This newsletter provides an overview of printed, flexible, and hybrid electronics, addressing critical challenges in commercialization, material performance, and process scalability. Discussions on In-Mold Electronics (IME) highlight the current status of screen printing technologies, substrate material limitations, and ink formulation challenges. Insights into highly bendable oxide TFTs demonstrate significant progress in mechanical durability, stress simulation, and wearable sensor integration. Further, the exploration of reliability frameworks for scalable FHE manufacturing emphasizes the importance of data-driven optimization and failure mode analysis. The latest developments in conductive adhesives also present a step-change in component bonding for FHE applications, introducing room-temperature processing solutions that improve efficiency and reduce material constraints. By bridging research, industry expertise, and application-driven insights, these discussions contribute to the ongoing evolution of next-generation electronics manufacturing. InMold Electronics (IME) Panel | State-of-the-Art Talks| Advancing Screen Printing Across Industries Clayens NP  | Plastronics - A Short Introduction Toppan  | Highly bendable oxide TFT withstanding over one million bending cycles Bayflex Solutions  | Accelerating FHE at scale with commercial grade reliability data frameworks CondAlign  | Enabling Room Temperature Electronics Bonding In FHE Applications, Addressing Sustainability a...

This newsletter points out the interesting improvements in solar power technology. Dr. Stéphane Cros of CEA presented improvements from the Apolo European project and these improvements included record module efficiencies near 19% and understandings into laser scribing, deposition uniformity and encapsulation issues. Dr. Emma Spooner, at the University of Manchester, intensely studies scalable semi-transparent organic photovoltaics (STOPVs) for windows and building-integrated PV. She collaborates with Contra Vision to develop remarkably revolutionary OPV stacks. Lena Reinke of Panacol presents several highly effective adhesive solutions and these solutions considerably improve the durability and electrical reliability of a large number of flexible solar modules. Francesca Scuratti of Ribes Tech uses advanced roll-to-roll (R2R) additive manufacturing and organic photovoltaics to overcome several IoT2 challenges and enable energy independence. Aldo Kingma of Solliance presented meaningful progress. This progress involved developing a pilot line for several cost-effective and flexible PV laminates, easing their smooth integration into buildings and infrastructure. CEA | Apolo story for the manufacturing of record modules (11 cm2) close to 19% efficiency University of Manchester | Scalable Semi-transparent Organic Photovoltaics Panacol | Adhesive Solutions for Perovskite-based and Organic Photovoltaic Applications Ribes Tech  | Fully printed additive manufacturing for indoor pho...

Additive electronics and future of spacecrafts and deployed structured? Watch this video of the talk from Anthony DeCicco  how printed sensors are crucial, saving technician time/effort, and how ink technology is becoming reliable and high quality enough for these long lifetime (15+++ year) applications..... Join us at TechBlick USA show on 11&12 June to learn how additive electronics will enable in-space manufacturing. Explore the program here https://lnkd.in/gQKjBZzn 🌌 Monitoring Deployed Space Structures Monitoring the performance of large, deployed space structures over time is a significant challenge, requiring numerous strain sensors across the structure. Solution:  Printing sensors directly onto structures could drastically reduce technician time and streamline production. 🖋️ Advancements in Ink Technology Tremendous progress in ink technology and reliability, thanks to efforts by academia and industry consortiums like NextFlex. Focus is shifting toward print quality  and long-term reliability  for advanced applications. 🚀 Durability for Space Missions Spacecraft components must endure lifetimes of 15+ years, with some geosatellites already surpassing 25 years. Degradation impacts performance, thermal management, and spacecraft operations—making reliability critical. ⚡ Approaching Bulk Conductivity Recent advancements in reactive ink printing have achieved ~85% bulk conductivity, marking a significant step forward. The next challenge: Understanding the effects of lo...

Thomas Tombs  at  Energy Materials Corporation  explained why at  TechBlick 's Future of Electronics RESHAPED show in Boston last here, outlining that the demand will be 75 terawatts of need by the year 2025! Join us on 11 and 12 June again in Boston to RESHAPEE the FUTURE of ELECTRONCIS making it additive, printed R2R, flexible etc. Explore the program --> https://lnkd.in/gQKjBZzn   Stephan DeLuca #Perovskites   #PrintedElectronics   #R2R   #Additive #TechBlick   #ElectronicsRESHAPED...

