts from Sakuu discuss how dry electrode printing and additive manufacturing are revolutionizing solid-state battery production, significantly reducing energy consumption and eliminating toxic materials. Fraunhofer IFAM presents sustainable screen-printing technology for lithium-ion electrodes, enhancing efficiency and scalability while minimizing solvent use. Sandia National Laboratories provides a multi-scale safety evaluation of sodium-ion batteries, analyzing thermal stability, degradation, and fire risk mitigation. P3 Automotive GmbH examines next-generation battery strategies for 2027+, including Cell-to-Pack (CTP) and Cell-to-Chassis (CTC) integration, sodium-ion alternatives, and diversified battery portfolios for automotive and energy storage applications. Lastly, Orion Carbons highlights the critical role of engineered carbon black in enhancing lithium-ion and solid-state battery performance. Sakuu | Reinventing manufacturing for better batteries Fraunhofer IFAM | Printing technology as green alternative for thick layer Li Ion Battery electrode production Sandia National Laboratories | Multi-Scale Safety Evaluation of Commercial Sodium-ion Cells and Materials P3 automotive GmbH | Next-gen battery strategies 2027+ | Potentials and challenges for future battery designs and diversification in product port...