Contact: sales@voltera.io  or +1 888-381-3332 ext: 1 Radio Frequency Identification (RFID) is a technology that leverages wireless communication over radio waves to transfer data and locate objects. It is widely used in inventory management, asset tracking, access control, smart packaging, and increasingly, agriculture and crop management.   Summary of Materials and Tools MATERIALS USED Copprint LF-301 copper ink T5 Solder Paste Sn42Bi57.6Ag0.4   SUBSTRATES USED Cardstock paper (0.26 mm)   TOOLS AND ACCESSORIES Nordson EFD 7018395 dispensing tip LXMS21ACMD-220 RFID transceiver Heat press machine   Project Overview Purpose The purpose of this project was to demonstrate how we used the Voltera NOVA  materials dispensing system to create an ultra-high frequency (UHF) RFID tag using nano copper ink on a paper substrate. Design We designed a meander half-dipole antenna with an opening at the center to place and solder a transceiver, which controls the antenna and responds to incoming RFID signals.  The length of the meander trace was adjusted to ensure we could easily fine-tune the antenna and achieve the best performance. RFID tag layout Desired outcome Our hypothesis was that we could develop an omnidirectional RFID tag that would be readable from a long range (6 meters) and from all orientations relative to the reader.   Functionality The meander half-dipole antenna design was selected due to its ability to increase the trace length of the antenna without significantly increasi...

Abstract  – The increasing demand for technologies such as infrared (IR) thermal imaging sensors, quantum processors, and micro-LED displays drives the need for advanced interconnect solutions. These technologies require fine-pitch Indium Bump Interconnects (IBI) for high-density flip-chip bonding. Larger chip sizes, sub-micron alignment, and extreme environmental conditions pose significant challenges. This paper highlights solutions addressing these challenges, enabling high-quality bonding for IR thermal sensors and other applications. I. Introduction Indium Bump Interconnect (IBI) is crucial for applications like IR thermal sensors, quantum processors, X-ray detectors, and micro-LED displays. Among these, IR sensors represent a demanding use case, requiring precise bonding of fine-pitch micro Indium bumps to substrates. Challenges include maintaining co-planarity, preventing contamination, and ensuring mechanical and electrical reliability. II. Indium Bump Interconnect Flip Chip Die Bonding Die bonding process Bonding methods range from cold compression to thermal compression and formic acid reflow, depending on application requirements. Achieving high yield during trials and production is critical due to the high cost and complexity of materials. Material preparation and handling Indium bumps are vacuum-deposited and protected with photoresist. Cleaning and kitting processes minimize contamination and handling risks, reducing preparation time and ensuring material integr...

阿部誠之  from  Asahi Kasei  explains how their R2R printed ultrafine transparent RFID will be part of a total system including blockchain to enable brand owners to achieve full supply chain management  Join us in Boston on 11 and 12 June to learn what more about applications of additive and printed electronics across all sectors. Explore the upcoming program now  https://www.techblick.com/electronicsreshapedusa...

This edition dives into the cutting-edge innovations shaping the future of flexible circuits, e-textiles, and wearable electronics. Discover how industry leaders are leveraging technologies like SSAIL, embroidery, graphene fibers, and advanced inks to redefine scalability, durability, and performance across applications. From health monitoring wearables to thermal-regulating textiles, we highlight breakthrough solutions driving adoption in industries such as healthcare, aged care, and fitness. Key topics include SSAIL’s rapid circuit development, Celanese’s stretchable inks, Kyorene® fibers' antibacterial benefits, and embroidery’s automated precision in creating functional textiles. Stay informed on the challenges, advancements, and real-world applications of these transformative technologies. Akoneer | Using SSAIL technology for fast development of flexible circuits RMIT University | Stretchable and flexible electronics reshaped for industry-driven aged-care technologies Celanese | Time to Think Beyond Stretch in Wearable Electronics Graphene One | Graphene based functional fibers for clothing and textiles 3E Smart Solutions | Driving Reliability and Scalability in E-Textiles and Wearables via Embroidery Technology The Future of Electronics RESHAPED USA  is TechBlick's premier event, showcasing the latest innovations in electronics. Join us at UMass Boston on June 11-12, 2025  for an exciting exploration of emerging technologies. You can find more details on the event ...